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ST25TV16K-AP6G3

STMicroelectronics

ST25TV16K-AP6G3 by STMicroelectronics

ST25TV16K-AP6G3 by STMicroelectronics is a telecom interface IC designed for robust applications. It operates b/w -40 °C to 85 °C, features a data rate of 0.053 Mbps, and comes in a round, no-lead package. Ideal for surface mount technology in telecom circuits.

Median Price

$0.340

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11,350 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

-

11,350

$0.345

-

-

-

Future Electronics

Canada . 20,283 parts In-Stock

1+ parts

-

100+ parts

$0.335

1k+ parts

$0.330

10k+ parts

$0.305

20,283

-

$0.335

$0.330

$0.305

Chip1Stop

Japan . 11,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.309

11,350

-

-

-

$0.309

Verical

USA . 11,350 parts In-Stock

1+ parts

-

100+ parts

$0.345

1k+ parts

-

10k+ parts

-

11,350

-

$0.345

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,151 parts In-Stock

1+ parts

$0.276

100+ parts

-

1k+ parts

-

10k+ parts

-

2,151

$0.276

-

-

-

Vyrian

USA . 8,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,786

-

-

-

-

Anansix

USA . 1,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,052

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,148 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

10k+ parts

-

4,148

$0.261

-

-

-

IDEA Electronic Components Group

UK . 1,549 parts In-Stock

1+ parts

$10.885

100+ parts

-

1k+ parts

$9.797

10k+ parts

-

1,549

$10.885

-

$9.797

-

AZTECH Wire

Italy . 1,059 parts In-Stock

1+ parts

$14.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,059

$14.730

-

-

-

MKK Technologies

India . 2,183 parts In-Stock

1+ parts

$20.469

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$20.469

-

-

-

DigiPath Technology Company

USA . 2,183 parts In-Stock

1+ parts

$20.469

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$20.469

-

-

-

Parana Technologies

USA . 1,538 parts In-Stock

1+ parts

-

100+ parts

$13.015

1k+ parts

-

10k+ parts

-

1,538

-

$13.015

-

-

Overview

Unlock a world of seamless connectivity and reliability with the ST25TV16K-AP6G3 from STMicroelectronics. Renowned for its cutting-edge technology, STMicroelectronics ensures this telecom interface IC excels in a variety of applications, delivering outstanding performance even in extreme temperatures. Experience enhanced efficiency and durability, making it the ideal choice for your next project. Elevate your solutions today with quality you can trust!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easier integration into modern PCB designs, saving space and enabling higher-density applications.

Package Shape: ROUND

The round package shape contributes to efficient space usage and is often preferred in compact electronic designs, enhancing design flexibility.

Package Style (Meter): UNCASED CHIP

An uncased chip style offers reduced package size and weight, which is ideal for applications where minimal space is essential.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for a variety of industrial and environmental applications.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C ensures reliability in extreme environments, making it ideal for outdoor and harsh conditions.

Terminal Form: NO LEAD

The no-lead terminal form can help reduce electromagnetic interference (EMI) and provides a more compact footprint for designers.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit, this IC is optimized for telecommunications applications, ensuring high performance and reliability.

Data Rate: 0.053 Mbps

A data rate of 0.053 Mbps makes this IC suitable for low-bandwidth communication applications, ensuring cost-efficiency and simplicity in design.

Technical Specifications

Other Function Telecom Interface ICs ST25TV16K-AP6G3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

Data Rate:

.053 Mbps

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

ST25TV16K-AP6G3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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