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NO LEAD Cellphone ICs 238

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
BGA7210X by NXP Semiconductors

BGA7210X

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.85 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGA7350,115 by NXP Semiconductors

BGA7350,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

5 mm

BGA7350,515 by NXP Semiconductors

BGA7350,515

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGU7060Y by NXP Semiconductors

BGU7060Y

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7061,518 by NXP Semiconductors

BGU7061,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7062,518 by NXP Semiconductors

BGU7062,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,115 by NXP Semiconductors

BGU7063,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,518 by NXP Semiconductors

BGU7063,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

30

8 mm

CC1150RGVT by Texas Instruments

CC1150RGVT

Texas Instruments

The Texas Instruments CC1150RGVT is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and data rate of 0.5 Mbps. This surface-mount IC has 16 terminals in a square shape, ideal for industrial applications requiring compact design and high performance.

.5 Mbps

S-PQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.65 mm

QUAD

30

4 mm

CC1021RSST by Texas Instruments

CC1021RSST

Texas Instruments

The Texas Instruments CC1021RSST is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a data rate of 0.1536 Mbps, making it ideal for telecommunications applications.

.1536 Mbps

S-PQCC-N32

e4

7 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.65 mm

QUAD

30

7 mm

SKY13524-639LF by Skyworks Solutions

SKY13524-639LF

Skyworks Solutions

SKY13524-639LF by Skyworks Solutions is a cellphone IC with 14 terminals in a square package style. Operating b/w -30°C to 90°C, it's ideal for RF and baseband circuits at 3.3V supply voltage. With a compact size of 1.6mm x 1.6mm and terminal pitch of 0.4mm, it's suitable for telecom applications requiring surface mount technology.

S-XQCC-N14

1.6 mm

1

14

90 Cel

-30 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.5 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

1.6 mm

HMC832ALP6GETR by Analog Devices

HMC832ALP6GETR

Analog Devices

Analog Devices' HMC832ALP6GETR is a cellphone IC with 40 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications. It features RF and baseband circuits, operates at 3.3V, and has a compact size of 6x6mm with a terminal pitch of 0.5mm.

S-XQCC-N40

e3

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

30

6 mm

HMC832ALP6GE by Analog Devices

HMC832ALP6GE

Analog Devices

Analog Devices' HMC832ALP6GE is a 40-terminal cellphone IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has a nominal voltage of 3.3V and terminal pitch of 0.5mm, making it ideal for compact designs requiring high performance.

S-XQCC-N40

e3

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

30

6 mm

RFX2411 by Skyworks Solutions

RFX2411

Skyworks Solutions

RFX2411 by Skyworks Solutions is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 125°C, suitable for automotive use. This RF and baseband circuit has a nominal voltage of 3.3V, utilizing CMOS technology for high performance in telecom applications.

S-XQCC-N16

3 mm

1

16

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

3 mm

RFX5000B by Skyworks Solutions

RFX5000B

Skyworks Solutions

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N16

3 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SKY65364-21 by Skyworks Solutions

SKY65364-21

Skyworks Solutions

SKY65364-21 by Skyworks Solutions is a cellphone IC with 28 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications, with a nominal voltage of 3.3V. This surface mount IC in square package style is ideal for industrial use due to its compact size and quad terminal position.

S-XQMA-N28

6 mm

1

28

85 Cel

-40 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

NOT SPECIFIED

6 mm

ST25R3912-AQFT by STMicroelectronics

ST25R3912-AQFT

STMicroelectronics

ST25R3912-AQFT by STMicroelectronics is a compact RF and baseband circuit IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 3.3V supply, and comes in a very thin profile with 32 terminals. Ideal for cellphone integration, it ensures reliable performance in demanding environments.

S-XQCC-N32

5 mm

1

32

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

HPA00420RGVR by Texas Instruments

HPA00420RGVR

Texas Instruments

Texas Instruments' HPA00420RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With nickel palladium gold finish, it offers a nominal voltage of 3V and terminal pitch of 0.65mm.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA01083RGVR by Texas Instruments

HPA01083RGVR

Texas Instruments

Texas Instruments' HPA01083RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With a compact size of 4x4mm and no-lead terminal form, it suits industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA02142RGVR by Texas Instruments

HPA02142RGVR

Texas Instruments

Texas Instruments' HPA02142RGVR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it has a supply voltage of 3V and max current of 4mA. Ideal for RF and baseband circuits, this IC is surface mountable with nickel palladium gold finish.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

4 mA

3 V

YES

RF AND BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA00452RSTR by Texas Instruments

HPA00452RSTR

Texas Instruments

Texas Instruments' HPA00452RSTR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it features RF and baseband circuit technology, NO LEAD terminal form, and 3V supply voltage. Ideal for telecom applications requiring a compact design with high performance.

S-PQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.95 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

J-N3-B3E6-LR by Telit Communications Plc

J-N3-B3E6-LR

Telit Communications Plc

Telit Communications Plc's J-N3-B3E6-LR is a cellphone IC with 24 terminals, operating temp. range of -40 to 85°C. It features RF and baseband circuits, suitable for telecom applications. The small outline package measures 12.2mm x 16mm with a seated height of 2.4mm, making it ideal for compact devices.

