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MRF24WG0MA-I/RM10C

Microchip Technology

MRF24WG0MA-I/RM10C by Microchip Technology

MRF24WG0MA-I/RM10C by Microchip: Telecom IC with 36 terminals, 3.3V supply voltage, -40 to 85°C operating temp range. Ideal for industrial telecom applications due to TS 16949 screening level and compact rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,914 parts In-Stock

1+ parts

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4,914

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 285 parts In-Stock

1+ parts

$19.859

100+ parts

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285

$19.859

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Ampacity Inc.

Singapore . 808 parts In-Stock

1+ parts

$203.000

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808

$203.000

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Fulton Briggs Corp.

USA . 4,913 parts In-Stock

1+ parts

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4,913

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Looking for a reliable and high-quality telecom interface IC? Look no further than the MRF24WG0MA-I/RM10C by Microchip Technology. With a screening level of TS 16949 and industrial temperature grade, this product offers unmatched performance and durability. Whether you're designing IoT devices, smart appliances, or wireless sensors, this Telecom Circuit IC delivers outstanding value and benefits to customers. Trust in Microchip Technology's expertise and choose the MRF24WG0MA-I/RM10C for all your connectivity needs.

Feature Benefit Bullets

Screening Level: TS 16949

This product is guaranteed to meet high automotive quality standards, making it reliable for telecom applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into telecom systems with limited space.

No. of Terminals: 36

With a high number of terminals, this product can support complex telecom interface requirements.

Package Style: MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures high precision and reliability in telecom operations.

Maximum Operating Temperature: 85 °C

This product can operate efficiently even in high-temperature environments, ensuring consistent performance in telecom applications.

Minimum Operating Temperature: -40 °C

The wide temperature range in which this product can operate makes it suitable for various telecom settings.

Terminal Position: DUAL

The dual terminal position provides redundancy and enhances the reliability of the product in telecom systems.

Maximum Seated Height: 2.7 mm

The low seated height allows for compact design and easy installation in tight telecom spaces.

Width: 21 mm

The 21mm width of this product enables it to be used in telecom setups with specific size constraints.

Length: 31 mm

The 31mm length of this product offers flexibility in placement and integration within telecom devices.

Temperature Grade: INDUSTRIAL

This product is designed to withstand harsh industrial environments, making it a durable choice for telecom applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of soldering issues and ensures a reliable connection in telecom systems.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product offers optimal performance and compatibility in telecom applications.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage requirement is common in telecom systems, making this product easy to integrate and power.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch provides precise spacing for connections, ensuring stable and efficient telecom operations.

Technical Specifications

Other Function Telecom Interface ICs MRF24WG0MA-I/RM10C attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XDMA-N36

Length:

31 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

2.7 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

21 mm

Trade Compliance

MRF24WG0MA-I/RM10C Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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