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MRF24WG0MART-I/RM

Microchip Technology

MRF24WG0MART-I/RM by Microchip Technology

MRF24WG0MART-I/RM by Microchip offers TS 16949 screening, operates b/w -40 to 85 °C, and requires 3.3 V supply voltage. Ideal for telecom circuits, this IC has a rectangular package with 36 terminals and is suitable for industrial temperature-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,578 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Component Sense

UK . 30 parts In-Stock

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AZTECH Wire

Italy . 694 parts In-Stock

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Ampacity Inc.

Singapore . 181 parts In-Stock

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NIA Electronics

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Ledger Components

France . 6,274 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,057 parts In-Stock

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LMD Electronica

Estonia . 3,883 parts In-Stock

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Authorized Procurement Solutions

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Montano Global Distributors

Canada . 774 parts In-Stock

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Aranea Global

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Overview

Experience seamless connectivity with the MRF24WG0MART-I/RM by Microchip Technology. As a trusted manufacturer in the industry, Microchip Technology delivers top-quality products that exceed expectations. This telecom interface IC is versatile and reliable, making it perfect for a wide range of applications. With its industrial-grade temperature grade and nominal supply voltage of 3.3V, this product offers unparalleled value and benefits to customers. Stay connected effortlessly with the MRF24WG0MART-I/RM.

Feature Benefit Bullets

Screening Level: TS 16949

This high screening level ensures reliability and quality in automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs.

No. of Terminals: 36

With 36 terminals, this product provides ample connectivity options for telecom interfaces.

Package Style: MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style offers compact size and efficient performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy for improved reliability in communication systems.

Maximum Seated Height: 2.7 mm

The low seated height allows for space-saving integration in tight layouts.

Width: 21 mm

The compact width makes this product suitable for applications with limited space availability.

Length: 31 mm

The moderate length offers flexibility in mounting options for telecom interfaces.

Temperature Grade: INDUSTRIAL

This industrial-grade temperature rating ensures reliable performance in harsh industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failures in high vibration environments.

Telecom IC Type: TELECOM CIRCUIT

This telecom circuit type is optimized for efficient communication functions in telecommunication systems.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is widely compatible with standard power sources in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs MRF24WG0MART-I/RM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XDMA-N36

Length:

31 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

2.7 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

21 mm

Trade Compliance

MRF24WG0MART-I/RM Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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