R-PDSO-N24

16 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

SON

RECTANGULAR

SMALL OUTLINE

2.4 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

12.2 mm

ADC31RF80IRMPT by Texas Instruments

ADC31RF80IRMPT

Texas Instruments

Texas Instruments' ADC31RF80IRMPT is a 72-terminal cellphone IC with a square package shape and nickel palladium gold finish. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits in telecom applications. With a low profile of 0.9mm, it features a supply current of 1439mA at 1.15V nominal voltage.

S-XQCC-N72

e4

10 mm

3

1

72

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1439 mA

1.15 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

10 mm

ADC31RF80IRMP by Texas Instruments

ADC31RF80IRMP

Texas Instruments

Texas Instruments' ADC31RF80IRMP is a cellphone IC with 72 terminals in a square chip carrier package. Operating from -40 to 85°C, it features RF and baseband circuits, 1.15V supply voltage, and 1439mA max current draw. Ideal for telecom applications due to its compact size and industrial temperature grade suitability.

S-XQCC-N72

e4

10 mm

3

1

72

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1439 mA

1.15 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

10 mm

ST25R3913-AQFT by STMicroelectronics

ST25R3913-AQFT

STMicroelectronics

ST25R3913-AQFT from STMicroelectronics is a compact RF and baseband circuit IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 3.3V supply, and comes in a very thin profile with 32 terminals. Ideal for cellphone integration, it ensures reliable performance in demanding environments.

S-XQCC-N32

5 mm

1

32

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

ADRF5545ABCPZN by Analog Devices

ADRF5545ABCPZN

Analog Devices

Analog Devices' ADRF5545ABCPZN is a 40-terminal cellphone IC with a square package shape and nickel palladium gold finish. It operates b/w -40 to 105 °C, suitable for industrial telecom applications requiring RF and baseband circuit integration. The chip carrier has a very thin profile, measures 6x6 mm, and supports a nominal voltage of 5V.

S-XQCC-N40

e4

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

LARA-R202-02B by U-blox Ag

LARA-R202-02B

U-blox Ag

LARA-R202-02B by U-blox Ag is a Cellphone IC with TS 16949 screening. Features RF and baseband circuit for telecom, operates at -20 to 65°C, and requires 3.8V supply voltage. Ideal for compact devices due to its small size of 24x26mm and low seated height of 2.87mm.

-40 to 85 extended operating temp available

R-XLGA-N100

26 mm

4

1

100

65 Cel

-20 Cel

UNSPECIFIED

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

245

TS 16949

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24 mm

ADRF5549BCPZN by Analog Devices

ADRF5549BCPZN

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

6 mm

ADRF5547BCPZN by Analog Devices

ADRF5547BCPZN

Analog Devices

Analog Devices' ADRF5547BCPZN is a 40-terminal cellphone IC with a square surface mount package. It operates b/w -40 to 105°C, ideal for industrial telecom applications. With a nominal voltage of 5V and RF front end circuit type, it offers high performance in a compact chip carrier package.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

6 mm

S2-LPTXQTR by STMicroelectronics

S2-LPTXQTR

STMicroelectronics

STMicroelectronics S2-LPTXQTR is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C. It features RF and baseband circuits, suitable for telecom applications with a nominal voltage of 3V.

S-XQCC-N24

4 mm

1

24

105 Cel

-40 Cel

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

LX5584BLQ-TR by Microchip Technology

LX5584BLQ-TR

Microchip Technology

LX5584BLQ-TR by Microchip Technology is a Cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for cellphone applications.

S-XQCC-N16

3 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.023 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

3 mm

ADRF6650ACPZ-RL7 by Analog Devices

ADRF6650ACPZ-RL7

Analog Devices

Analog Devices' ADRF6650ACPZ-RL7 is a 56-terminal cellphone IC with BICMOS technology, operating from -40 to 105 °C. It features RF and baseband circuits, suitable for telecom applications. The chip carrier package has a very thin profile, measuring 8mm x 8mm in size.

S-XQCC-N56

8 mm

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

ADRF6650ACPZ by Analog Devices

ADRF6650ACPZ

Analog Devices

Analog Devices' ADRF6650ACPZ is a 56-terminal cellphone IC in a square chip carrier package. Operating from -40 to 105°C, it's ideal for RF and baseband circuits with a nominal voltage of 3.3V. Utilizing BiCMOS technology, this industrial-grade IC has a very thin profile at 0.8mm seated height.

S-XQCC-N56

8 mm

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

WLAN7102CZ by NXP Semiconductors

WLAN7102CZ

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .7 mm;

S-PQCC-N16

2 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.07SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.7 mm

214 mA

3.85 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.4 mm

QUAD

2 mm

CC1260RGZR by Texas Instruments

CC1260RGZR

Texas Instruments

CC1260RGZR by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

CC1260RGZT by Texas Instruments

CC1260RGZT

Texas Instruments

CC1260RGZT by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

EG91EXGA-128-SGNS by Quectel Wireless Solutions

EG91EXGA-128-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' EG91EXGA-128-SGNS is a Cellphone IC with 102 terminals, operating temp. range of -35 to 75°C, and 3.8V supply voltage. It integrates RF and baseband circuits for telecom applications in a compact rectangular package measuring 25mm x 29mm with a seated height of 2.3mm, suitable for surface mount assembly.

