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ATSAMW25H18-MR210PB1961

Microchip Technology

ATSAMW25H18-MR210PB1961 by Microchip Technology

Microchip ATSAMW25H18-MR210PB1961 is a telecom IC with 51 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm. Ideal for industrial applications requiring compact surface-mount telecom interface ICs.

Median Price

$15.300

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15 parts In-Stock

1+ parts

$12.410

100+ parts

-

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15

$12.410

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Verical

USA . 15 parts In-Stock

1+ parts

$12.410

100+ parts

-

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-

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15

$12.410

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Mouser Electronics

USA . 343 parts In-Stock

1+ parts

$15.300

100+ parts

-

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343

$15.300

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DigiKey

USA . 30 parts In-Stock

1+ parts

$15.300

100+ parts

$14.000

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-

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30

$15.300

$14.000

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Microchip Technology

USA . 17 parts In-Stock

1+ parts

$15.300

100+ parts

$13.100

1k+ parts

$11.770

10k+ parts

$11.000

17

$15.300

$13.100

$11.770

$11.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 73 parts In-Stock

1+ parts

$16.435

100+ parts

-

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73

$16.435

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Vyrian

USA . 5,924 parts In-Stock

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5,924

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VNN

France . 2,391 parts In-Stock

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2,391

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,260 parts In-Stock

1+ parts

$2.150

100+ parts

-

1k+ parts

$2.064

10k+ parts

$2.064

5,260

$2.150

-

$2.064

$2.064

Aztec Data Supply Inc.

USA . 3,212 parts In-Stock

1+ parts

$7.890

100+ parts

-

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3,212

$7.890

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Corohmni

South Africa . 19 parts In-Stock

1+ parts

$11.377

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19

$11.377

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Ampacity Inc.

Singapore . 45 parts In-Stock

1+ parts

$13.010

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45

$13.010

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AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$14.216

100+ parts

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590

$14.216

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Continental Prestige Electronics

USA . 4,685 parts In-Stock

1+ parts

$16.435

100+ parts

-

1k+ parts

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10k+ parts

$16.106

4,685

$16.435

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-

$16.106

Argo Parts USA

USA . 2,545 parts In-Stock

1+ parts

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2,545

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Fulton Briggs Corp.

USA . 2,057 parts In-Stock

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2,057

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XScomponents

USA . 2,000 parts In-Stock

1+ parts

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1k+ parts

$22.380

10k+ parts

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2,000

-

-

$22.380

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$16.106

1k+ parts

$15.613

10k+ parts

$15.285

1,000

-

$16.106

$15.613

$15.285

Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

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100+ parts

$10.715

1k+ parts

$9.922

10k+ parts

$9.922

150

-

$10.715

$9.922

$9.922

Overview

Elevate your telecom interface with the ATSAMW25H18-MR210PB1961 by Microchip Technology. Known for their superior quality and cutting-edge technology, Microchip delivers top-of-the-line products that exceed industry standards. This versatile IC is perfect for a wide range of applications, providing seamless connectivity and reliable performance. With its compact design and industrial-grade temperature range, this Telecom Circuit IC offers unmatched value and efficiency. Upgrade your systems with the ATSAMW25H18-MR210PB1961 and experience the difference that Microchip Technology brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount feature allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape is a common form factor that can easily fit into various electronic devices.

No. of Terminals: 51

Having 51 terminals provides versatility and options for interfacing with other components in a telecom system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding thermal conditions in industrial environments.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V makes it compatible with standard power sources in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ATSAMW25H18-MR210PB1961 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N51

Length:

33.864 mm

No. of Functions:

1

No. of Terminals:

51

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.138 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

UNSPECIFIED

Width:

14.908 mm

Trade Compliance

ATSAMW25H18-MR210PB1961 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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