Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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LC72720YVS-MPB-E
Onsemi
LC72720YVS-MPB-E by Onsemi is a telecom IC with 30 terminals, operating from -40 to 85 °C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for telecom circuits, it comes in a small outline package with gull wing terminals.
R-PDSO-G30
e6
9.75 mm
4
1
30
85 Cel
-40 Cel
PLASTIC/EPOXY
LSSOP
RECTANGULAR
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
260
1.5 mm
3.3 V
YES
TELECOM CIRCUIT
INDUSTRIAL
TIN BISMUTH
GULL WING
.65 mm
DUAL
5.6 mm
LC72720YVS-TLM-E
LC72720YVS-TLM-E by Onsemi is a telecom IC with 30 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Features include 3.3V supply voltage, Gull Wing terminals, and tin bismuth finish for telecom circuit applications.
BGS110MN20E6327XTSA1
Infineon Technologies
BGS110MN20E6327XTSA1 by Infineon is a 20-terminal telecom IC with a nominal voltage of 3.5V. It operates b/w -30°C to 85°C, in a square chip carrier package style. With terminals at the bottom and 0.4mm pitch, it's ideal for telecom interface applications.
S-XBCC-B20
2.3 mm
20
-30 Cel
UNSPECIFIED
BCC
SQUARE
CHIP CARRIER
.77 mm
3.5 V
OTHER
BUTT
.4 mm
BOTTOM
HMC641ALP4ETR
Analog Devices
HMC641ALP4ETR by Analog Devices is a telecom interface IC with 24 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal negative supply voltage of -3V and terminal pitch of 0.5mm, it is ideal for telecom circuit designs requiring compact and high-performance solutions.
S-XQCC-N24
4 mm
-3 V
24
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
NOT SPECIFIED
.95 mm
NO LEAD
.5 mm
QUAD
LMS7002M
Lime Microsystems
Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.
S-PBGA-B261
11.5 mm
261
BGA
GRID ARRAY
1.2 V
BALL
IP4047CX6/LF,135
Nexperia
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;
R-PBGA-B6
1.44 mm
6
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.7 mm
.99 mm
RN41XVC-I/RM
Microchip Technology
Microchip Technology's RN41XVC-I/RM is a telecom IC with 20 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial applications. The package style is rectangular with dimensions of 24.4mm x 29.9mm, making it suitable for various telecom interface functions.
R-XDMA-T20
29.9 mm
MICROELECTRONIC ASSEMBLY
2 mm
NO
THROUGH-HOLE
24.4 mm
RN41XVU-I/RM
Microchip Technology's RN41XVU-I/RM is a telecom IC with 20 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and nickel/gold terminal finish. This rectangular package is ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY design.
e4
Nickel/Gold (Ni/Au)
RN42XVU-I/RM
RN42XVU-I/RM by Microchip Technology is a telecom interface IC with 1 function. It has a rectangular package shape with 20 terminals and a max seated height of 2mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V, making it suitable for various telecom circuit applications.
ENW89823C4KF
Panasonic
TELECOM CIRCUIT;
HMC745LC3TR-R5
Analog Devices' HMC745LC3TR-R5 is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm, ideal for telecom circuit applications.
S-CQCC-N16
2.9 mm
3
16
CERAMIC, METAL-SEALED COFIRED
.9 mm
AX-SFEU-1-01-TB05
AX-SFEU-1-01-TB05 by Onsemi is a Telecom Circuit IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. This surface-mount IC is ideal for telecom interface applications requiring a very thin profile and industrial temperature grade.
R-PQCC-N40
7 mm
40
LCC40,.2X.27,20
1 mm
3 V
Nickel/Palladium/Gold (Ni/Pd/Au)
5 mm
AX5243-1-TA05
AX5243-1-TA05 by Onsemi is a telecom IC with CMOS technology, operating b/w -40 to 85°C. It features 20 terminals in a square chip carrier package style, suitable for telecom circuit applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in industrial temperature grades.
S-XQCC-N20
e3
CMOS
TIN
AX5243-1-TW30
AX5243-1-TW30 by Onsemi is a CMOS telecom IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features include 3V supply voltage, matte tin finish, and quad terminal position for telecom interface functions.
MATTE TIN
BGA5M1BN6E6327XTSA1
Infineon's BGA5M1BN6E6327XTSA1 is a RECTANGULAR CHIP CARRIER with 6 terminals, operating from -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT IC with a supply voltage of 1.8V, suitable for telecom interface applications due to its compact size and surface-mount capability.
R-XBCC-B6
1.1 mm
1.8 V
BGSF110GN26E6327XTSA1
BGSF110GN26E6327XTSA1 by Infineon is a Telecom IC with 26 terminals in a rectangular chip carrier package. Operating temperature range from -30 to 85°C, suitable for telecom circuits. Utilizes CMOS technology with a nominal voltage of 3V, ideal for surface mount applications.