Also has Extended temp from -40 Deg c to 85 Deg c

R-XXMA-N102

29 mm

1

102

75 Cel

-35 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.3 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

UNSPECIFIED

25 mm

NRF9160-SIBA-B1A-R7 by Nordic Semiconductor Asa

NRF9160-SIBA-B1A-R7

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-B1A-R7 is a CELL IC with RF & baseband circuit. It operates in industrial temp range (-40 to 85°C) with 3.8V supply voltage. This surface-mountable chip has 127 terminals, rectangular shape, and grid array package suitable for cellphone applications.

R-XBGA-N127

16 mm

1

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

NRF9160-SIBA-B1A-R by Nordic Semiconductor Asa

NRF9160-SIBA-B1A-R

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-B1A-R is a CELL IC with RF & BASEBAND CIRCUIT for telecom. It operates in -40 to 85°C, has 127 terminals in GRID ARRAY package style, and requires 3.8V supply voltage. Ideal for cellphone applications due to its compact RECTANGULAR shape and 0.5mm terminal pitch.

R-XBGA-N127

16 mm

1

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

M95FA-03-STD by Quectel Wireless Solutions

M95FA-03-STD

Quectel Wireless Solutions

M95FA-03-STD by Quectel Wireless Solutions is a cellphone IC with 42 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications. This surface-mount IC has a rectangular package style, measuring 19.9mm in width and 23.6mm in length, making it suitable for compact electronic devices.

R-XQMA-N42

23.6 mm

1

42

85 Cel

-40 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.65 mm

4 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

19.9 mm

ACPM-7788-TR1 by Broadcom

ACPM-7788-TR1

Broadcom

RF FRONT END CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 42; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-XQCC-N42;

R-XQCC-N42

7 mm

1

42

RECTANGULAR

.9 mm

YES

RF FRONT END CIRCUIT

NO LEAD

QUAD

5 mm

EG25GGC-128-SGNS by Quectel Wireless Solutions

EG25GGC-128-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' EG25GGC-128-SGNS is a compact CELL IC with RF & baseband circuit. Operating temp range -35 to 75°C, it has a low profile of 4.9mm making it ideal for space-constrained applications like IoT devices and mobile communication systems. Package style: Microelectronic Assembly, Terminal position: Single.

also available Extended Temperature Range -40 to 80 degree Celsius

R-XSMA-N

51 mm

1

75 Cel

-35 Cel

UNSPECIFIED

SMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

4.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

SINGLE

30 mm

BC66NB-04-STD by Quectel Wireless Solutions

BC66NB-04-STD

Quectel Wireless Solutions

Quectel Wireless Solutions BC66NB-04-STD is a CELL IC with 58 terminals, operating temp -35 to 75°C. Telecom IC for RF and baseband circuits, package style MICROELECTRONIC ASSEMBLY. Ideal for compact applications requiring low power consumption.

EXTENDED TEMP AVAILABLE WITH -40 TO 85

R-XQMA-N58

17.7 mm

1

58

75 Cel

-35 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

15.8 mm

A7682E by Simcom Wireless Solutions

A7682E

Simcom Wireless Solutions

A7682E by Simcom Wireless Solutions is a Cellphone IC with 85 terminals in a square package. It operates b/w -40°C to 85°C, with a seated height of 2.4mm and nominal voltage of 3.8V. This RF and baseband circuit is ideal for mobile communication devices due to its compact size and temperature range suitability.

S-XXMA-N85

19.6 mm

1

85

85 Cel

-40 Cel

UNSPECIFIED

XMA

SQUARE

MICROELECTRONIC ASSEMBLY

2.4 mm

3.8 V

NO

RF AND BASEBAND CIRCUIT

NO LEAD

UNSPECIFIED

19.6 mm

BG95M1LA-64-SGNS by Quectel Wireless Solutions

BG95M1LA-64-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' BG95M1LA-64-SGNS, a CELL IC with 102 terminals in MICROELECTRONIC ASSEMBLY, operates b/w -35°C to 75°C. This RF and BASEBAND CIRCUIT has a nominal voltage of 3.3V, ideal for compact cellphone designs due to its small dimensions of 19.9mm width and 23.6mm length.

EXTENDED TEMP AVAILABLE WITH -40 TO 85

R-XQMA-N102

23.6 mm

1

102

75 Cel

-35 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.2 mm

3.3 V

NO

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

19.9 mm

TOBY-L210-03S-03 by U-blox Ag

TOBY-L210-03S-03

U-blox Ag

TOBY-L210-03S-03 by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits for telecom applications. With a compact size of 24.8mm x 35.6mm and low seated height of 2.87mm, it's ideal for mobile device designs.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm