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RN4678U-V/RM100

Microchip Technology

RN4678U-V/RM100 by Microchip Technology

RN4678U-V/RM100 by Microchip Technology is a telecom IC with 30 terminals, operating temperature range of -20 to 70°C. It is surface mountable and TS 16949 compliant. Ideal for applications requiring a compact MICROELECTRONIC ASSEMBLY package with COMMERCIAL EXTENDED temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,506 parts In-Stock

1+ parts

-

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1k+ parts

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1,506

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

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1k+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 500 parts In-Stock

1+ parts

$6.843

100+ parts

-

1k+ parts

$6.569

10k+ parts

$6.569

500

$6.843

-

$6.569

$6.569

AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$7.919

100+ parts

-

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469

$7.919

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Ampacity Inc.

Singapore . 1,006 parts In-Stock

1+ parts

$98.000

100+ parts

-

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1,006

$98.000

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Semicontronic

India . 545 parts In-Stock

1+ parts

$575.000

100+ parts

$560.625

1k+ parts

$557.750

10k+ parts

-

545

$575.000

$560.625

$557.750

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West Coast Incorporated

USA . 5,855 parts In-Stock

1+ parts

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5,855

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Continental Prestige Electronics

USA . 2,698 parts In-Stock

1+ parts

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2,698

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Argo Parts USA

USA . 729 parts In-Stock

1+ parts

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729

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Experience seamless connectivity and reliable performance with the Microchip Technology RN4678U-V/RM100. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and cutting-edge technology in every product they deliver. The RN4678U-V/RM100 falls under the category of Other Function Telecom Interface ICs, making it versatile for various applications. With its compact package style and wide temperature range, this product is designed to meet your needs with precision and efficiency. Trust Microchip Technology to provide you with superior products that bring value, benefits, and advantages to your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design ensures easy and efficient integration into circuit boards, saving space and reducing assembly time.

Screening Level: TS 16949

TS 16949 screening ensures high quality and reliability, meeting stringent industry standards for telecom applications.

Package Shape: RECTANGULAR

Rectangular package shape enables stable placement and secure connection within electronic systems.

No. of Terminals: 30

Having 30 terminals provides ample connectivity options for interfacing with other components in a telecom system.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style offers precision and compactness suitable for telecom interface applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding telecom environments.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for operation in a wide range of temperature conditions.

Maximum Seated Height: 1.8 mm

Low seated height facilitates a slim and compact design, suitable for space-constrained telecom systems.

Width: 12 mm

12 mm width provides a balance between compactness and ease of handling during installation.

Length: 15 mm

15 mm length ensures compatibility with standard board sizes and allows for flexible placement within the system.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable performance in various commercial telecom applications.

Terminal Form: NO LEAD

No-lead terminals offer improved soldering reliability and environmental sustainability compared to traditional leaded terminals.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed as a telecom circuit IC, ensuring compatibility and optimal performance in telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs RN4678U-V/RM100 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N30

Length:

15 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

MODULE,30LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

1.8 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

12 mm

Trade Compliance

RN4678U-V/RM100 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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