R-PQCC-N26
3.4 mm
26
HQCCN
CHIP CARRIER, HEAT SINK/SLUG
NICKEL PALLADIUM GOLD SILVER
2.6 mm
RM024-P125-C-30
Laird Technologies
RM024-P125-C-30 by Laird Technologies is an industrial-grade TELECOM CIRCUIT with a data rate of 0.5 Mbps. Operating temperature ranges from -40°C to 85°C, making it suitable for various telecom applications. Packaged in MICROELECTRONIC ASSEMBLY, this IC is ideal for telecommunications interfaces requiring reliable performance in harsh environments.
ALSO AVAILABLE WITH 280kbps data rate
.5 Mbps
R-XXMA-X
XMA
RM024-S125-C-30
RM024-S125-C-30 by Laird Technologies is an industrial-grade TELECOM CIRCUIT with a data rate of 0.5 Mbps. Operating temperature ranges from -40°C to 85°C, making it suitable for various telecom applications. Packaged in MICROELECTRONIC ASSEMBLY, this RECTANGULAR device excels in telecom interface functions.
ADAR1000ACCZN-R7
ADAR1000ACCZN-R7 by Analog Devices is a telecom IC with 88 terminals, operating temp range of -40 to 85°C. It has a nominal voltage of 3.3V and negative supply voltage of -5V. Ideal for telecom circuits, this IC comes in a square package style with surface mount feature.
S-PBGA-B88
-5 V
88
HLGA
GRID ARRAY, HEAT SINK/SLUG
.8 mm
ADAR1000ACCZN
ADAR1000ACCZN by Analog Devices is a telecom IC with 88 terminals in a grid array package. It operates b/w -40°C to 85°C, with a nominal voltage of 3.3V and negative supply voltage of -5V. This IC is designed for telecom circuits requiring precise temperature control and industrial-grade performance.
LEA-6T-0
U-blox Ag
LEA-6T-0 by U-blox Ag is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a nominal voltage of 3V and is AEC-Q100 and TS 16949 compliant. This surface-mount IC is designed for industrial applications requiring reliable telecom circuitry in a small outline package.
R-PDSO-N28
28
SON
SMALL OUTLINE
AEC-Q100; TS 16949
ADRV9009BBCZ
Analog Devices ADRV9009BBCZ is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a fine pitch terminal style and tin silver copper finish.
S-PBGA-B196
e1
12 mm
196
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.27 mm
1.3 V
TIN SILVER COPPER
AX5042-1-TA05
The Onsemi AX5042-1-TA05 is a Telecom Interface IC with 28 terminals in a square chip carrier package. It operates b/w -40 °C to 85°C, suitable for industrial applications. This CMOS technology IC has a nominal voltage of 2.5V and terminal finish of Ni/Pd/Au, making it ideal for telecom circuits.
S-XQCC-N28
2.5 V
MFRC63103HNE
NXP Semiconductors
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 2; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
2
BGAU1A10E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;
R-XBCC-B10
10
ST25TV16K-AP6G3
STMicroelectronics
ST25TV16K-AP6G3 by STMicroelectronics is a telecom interface IC designed for robust applications. It operates b/w -40 °C to 85 °C, features a data rate of 0.053 Mbps, and comes in a round, no-lead package. Ideal for surface mount technology in telecom circuits.
.053 Mbps
X-XUUC-N
DIE
DIE OR CHIP
ROUND
UNCASED CHIP
ADRV9008BBCZ-1
ADRV9008BBCZ-1 by Analog Devices is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom applications requiring precise signal processing and connectivity in industrial environments.
ADRV9008BBCZ-2
Analog Devices' ADRV9008BBCZ-2 is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a bottom terminal position and plastic/epoxy body material.
ACFM-7037-TR1
Broadcom
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 15; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N15; Terminal Position: UNSPECIFIED;
R-XXMA-N15
3.6 mm
15
ZED-F9P-00B
ZED-F9P-00B by U-blox Ag is a 54-terminal IC with AEC-Q100 screening, operating from -40 to 85°C. It features a 3V supply voltage, telecom circuit type, and compact rectangular package. Ideal for telecom interfaces in industrial applications due to its small size and wide temperature range.
R-XBGA-N54
22 mm
54
LGA
AEC-Q100
17 mm
XB3-24Z8PS-J
Digi International
The Digi International XB3-24Z8PS-J is a telecom IC with 37 terminals, suitable for industrial applications. It operates b/w -40°C to 85°C and comes in a surface-mount rectangular package. This IC is designed for telecom circuits, offering reliable performance in various communication systems.
R-XXMA-N37
37
XB3-24Z8RM-J
The Digi International XB3-24Z8RM-J is a surface mount telecom IC with 34 terminals. It operates in industrial temperature range (-40 to 85°C) and has a rectangular package style (13x19mm). Ideal for telecom circuits, this IC is designed for various applications requiring reliable communication interfaces.
R-XXMA-N34
19 mm
34
13 mm
XB3-24Z8RM
The Digi International XB3-24Z8RM is a surface mount telecom IC with 34 terminals, operating temperature range of -40 to 85°C. Its rectangular package style makes it suitable for industrial applications requiring telecom circuit functionality.
