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ST25RU3992-BQFT

STMicroelectronics

ST25RU3992-BQFT by STMicroelectronics

ST25RU3992-BQFT by STMicroelectronics is a 64-terminal telecom IC in a square package. It is surface-mountable and designed for telecom circuit applications, offering quad terminal positioning without leads.

Median Price

$49.337

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$49.337

100+ parts

-

1k+ parts

-

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300

$49.337

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-

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Vyrian

USA . 4,773 parts In-Stock

1+ parts

-

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-

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4,773

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-

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Anansix

USA . 1,518 parts In-Stock

1+ parts

-

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-

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1,518

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-

-

-

Digiode

USA . 648 parts In-Stock

1+ parts

-

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-

1k+ parts

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648

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-

-

-

Chip Stock

USA . 148 parts In-Stock

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148

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 438 parts In-Stock

1+ parts

$8.650

100+ parts

-

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438

$8.650

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-

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IDEA Electronic Components Group

UK . 559 parts In-Stock

1+ parts

$13.633

100+ parts

-

1k+ parts

$12.270

10k+ parts

-

559

$13.633

-

$12.270

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$15.130

100+ parts

-

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483

$15.130

-

-

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Corohmni

South Africa . 286 parts In-Stock

1+ parts

$16.357

100+ parts

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286

$16.357

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MKK Technologies

India . 622 parts In-Stock

1+ parts

$25.637

100+ parts

-

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622

$25.637

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-

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DigiPath Technology Company

USA . 622 parts In-Stock

1+ parts

$25.637

100+ parts

-

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622

$25.637

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Continental Prestige Electronics

USA . 2,417 parts In-Stock

1+ parts

$49.337

100+ parts

-

1k+ parts

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10k+ parts

$48.350

2,417

$49.337

-

-

$48.350

Semicontronic

India . 598 parts In-Stock

1+ parts

$641.000

100+ parts

$624.975

1k+ parts

$621.770

10k+ parts

-

598

$641.000

$624.975

$621.770

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Ampacity Inc.

Singapore . 1,364 parts In-Stock

1+ parts

$751.000

100+ parts

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1,364

$751.000

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Argo Parts USA

USA . 3,816 parts In-Stock

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3,816

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Parana Technologies

USA . 1,533 parts In-Stock

1+ parts

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$16.301

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1,533

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$16.301

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Corphita

USA . 789 parts In-Stock

1+ parts

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789

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Epart123

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$187.500

1k+ parts

-

10k+ parts

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500

-

$187.500

-

-

GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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500

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$48.350

1k+ parts

$46.870

10k+ parts

$45.883

50

-

$48.350

$46.870

$45.883

Overview

Unleash the power of seamless connectivity with the ST25RU3992-BQFT by STMicroelectronics. Crafted with precision by a leading manufacturer in the industry, this telecom interface IC offers unparalleled quality and reliability. Ideal for various applications, this product provides value beyond measure with its advanced features and cutting-edge technology. Elevate your projects to new heights with the ST25RU3992-BQFT, where innovation meets excellence.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable assembly onto PCBs, saving space and reducing overall product size.

Package Shape: SQUARE

The square package shape can provide better heat dissipation and mechanical stability compared to other shapes, enhancing the reliability of the product.

No. of Terminals: 64

Having 64 terminals allows for more connections and functionalities to be integrated into the IC, making it versatile and suitable for complex telecom applications.

Terminal Position: QUAD

Quad terminal positioning can help optimize signal integrity and reduce crosstalk, improving the overall performance of the telecom interface IC.

Terminal Form: NO LEAD

No lead terminals eliminate the risk of solder bridging and improve signal transmission quality, ensuring reliable operation in telecom systems.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this IC is tailored to meet the unique requirements of telecom applications, providing superior performance and compatibility.

Technical Specifications

Other Function Telecom Interface ICs ST25RU3992-BQFT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

Additional Features:

Operates from 4.1V to 5.5V Supply

JESD-30 Code:

S-XQCC-N64

No. of Functions:

1

No. of Terminals:

64

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

LCC64(UNSPEC)

Package Shape:

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

ST25RU3992-BQFT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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