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ATSAMW25H18-MR510PB

Microchip Technology

ATSAMW25H18-MR510PB by Microchip Technology

Microchip's ATSAMW25H18-MR510PB is a telecom IC with 51 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm. This surface-mount rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces.

Median Price

$11.370

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

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$11.370

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Verical

USA . 7 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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$18.465

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750

$18.465

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Vyrian

USA . 9,033 parts In-Stock

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VNN

France . 3,667 parts In-Stock

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Bristol Electronics

USA . 24 parts In-Stock

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Dan-Mar Components

USA . 24 parts In-Stock

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$3.140

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$3.140

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AZTECH Wire

Italy . 430 parts In-Stock

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$5.437

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$5.437

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Continental Prestige Electronics

USA . 3,085 parts In-Stock

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$18.465

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$18.096

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$18.465

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Kepictronics

USA . 22,702 parts In-Stock

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Argo Parts USA

USA . 3,186 parts In-Stock

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Marpe Global Electronics

Taiwan . 1,443 parts In-Stock

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QualityLine Systems

Poland . 1,443 parts In-Stock

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XL Components Corporation

Australia . 1,443 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Perfect Parts

USA . 56 parts In-Stock

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Overview

Elevate your telecom projects with the ATSAMW25H18-MR510PB by Microchip Technology. Known for their high-quality products, Microchip Technology delivers reliable solutions that exceed industry standards. This cutting-edge telecom interface IC offers seamless integration, optimal performance, and versatility for a wide range of applications. Experience the value of innovation and efficiency with the ATSAMW25H18-MR510PB, making it the ultimate choice for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy assembly and space-saving on PCB, making it a convenient choice for compact designs.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, enabling a more organized layout and potentially reducing manufacturing costs.

No. of Terminals: 51

With 51 terminals, this product offers a wide range of connectivity options, making it versatile for various telecom interface applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments where temperature may fluctuate.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this product is compatible with standard power sources, enhancing ease of integration.

Technical Specifications

Other Function Telecom Interface ICs ATSAMW25H18-MR510PB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N51

Length:

33.864 mm

No. of Functions:

1

No. of Terminals:

51

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.138 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

UNSPECIFIED

Width:

14.908 mm

Trade Compliance

ATSAMW25H18-MR510PB Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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