XB3-24Z8RS
The Digi International XB3-24Z8RS is a surface mount telecom IC with 37 terminals. Operating temperature range of -40 to 85°C makes it suitable for industrial applications. This rectangular package style microelectronic assembly does not have lead terminals, ideal for telecom circuit interfaces.
XB3-24Z8US-J
The Digi International XB3-24Z8US-J is a surface mount telecom IC with 37 terminals. It operates in industrial temperature range (-40 to 85°C) and has a rectangular package style. Ideal for telecom circuits, this IC offers reliable performance in various applications.
STHVDAC-253C7
STHVDAC-253C7 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C and 85 °C, with a nominal voltage of 3.3V and features a very thin profile grid array package. Ideal for compact telecom systems, it ensures efficient performance in limited spaces.
R-XBGA-B12
1.45 mm
12
BGA12,3X4,14
.64 mm
.35 mm
TC35680FSG-002(ELG
Toshiba
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
S-XQCC-N40
LCC40,.2SQ,16
VSC8490YJU-17
VSC8490YJU-17 by Microchip Technology is a telecom IC with 196 terminals in a low-profile grid array package. It operates b/w -40 to 110°C, supporting data rates up to 10 Gbps. Ideal for industrial applications requiring high-speed telecom circuitry in compact form factors.
10000 Mbps
15 mm
110 Cel
LBGA
BGA196,14X14,40
GRID ARRAY, LOW PROFILE
1.4 mm
1 V
VSC8491YJU-17
Microchip Technology's VSC8491YJU-17 is a telecom IC with data rate of 10 Gbps. It operates in industrial temperature range (-40 to 110°C) and has 196 terminals in a low profile grid array package. Ideal for telecom applications requiring high-speed data transmission.
ADF5902WCCPZ
Analog Devices ADF5902WCCPZ is a telecom IC with 32 terminals, operating at -40 to 105 °C. It has a supply voltage of 3.3V and terminal pitch of 0.5mm, suitable for industrial applications requiring AEC-Q100 screening and surface mount compatibility. The chip carrier package style with very thin profile makes it ideal for compact designs in telecommunications interfaces.
S-XQCC-N32
32
105 Cel
SARA-G450-00C-00
SARA-G450-00C-00 by U-blox Ag is a surface mount telecom IC with 96 terminals. It operates b/w -20°C to 70°C, with a nominal voltage of 3.8V. This rectangular microelectronic assembly is ideal for telecom circuit applications due to its compact size and no lead terminal form.
R-XXMA-N96
26 mm
96
70 Cel
-20 Cel
2.65 mm
3.8 V
16 mm
ZED-F9T-00B
ZED-F9T-00B by U-blox Ag is a 54-terminal RECTANGULAR GRID ARRAY IC with -40 to 85 °C temp range. Ideal for TELECOM CIRCUIT applications, it operates at 3V with 1.1mm terminal pitch and AEC-Q100 screening level.
R-XBGA-B54
453-00005C
Laird Technologies' 453-00005C is a surface mount telecom IC with 1 function and 39 terminals. It has a rectangular shape, measures 14mm in length, and operates at temperatures ranging from -40 to 85°C. This IC is commonly used in industrial applications requiring a nominal voltage of 3V.
R-XXMA-N39
14 mm
39
2.33 mm
.75 mm
10 mm
XB24CZ7PIS-004
XB24CZ7PIS-004 by Digi International is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features an industrial temperature grade and surface-mount package style, suitable for various telecom interface applications. This rectangular microelectronic assembly has no-lead terminals, making it ideal for industrial settings.
R-XXMA-N
ADS58J64IRRHR
Texas Instruments
Texas Instruments ADS58J64IRRHR is a 72-terminal IC with max analog input of 2V. Ideal for telecom circuits, it operates b/w -40 to 85°C and has a nominal voltage of 1.15V. Its surface mount design and industrial temperature grade make it suitable for various telecom interface applications.
2 V
R-XQCC-N72
72
1.15 V
NICKEL PALLADIUM GOLD
MGM12P02F1024GA-V4R
Silicon Labs
Silicon Labs' MGM12P02F1024GA-V4R is a rectangular-shaped telecom IC with 3.3V supply voltage, 1 Mbps data rate, and operating temperatures from -40 to 85°C. It is designed for telecom circuit applications requiring special package shapes in a compact form factor of 12.9mm width and 17.8mm length.
1 Mbps
17.8 mm
SPECIAL SHAPE
12.9 mm
MGM12P02F1024GA-V4
Silicon Labs' MGM12P02F1024GA-V4 is a Telecom IC with 1 Mbps data rate, operating from -40 to 85°C. Its package style is special shape, measuring 12.9mm in width and 17.8mm in length. Ideal for telecom applications requiring a nominal voltage of 3.3V.
MGM12P02F1024GE-V4
Silicon Labs' MGM12P02F1024GE-V4 is a TELECOM CIRCUIT with 1 Mbps Data Rate, operating b/w -40 to 85 °C. RECTANGULAR package shape, 12.9mm Width, and 17.8mm Length make it ideal for telecom interface applications requiring a Nominal Voltage of 3.3V.
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