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ATSAMW25H18-MR210PB

Microchip Technology

ATSAMW25H18-MR210PB by Microchip Technology

Microchip's ATSAMW25H18-MR210PB is a telecom IC with 51 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm. Ideal for industrial applications requiring surface mount rectangular package style ICs.

Median Price

$23.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,627 parts In-Stock

1+ parts

$23.580

100+ parts

$20.250

1k+ parts

$18.130

10k+ parts

$17.040

5,627

$23.580

$20.250

$18.130

$17.040

Avnet

USA . 100 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$15.490

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$15.490

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VNN

France . 5,074 parts In-Stock

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Vyrian

USA . 2,902 parts In-Stock

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AZTECH Wire

Italy . 195 parts In-Stock

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$6.324

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Aztec Data Supply Inc.

USA . 2,030 parts In-Stock

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$14.490

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$14.490

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Continental Prestige Electronics

USA . 3,554 parts In-Stock

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$15.490

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$15.180

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$15.180

Netroflash

USA . 50 parts In-Stock

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$15.490

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Corohmni

South Africa . 217 parts In-Stock

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$17.868

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Ampacity Inc.

Singapore . 100 parts In-Stock

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$164.000

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Kepictronics

USA . 22,701 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,981 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,987 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,696 parts In-Stock

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Argo Parts USA

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Upgrade your telecom systems with the ATSAMW25H18-MR210PB by Microchip Technology. Known for its high-quality components and innovative solutions, Microchip Technology delivers reliable products that exceed industry standards. The ATSAMW25H18-MR210PB is a versatile telecom interface IC that offers seamless integration and superior performance. Whether you're looking to enhance communication networks or streamline telecommunication processes, this product provides unmatched value, benefits, and advantages to meet your specific needs. Upgrade to Microchip Technology and experience the difference in quality and reliability.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic devices.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for compatibility with various applications.

No. of Terminals: 51

Ample number of terminals for versatile connectivity options.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly offers precise and reliable performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable operation in various environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for functionality in extreme conditions.

Maximum Seated Height: 2.138 mm

Low profile design for space-saving installation.

Width: 14.908 mm

Compact width for easy integration into tight spaces.

Length: 33.864 mm

Standard length for compatibility with existing designs.

Temperature Grade: INDUSTRIAL

Industrial-grade design ensures durability and reliability in harsh environments.

Terminal Form: NO LEAD

Lead-free terminal form for environmental and health safety.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications for optimal performance.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

Terminal Pitch: 1.2 mm

Fine terminal pitch for precise and secure connections.

Technical Specifications

Other Function Telecom Interface ICs ATSAMW25H18-MR210PB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N51

Length:

33.864 mm

No. of Functions:

1

No. of Terminals:

51

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.138 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

UNSPECIFIED

Width:

14.908 mm

Trade Compliance

ATSAMW25H18-MR210PB Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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