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NO LEAD Cellphone ICs 238

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
MAX9985ETX by Maxim Integrated

MAX9985ETX

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e0

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

ADF7021BCPZ-RL7 by Analog Devices

ADF7021BCPZ-RL7

Analog Devices

Analog Devices' ADF7021BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for baseband circuits in telecom applications due to its compact square package shape and low profile design.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

ADL5387ACPZ-WP by Analog Devices

ADL5387ACPZ-WP

Analog Devices

ADL5387ACPZ-WP by Analog Devices is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, square package shape, and quad terminal position. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

BIPOLAR

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

CC1101RTKR by Texas Instruments

CC1101RTKR

Texas Instruments

CC1101RTKR by Texas Instruments is a cellphone IC with power supplies of 1.8/3.6V, operating temperature range of -40 to 85°C, and RF & baseband circuit type. Its package style is chip carrier with very thin profile, suitable for industrial telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3 MSL.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

CC1101RTK by Texas Instruments

CC1101RTK

Texas Instruments

CC1101RTK by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a package style of chip carrier. Ideal for industrial applications requiring RF communication in compact form factors.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TRF3710IRGZT by Texas Instruments

TRF3710IRGZT

Texas Instruments

TRF3710IRGZT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

ADF7020-1BCPZ-RL by Analog Devices

ADF7020-1BCPZ-RL

Analog Devices

Analog Devices' ADF7020-1BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 3V, RF and baseband circuitry, and a compact square package suitable for telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

CC1110F16RSP by Texas Instruments

CC1110F16RSP

Texas Instruments

The Texas Instruments CC1110F16RSP is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial applications.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F32RSPR by Texas Instruments

CC1110F32RSPR

Texas Instruments

The Texas Instruments CC1110F32RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit make it ideal for industrial telecom applications. With a low profile of 0.9mm and terminal pitch of 0.5mm, it offers high performance in compact designs.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F32RSP by Texas Instruments

CC1110F32RSP

Texas Instruments

CC1110F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F8RSPR by Texas Instruments

CC1110F8RSPR

Texas Instruments

The Texas Instruments CC1110F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit for telecom applications. Nominal voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3 make it ideal for industrial use.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F8RSP by Texas Instruments

CC1110F8RSP

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

MAX2029ETP-T by Maxim Integrated

MAX2029ETP-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.65 mm

QUAD

5 mm

MAX2029ETP by Maxim Integrated

MAX2029ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

5 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

AD6655ABCPZ-150 by Analog Devices

AD6655ABCPZ-150

Analog Devices

AD6655ABCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V and max current of 0.805mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.805 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZ-80 by Analog Devices

AD6655ABCPZ-80

Analog Devices

AD6655ABCPZ-80 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and low supply current of 0.42mA. Ideal for baseband circuits, this square chip carrier package is surface mountable with a terminal pitch of 0.5mm.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.42 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZRL7-125 by Analog Devices

AD6655ABCPZRL7-125

Analog Devices

AD6655ABCPZRL7-125 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and max current of 0.705mA. This BASEBAND CIRCUIT IC comes in a square chip carrier package with matte tin finish, suitable for industrial applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.705 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZRL7-150 by Analog Devices

AD6655ABCPZRL7-150

Analog Devices

AD6655ABCPZRL7-150 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and consumes 0.805mA current. This BASEBAND CIRCUIT IC comes in a SQUARE package style, suitable for telecom applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.805 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

Matte Tin (Sn)

NO LEAD

.5 mm

QUAD

30

9 mm

MAX2392ETI by Maxim Integrated

MAX2392ETI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

e0

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.04 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

MAX2396EGI by Maxim Integrated

MAX2396EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

e0

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.038 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

MAX2401ETI by Maxim Integrated

MAX2401ETI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.043 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

ALM-1522-BLKG by Broadcom

ALM-1522-BLKG

Broadcom

BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 22; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2; Nominal Supply Voltage: 5 V;

R-XQMA-N22

2

1

22

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

Not Qualified

5 V

YES

BASEBAND CIRCUIT

NO LEAD

QUAD

SI4710-B30-GMR by Silicon Labs

SI4710-B30-GMR

Silicon Labs

SI4710-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating temp range -20 to 85°C, CMOS tech, and 3.3V supply voltage make it ideal for RF and baseband circuits in telecom applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4710-B30-GM by Silicon Labs

SI4710-B30-GM

Silicon Labs

SI4710-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20 to 85°C, ideal for RF and baseband circuits. With CMOS technology and 3.3V supply voltage, it's perfect for compact telecom applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GMR by Silicon Labs

SI4711-B30-GMR

Silicon Labs

SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GM by Silicon Labs

SI4711-B30-GM

Silicon Labs

SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4712-B30-GMR by Silicon Labs

SI4712-B30-GMR

Silicon Labs

SI4712-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, utilizing CMOS technology and requiring 3.3V supply voltage. This RF and baseband circuit is ideal for compact mobile devices due to its very thin profile and small dimensions of 3mm x 3mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GMR by Silicon Labs

SI4713-B30-GMR

Silicon Labs

SI4713-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this CMOS technology IC has a compact size of 3x3mm and terminal pitch of 0.5mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GM by Silicon Labs

SI4713-B30-GM

Silicon Labs

SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SKY73420-11 by Skyworks Solutions

SKY73420-11

Skyworks Solutions

SKY73420-11 by Skyworks Solutions is a 36-terminal cellphone IC with a square package shape and 0.9mm seated height. It features RF and baseband circuit for telecom applications, operates at 5V supply voltage, and has a terminal pitch of 0.5mm. Ideal for compact devices requiring high-performance RF capabilities.

S-XQCC-N36

6 mm

1

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.9 mm

5 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

SX8652IWLTRT by Semtech

SX8652IWLTRT

Semtech

Semtech's SX8652IWLTRT is a Cellphone IC with 14 terminals, operating temp. range of -40 to 85°C, and 1.8V supply voltage. It features a small outline package suitable for baseband circuits in telecom applications.

R-PDSO-N14

e3

4 mm

2

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.8 mm

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

DUAL

3 mm

CC2591RGVRG4 by Texas Instruments

CC2591RGVRG4

Texas Instruments

CC2591RGVRG4 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. This RF front end circuit has a max supply current of 4mA, making it ideal for industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC2591RGVTG4 by Texas Instruments

CC2591RGVTG4

Texas Instruments

RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

ADF4360-9BCPZRL by Analog Devices

ADF4360-9BCPZRL

Analog Devices

Analog Devices' ADF4360-9BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, matte tin finish, and industrial temperature grade. Ideal for baseband circuits in telecom applications due to its compact size (4x4mm) and low profile (1mm).

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-9BCPZ by Analog Devices

ADF4360-9BCPZ

Analog Devices

Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

AD8366ACPZ-R7 by Analog Devices

AD8366ACPZ-R7

Analog Devices

AD8366ACPZ-R7 by Analog Devices is a Cellphone IC with 2 functions, operating at -40 to 85 °C. It features a square package style, 32 terminals, and matte tin finish. Ideal for telecom applications as a baseband circuit with a nominal voltage of 5V.

S-XQCC-N32

e3

5 mm

3

2

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

MAX2306EGI by Maxim Integrated

MAX2306EGI

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

240

3/3.3

Not Qualified

.9 mm

Other Telecom ICs

.0415 mA

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

20

5 mm

MAX2902EGI by Maxim Integrated

MAX2902EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2904EGI by Maxim Integrated

MAX2904EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2361EGM by Maxim Integrated

MAX2361EGM

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N48

e0

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

Not Qualified

1 mm

Other Telecom ICs

.09 mA

2.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

7 mm

MAX2620E/D by Maxim Integrated

MAX2620E/D

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1;

X-XUUC-N

e0

1

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

240

Not Qualified

3 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

UPPER

20

MAX9982ETP by Maxim Integrated

MAX9982ETP

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX9989ETP by Maxim Integrated

MAX9989ETP

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX1958ETP by Maxim Integrated

MAX1958ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

3.6 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX1959ETP by Maxim Integrated

MAX1959ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

3.6 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX2046ETJ-T by Maxim Integrated

MAX2046ETJ-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e0

5 mm

1

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2010ETI-T by Maxim Integrated

MAX2010ETI-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5

Not Qualified

.8 mm

Other Telecom ICs

.0121 mA

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

ADF4360-7BCPZRL by Analog Devices

ADF4360-7BCPZRL

Analog Devices

Analog Devices' ADF4360-7BCPZRL is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm