Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA8090EXGAJ
STMicroelectronics
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B169
9 mm
1
169
85 Cel
-40 Cel
PLASTIC/EPOXY
TFBGA
SQUARE
GRID ARRAY, THIN PROFILE, FINE PITCH
NOT SPECIFIED
AEC-Q100
1.2 mm
1.1 V
YES
CMOS
TELECOM CIRCUIT
INDUSTRIAL
BALL
.65 mm
BOTTOM
STA8090EXGATR
STA8090EXGA
e3
3
260
MATTE TIN
BGS18GA14E6327XTSA1
Infineon Technologies
BGS18GA14E6327XTSA1 by Infineon Technologies is a telecom interface IC with 14 terminals in a square package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits requiring a nominal voltage of 3V. With surface mount capability and compact dimensions of 2x2mm, it is ideal for microelectronic assembly applications.
S-XQMA-B14
2 mm
14
-30 Cel
UNSPECIFIED
MICROELECTRONIC ASSEMBLY
3 V
OTHER
BUTT
QUAD
BGS16GA14E6327XTSA1
BGS16GA14E6327XTSA1 by Infineon is a telecom interface IC with 14 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, suitable for telecom circuits with a nominal voltage of 3V. Its compact size of 2x2mm and 0.65mm height make it ideal for space-constrained applications.
S-PBCC-N14
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
NO LEAD
.4 mm
ADRF5045BCCZN-R7
Analog Devices
Analog Devices' ADRF5045BCCZN-R7 is a 24-terminal IC with -40 to 85°C operating temp, suitable for telecom circuits. It features a 3.3V nominal voltage, 0.5mm terminal pitch, and industrial temperature grade. The package style is grid array with heat sink/slug in a square shape, making it ideal for surface mount applications.
S-XBGA-B24
e4
4 mm
-3.3 V
24
HLGA
GRID ARRAY, HEAT SINK/SLUG
.96 mm
3.3 V
NICKEL PALLADIUM GOLD
.5 mm
30
ADRF5045BCCZN
Analog Devices' ADRF5045BCCZN is a 24-terminal SQUARE IC with -40 to 85 °C operating temp. Ideal for TELECOM CIRCUIT applications, it has a 3.3V supply voltage and nickel palladium gold finish. The GRID ARRAY package style with 0.5mm pitch makes it suitable for industrial use in telecom interfaces.
ADL5335ACPZN-R7
ADL5335ACPZN-R7 by Analog Devices is a telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 5V, it features nickel palladium gold terminal finish and very thin profile design for telecom applications.
S-XQCC-N16
16
.8 mm
5 V
ADL5335ACPZN
ADL5335ACPZN by Analog Devices is a 16-terminal telecom IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85 °C, suitable for telecom circuits with a nominal voltage of 5V. The chip carrier has a very thin profile, terminal pitch of 0.65mm, and peak reflow temperature of 260°C.
ADRF5044BCCZN-R7
Analog Devices' ADRF5044BCCZN-R7 is a 24-terminal SQUARE package IC with -40 to 85 °C operating temp. Ideal for TELECOM CIRCUIT applications, it has a 3.3 V nominal voltage and 0.5 mm terminal pitch. With NICKEL PALLADIUM GOLD finish, it suits INDUSTRIAL-grade telecom interfaces.
NL3HS644FCTAG
Onsemi
NL3HS644FCTAG by Onsemi is a 36-terminal, telecom interface IC with a nominal voltage of 3.3V. It features a grid array package style with very thin profile and fine pitch, suitable for telecom circuit applications. The package body material is plastic/epoxy, making it surface mountable with a terminal pitch of 0.4mm and max seated height of 0.54mm.
S-PBGA-B36
2.34 mm
36
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.54 mm
LMX8410RGZR
Texas Instruments
LMX8410RGZR by Texas Instruments is a 48-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, surface mount compatibility, and nickel palladium gold silver terminal finish. Ideal for industrial telecom circuit applications requiring compact design and high-temperature resilience.
S-PQCC-N48
7 mm
48
1 mm
NICKEL PALLADIUM GOLD SILVER
LMX8410RGZT
LMX8410RGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include 3.3V supply voltage, surface mountable, and terminal finish of nickel palladium gold silver.
PI3EQX1001XUAEX
Diodes Incorporated
Diodes Inc. PI3EQX1001XUAEX is a 3.3V telecom IC with 18 terminals in a square chip carrier package. Operating from 0 to 70°C, it has a very thin profile of 0.4mm and quad terminal position, suitable for telecom circuit applications.
S-XQCC-N18
18
70 Cel
0 Cel
COMMERCIAL
AX5031-1-TA05
The Onsemi AX5031-1-TA05 is a CMOS telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 3V, it is ideal for telecom circuit applications requiring a very thin profile design.
S-XQCC-N20
20
LCC20,.16SQ,20
TIN
HMC773ALC3BTR-R5
Analog Devices' HMC773ALC3BTR-R5 is a telecom IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. With a very thin profile and no-lead terminal form, it's ideal for telecom interface applications.
S-XQCC-N12
2.9 mm
12
.9 mm
BGS110MN20E6327XTSA1
BGS110MN20E6327XTSA1 by Infineon is a 20-terminal telecom IC with a nominal voltage of 3.5V. It operates b/w -30°C to 85°C, in a square chip carrier package style. With terminals at the bottom and 0.4mm pitch, it's ideal for telecom interface applications.
S-XBCC-B20
2.3 mm
BCC
CHIP CARRIER
.77 mm
3.5 V
HMC641ALP4ETR
HMC641ALP4ETR by Analog Devices is a telecom interface IC with 24 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal negative supply voltage of -3V and terminal pitch of 0.5mm, it is ideal for telecom circuit designs requiring compact and high-performance solutions.
S-XQCC-N24
-3 V
.95 mm
LMS7002M
Lime Microsystems
Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.
S-PBGA-B261
11.5 mm
261
BGA
GRID ARRAY
1.2 V
HMC745LC3TR-R5
Analog Devices' HMC745LC3TR-R5 is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm, ideal for telecom circuit applications.
S-CQCC-N16
CERAMIC, METAL-SEALED COFIRED
AX5243-1-TA05
AX5243-1-TA05 by Onsemi is a telecom IC with CMOS technology, operating b/w -40 to 85°C. It features 20 terminals in a square chip carrier package style, suitable for telecom circuit applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in industrial temperature grades.
AX5243-1-TW30
AX5243-1-TW30 by Onsemi is a CMOS telecom IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features include 3V supply voltage, matte tin finish, and quad terminal position for telecom interface functions.
ADAR1000ACCZN-R7
ADAR1000ACCZN-R7 by Analog Devices is a telecom IC with 88 terminals, operating temp range of -40 to 85°C. It has a nominal voltage of 3.3V and negative supply voltage of -5V. Ideal for telecom circuits, this IC comes in a square package style with surface mount feature.
S-PBGA-B88
-5 V
88
ADAR1000ACCZN
ADAR1000ACCZN by Analog Devices is a telecom IC with 88 terminals in a grid array package. It operates b/w -40°C to 85°C, with a nominal voltage of 3.3V and negative supply voltage of -5V. This IC is designed for telecom circuits requiring precise temperature control and industrial-grade performance.
ADRV9009BBCZ
Analog Devices ADRV9009BBCZ is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a fine pitch terminal style and tin silver copper finish.
S-PBGA-B196
e1
12 mm
196
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.27 mm
1.3 V
TIN SILVER COPPER
AX5042-1-TA05
The Onsemi AX5042-1-TA05 is a Telecom Interface IC with 28 terminals in a square chip carrier package. It operates b/w -40 °C to 85°C, suitable for industrial applications. This CMOS technology IC has a nominal voltage of 2.5V and terminal finish of Ni/Pd/Au, making it ideal for telecom circuits.
S-XQCC-N28
5 mm
28
2.5 V
Nickel/Palladium/Gold (Ni/Pd/Au)
ADRV9008BBCZ-1
ADRV9008BBCZ-1 by Analog Devices is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom applications requiring precise signal processing and connectivity in industrial environments.
ADRV9008BBCZ-2
Analog Devices' ADRV9008BBCZ-2 is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a bottom terminal position and plastic/epoxy body material.
TC35680FSG-002(ELG
Toshiba
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
S-XQCC-N40
40
LCC40,.2SQ,16
VSC8490YJU-17
Microchip Technology
VSC8490YJU-17 by Microchip Technology is a telecom IC with 196 terminals in a low-profile grid array package. It operates b/w -40 to 110°C, supporting data rates up to 10 Gbps. Ideal for industrial applications requiring high-speed telecom circuitry in compact form factors.
10000 Mbps
15 mm
110 Cel
LBGA
BGA196,14X14,40
GRID ARRAY, LOW PROFILE
1.4 mm
1 V
VSC8491YJU-17
Microchip Technology's VSC8491YJU-17 is a telecom IC with data rate of 10 Gbps. It operates in industrial temperature range (-40 to 110°C) and has 196 terminals in a low profile grid array package. Ideal for telecom applications requiring high-speed data transmission.
ADF5902WCCPZ
Analog Devices ADF5902WCCPZ is a telecom IC with 32 terminals, operating at -40 to 105 °C. It has a supply voltage of 3.3V and terminal pitch of 0.5mm, suitable for industrial applications requiring AEC-Q100 screening and surface mount compatibility. The chip carrier package style with very thin profile makes it ideal for compact designs in telecommunications interfaces.
S-XQCC-N32
32
105 Cel
MWCT1013VLHSTR
NXP Semiconductors
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G64
10 mm
64
LFQFP
QFP64,.47SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
1.6 mm
GULL WING
MWCT1013VLHST
PN5120A0ET/C2,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B64
5.5 mm
1.15 mm
PT5010A0HN/C1,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;
S-PQCC-N32
VQCCN
CHIP CARRIER, VERY THIN PROFILE
TEF6657HN/V101,518
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;
QCCN
AFE7700IABJ
AFE7700IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for industrial telecom circuits, it features fine pitch (0.8mm) ball terminals and moisture sensitivity level of MSL3.
RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000
S-PBGA-B400
17 mm
400
FBGA
GRID ARRAY, FINE PITCH
2.65 mm
ADRV9026BBCZ-REEL
Analog Devices' ADRV9026BBCZ-REEL is a telecom IC with 4 functions, operating b/w -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and peak reflow temperature of 260°C.
ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE
S-PBGA-B289
14 mm
4
289
BGA289,17X17,32
1.46 mm
ADRV9026BBCZ
Analog Devices ADRV9026BBCZ is a telecom IC with 4 functions, operating at -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and terminal pitch of 0.8mm.
WFM200SS22XNA2
Silicon Labs
Silicon Labs' WFM200SS22XNA2 is a Telecom IC with 52 terminals in a square grid array package. Operating from -40 to 105°C, it supports data rates up to 72.2 Mbps. Ideal for telecom applications requiring a compact design and low power consumption.
72.2 Mbps
S-XLGA-N52
6.5 mm
52
LGA
LGA52(UNSPEC)
1.8 V
PM5440B-FEI
PM5440B-FEI by Microchip Technology is a grid array package with 1894 terminals. It is a telecom circuit IC designed for telecom interface applications. The package body material is plastic/epoxy, and it features surface mount technology with bottom terminal position in a square shape.
S-PBGA-B1894
1894
PM5980B-FEI
PM5980B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals. It is a TELECOM CIRCUIT IC for telecom applications, featuring PLASTIC/EPOXY material and BOTTOM terminal position. Suitable for surface mount assembly, it offers high functionality in a compact SQUARE package shape.
S-PBGA-B1932
1932
PM5981B-FEI
PM5981B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals in PLASTIC/EPOXY material. It is a TELECOM CIRCUIT IC designed for telecom interfaces, featuring surface mount capability and ball-shaped bottom terminals.
PM5990B-FEI
PM5990B-FEI by Microchip Technology is a GRID ARRAY IC with 1932 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.
PM5991B-FEI
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
ST25RU3992-BQFT
ST25RU3992-BQFT by STMicroelectronics is a 64-terminal telecom IC in a square package. It is surface-mountable and designed for telecom circuit applications, offering quad terminal positioning without leads.
Operates from 4.1V to 5.5V Supply
S-XQCC-N64
LCC64(UNSPEC)
AX5042-1-TW30
AX5042-1-TW30 by Onsemi is a telecom IC with CMOS technology, operating at -40 to 85 °C. It has 28 terminals in a square chip carrier package style, with Ni/Pd/Au terminal finish. This IC supports data rates up to 0.25 Mbps and is ideal for telecom circuit applications.
.25 Mbps
LCC28,.2SQ,20
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