Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Digi International XB3-24Z8RM is a surface mount telecom IC with 34 terminals, operating temperature range of -40 to 85°C. Its rectangular package style makes it suitable for industrial applications requiring telecom circuit functionality.
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YES - Surface mount technology allows for easy and efficient assembly onto circuit boards.
RECTANGULAR - Rectangular shape provides compatibility with standard PCB layouts.
34 - Sufficient number of terminals for versatile connectivity options.
MICROELECTRONIC ASSEMBLY - Compact package style saves space on the board.
85 °C - Able to withstand high operating temperatures without performance degradation.
40 °C - Designed to function in extreme cold conditions.
13 mm - Slim width fits well in compact devices.
19 mm - Optimal length for fitting within limited space requirements.
INDUSTRIAL - Suitable for industrial applications that require reliable performance under harsh conditions.
NO LEAD - Lead-free terminals ensure environmental friendliness and compliance with regulations.
TELECOM CIRCUIT - Specialized for telecom applications, ensuring optimal performance in telecommunications systems.
Other Function Telecom Interface ICs XB3-24Z8RM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Digi International
JESD-30 Code:
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Package Body Material:
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Telecom IC Type:
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PCN Design/Specification - Firmware version 14/Jul/2021 Mult Dev Firmware Chgs 2/Nov/2020
Since 1985, Digi International Inc. (Digi) has been a pioneer in wireless communication, forging the future for connected devices and responding to the needs of the people and enterprises that use them. Before the Internet of Things was a thing, we built M2M and IoT devices, adapted to evolving network standards, and optimized data communications around the most advanced protocols and emerging technologies. From radio frequency modems to gateways, cellular routers, networking devices, embedded system-on-modules (SOM) and single-board computers (SBCs), Digi's solutions have continually grown to serve the full breadth of applications across the IoT landscape. Today, our IoT offering includes sensor-based solutions, a sophisticated platform for remotely monitoring device deployments of any size, anywhere, as well as professional design, implementation and certification teams to help you carry out your vision, no matter how large or small.
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Taitron Components
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
Crimson Semiconductor
NC7WZ07P6X
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
Grande Electronics
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
LIS3DHTR
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
RS9116W-DB00-CC0-B24
Silicon Labs
TELECOM CIRCUIT;
PN5321A3HN/C106;55
NXP Semiconductors
NXP Semiconductors' PN5321A3HN/C106;55 is a telecom IC with 40 terminals, operating b/w -30 to 85°C. It has a nominal voltage of 3.4V and terminal pitch of 0.5mm. This chip carrier package is suitable for various telecom circuit applications due to its compact size and surface mount capability.
CC2500RGPR
Texas Instruments
CC2500RGPR by Texas Instruments is a telecom IC with 20 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.25 Mbps, suitable for industrial applications requiring a compact chip carrier package with surface mount capability.
MAX-8Q-0
U-blox Ag
MAX-8Q-0 by U-blox Ag is an AEC-Q100 graded telecom IC with 18 terminals, operating b/w -40 to 85°C. With a nominal voltage of 3V, it is ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package style. The IC's DUAL terminal position and NO LEAD form make it suitable for telecom circuit designs needing high reliability in harsh environments.
CL4490-1000-PRO
Laird Technologies
RF AND BASEBAND CIRCUIT;
NINA-B306-00B-00
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
ISL32275EFVZ-T
Intersil
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
MAX-M8Q
CC2640R2FRGZR
CC2640R2FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and no-lead terminal form.
RN4020-V/RM123
Microchip Technology
RN4020-V/RM123 by Microchip Technology is a telecom IC with 24 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and operates b/w -30 to 85°C. Ideal for telecom applications requiring high-speed data transmission in compact designs.
HMC624ALP4E
Hittite Microwave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
BGT24MTR12E6327XUMA1
Infineon Technologies
BGT24MTR12E6327XUMA1 by Infineon is a telecom IC with 32 terminals in a chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a supply voltage of 3.3V, it features a terminal pitch of 0.5mm and is surface mountable for various telecom interface applications.
BM70BLES1FC2-0B03AA
The Microchip Technology BM70BLES1FC2-0B03AA is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C, and data rate of 0.0086 Mbps. It is designed for industrial applications requiring a nominal voltage of 3V, such as wireless communication systems.
LNBH26LPQR
STMicroelectronics LNBH26LPQR is a 24-terminal, 4x4mm chip carrier IC with a nominal voltage of 12V. Operating b/w 0-85°C, it's ideal for telecom circuits due to its quad terminal position and 0.5mm pitch. The surface-mountable IC features a very thin profile package style for compact applications.
HMC566LP4E
XB3-24Z8ST-J
Digi International
XB3-24Z8ST-J by Digi Int. is a telecom IC with 20 terminals in MICROELECTRONIC ASSEMBLY package. Operating temp range -40 to 85°C, suitable for INDUSTRIAL applications. Features THROUGH-HOLE terminals and DUAL position, ideal for TELECOM CIRCUIT designs.
AD9874ABSTZ
Analog Devices
AD9874ABSTZ by Analog Devices is a telecom IC with 48 terminals in a square flatpack package. It operates b/w -40°C to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features gull wing terminals and matte tin finish, suitable for industrial temperature grade applications.
WT32I-A-AI61
Other Telecom ICs;
TLE8457BSJXUMA1
TLE8457BSJXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC is ideal for telecom circuit applications due to its compact size and gull wing terminal form.
MGM12P32F1024GE-V2
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XB3-24Z8PT-J
XB3-24Z8PT-J by Digi Int. is a telecom IC with 20 terminals in MICROELECTRONIC ASSEMBLY package. Operating temp range -40 to 85°C, INDUSTRIAL grade. Ideal for TELECOM CIRCUIT applications due to THROUGH-HOLE terminal form and DUAL position.
XB3-24Z8UT-J
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Shape: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Shape: UNSPECIFIED; No. of Functions: 1;
XB3-24Z8UM-J
The Digi International XB3-24Z8UM-J is a surface mount telecom IC with 34 terminals. Operating temperature range of -40 to 85°C, suitable for industrial applications. Package style is microelectronic assembly, making it ideal for telecom circuit interfaces.
XB3-24DMCM-J
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
XB3-24Z8PT
The Digi International XB3-24Z8PT is a telecom IC with 20 terminals in a MICROELECTRONIC ASSEMBLY package. It operates in temperatures ranging from -40°C to 85°C, making it suitable for industrial applications requiring reliable telecom circuit connections. The terminal form is THROUGH-HOLE, ideal for robust and secure installations.
XB3-24Z8ST
The Digi International XB3-24Z8ST is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. Its dual terminal position and microelectronic assembly style enhance its functionality in telecommunications systems.
XB3-24Z8UT
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
XB3-24Z8CM-J
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 34; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
XB3-24Z8UM
The Digi International XB3-24Z8UM is a surface mount telecom IC with 34 terminals. Operating temperature ranges from -40°C to 85°C, suitable for industrial applications. With a compact size of 13mm x 19mm, it's ideal for telecom circuit integration in various devices.
XB3-24Z8US-J
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 37; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N37;
XB3-24Z8RM-J
XB3-24AUM
The Digi International XB3-24AUM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in telecom interface ICs.
XB3-24DMUM-J
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XB3-24AUT-J
TELECOM CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Package Style (Meter): SPECIAL SHAPE;
XB3-24DMCM
XB3-24ARM-J
The Digi International XB3-24ARM-J is a TELECOM CIRCUIT IC with 1 Mbps data rate. Operating temperature range: -40 to 85°C. RECTANGULAR package shape for telecom interfaces, ideal for various telecommunications applications.
XB3-24ARM
The Digi International XB3-24ARM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40°C to 85°C, making it suitable for various telecom applications. The RECTANGULAR package style and SPECIAL SHAPE design enhance its performance in Other Function Telecom Interface ICs.
XB3-24Z8US
The Digi International XB3-24Z8US is a telecom IC with 37 terminals, suitable for industrial applications. It operates b/w -40°C to 85°C, making it ideal for harsh environments. This surface-mount IC comes in a rectangular package style and is designed for other telecom interface functions.
XB3-24APS
The Digi International XB3-24APS is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in Other Function Telecom Interface ICs.
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