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BM23SPKS1NB9-0001AA

Microchip Technology

BM23SPKS1NB9-0001AA by Microchip Technology

BM23SPKS1NB9-0001AA by Microchip is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 43 terminals. It operates b/w -20 to 70 °C and has a seated height of 1.9 mm. This TELECOM CIRCUIT IC has a supply voltage of 3.7 V, making it ideal for telecom interface applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,724 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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VNN

France . 45 parts In-Stock

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Corohmni

South Africa . 723 parts In-Stock

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$6.597

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723

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AZTECH Wire

Italy . 331 parts In-Stock

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$15.483

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$18.402

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$16.746

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$15.090

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$18.402

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Ampacity Inc.

Singapore . 965 parts In-Stock

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$930.000

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Lixinc

USA . 17,567 parts In-Stock

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Argo Parts USA

USA . 4,871 parts In-Stock

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Continental Prestige Electronics

USA . 4,259 parts In-Stock

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Kepictronics

USA . 2,864 parts In-Stock

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RGB Technical Solutions

Ukraine . 739 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your telecom interface systems with the BM23SPKS1NB9-0001AA by Microchip Technology. Known for their top-quality products, Microchip Technology delivers exceptional results in the Other Function Telecom Interface ICs category. With a sleek rectangular design and 43 terminals, this surface mount IC offers reliability and versatility. From commercial to industrial applications, this telecom circuit IC provides a nominal supply voltage of 3.7V and operates in temperatures ranging from -20°C to 70°C. Upgrade your telecom systems today with the BM23SPKS1NB9-0001AA and experience the superior performance and value it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology ensures easy and efficient PCB assembly, making the product suitable for mass production and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB layouts and allows for efficient space utilization on the board.

No. of Terminals: 43

The high number of terminals allows for versatile connection options and supports complex telecom interface requirements.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions.

Width: 15 mm

Compact width dimension saves space on the PCB and enables integration into space-constrained designs.

Nominal Supply Voltage: 3.7 V

Optimal nominal supply voltage range supports efficient power management and ensures stable performance.

Technical Specifications

Other Function Telecom Interface ICs BM23SPKS1NB9-0001AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N43

Length:

29 mm

No. of Functions:

1

No. of Terminals:

43

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,43LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

1.9 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

UNSPECIFIED

Width:

15 mm

Trade Compliance

BM23SPKS1NB9-0001AA Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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