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RN4677-V/RM112

Microchip Technology

RN4677-V/RM112 by Microchip Technology

RN4677-V/RM112 by Microchip Technology is a telecom IC with 33 terminals, operating at -20 to 70°C. It has a data rate of 0.4 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for telecom applications requiring high-speed data transmission in commercial temperature environments.

Median Price

$9.590

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,525 parts In-Stock

1+ parts

$9.590

100+ parts

$8.250

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2,525

$9.590

$8.250

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Distributors (In-Stock)

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Vyrian

USA . 12,884 parts In-Stock

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12,884

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Corohmni

South Africa . 351 parts In-Stock

1+ parts

$6.452

100+ parts

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351

$6.452

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Ampacity Inc.

Singapore . 2,239 parts In-Stock

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$8.150

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2,239

$8.150

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Aztec Data Supply Inc.

USA . 3,126 parts In-Stock

1+ parts

$14.765

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3,126

$14.765

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AZTECH Wire

Italy . 713 parts In-Stock

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$16.960

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713

$16.960

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QualityLine Systems

Poland . 6,881 parts In-Stock

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6,881

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Marpe Global Electronics

Taiwan . 6,559 parts In-Stock

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6,559

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Continental Prestige Electronics

USA . 3,031 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,352 parts In-Stock

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2,352

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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XL Components Corporation

Australia . 260 parts In-Stock

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260

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Overview

Unlock the potential of seamless connectivity with the RN4677-V/RM112 by Microchip Technology. With a reputation for quality and reliability, Microchip Technology brings you a versatile solution in the category of Other Function Telecom Interface ICs. This innovative product offers unparalleled value, benefits, and advantages to customers seeking high-performance telecom ICs. From its surface mount capability to its high data rate of 0.4 Mbps, the RN4677-V/RM112 is designed to meet your communication needs with ease. Elevate your projects with this cutting-edge technology and experience the difference Microchip Technology can make in your designs.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation on PCBs, making it suitable for mass production.

Screening Level: TS 16949

This high screening level ensures reliability and quality in automotive applications, making it a dependable choice.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, saving space on the PCB.

No. of Terminals: 33

With a high number of terminals, this product offers ample connectivity options for various applications.

Package Style: MICROELECTRONIC ASSEMBLY

This package style offers durability and protection for the sensitive components within, ensuring long-term functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for use in diverse environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures reliability even in extreme cold conditions.

Terminal Finish: GOLD OVER NICKEL

The gold over nickel terminal finish provides excellent conductivity and corrosion resistance for reliable performance.

Maximum Seated Height: 2.46 mm

The low maximum seated height allows for a compact design, ideal for space-constrained applications.

Width: 12 mm

The narrow width of this product enables it to fit easily within small spaces on the PCB.

Length: 22 mm

The moderate length provides a balance between compact design and ease of handling during installation.

Temperature Grade: COMMERCIAL

This temperature grade ensures suitability for standard commercial applications.

Terminal Form: NO LEAD

The no-lead terminal form offers environmental benefits and ease of manufacturing.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type ensures optimized performance in telecommunications.

Nominal Supply Voltage: 3.3 V

The stable 3.3V supply voltage ensures consistent and reliable operation in various applications.

Terminal Pitch: 1.1 mm

The small terminal pitch allows for high-density mounting, making it suitable for compact PCB designs.

Data Rate: 0.4 Mbps

With a data rate of 0.4 Mbps, this product is ideal for applications requiring moderate-speed data transmission.

Technical Specifications

Other Function Telecom Interface ICs RN4677-V/RM112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

Data Rate:

.4 Mbps

JESD-30 Code:

R-XXMA-N33

JESD-609 Code:

e4

Length:

22 mm

No. of Functions:

1

No. of Terminals:

33

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,33LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

2.46 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

1.1 mm

Terminal Position:

UNSPECIFIED

Width:

12 mm

Trade Compliance

RN4677-V/RM112 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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