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RF AND BASEBAND CIRCUIT Cellphone ICs 282

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SKY73083-21 by Skyworks Solutions

SKY73083-21

Skyworks Solutions

SKY73083-21 by Skyworks Solutions is a Cellphone IC with BICMOS technology. It features 36 terminals in a square chip carrier package, suitable for RF and baseband circuits. Operating temperature ranges from -40 to 85°C, making it ideal for industrial telecom applications.

S-XQCC-N36

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

Not Qualified

1.15 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

TRF3702IRHCG4 by Texas Instruments

TRF3702IRHCG4

Texas Instruments

TRF3702IRHCG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square chip carrier package suitable for surface mounting.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,32

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.17 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.8 mm

QUAD

30

4 mm

ADF7020-1BCPZ by Analog Devices

ADF7020-1BCPZ

Analog Devices

Analog Devices' ADF7020-1BCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuits for telecom applications, and a compact square package suitable for surface mounting in industrial settings.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

ADRF5545ABCPZN-RL by Analog Devices

ADRF5545ABCPZN-RL

Analog Devices

Analog Devices' ADRF5545ABCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105 °C, suitable for industrial telecom applications. With RF and baseband circuits, it has a nominal voltage of 5V and terminal pitch of 0.5mm.

S-XQCC-N40

e4

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

LARA-R211-02B by U-blox Ag

LARA-R211-02B

U-blox Ag

LARA-R211-02B by U-blox Ag is a Cellphone IC with TS 16949 screening. It features RF and baseband circuit, operates at -20 to 65 °C, and requires 3.8V supply voltage. This rectangular GRID ARRAY package is ideal for mobile communication applications.

-40 to 85 extended operating temp available

R-XLGA-N100

26 mm

4

1

100

65 Cel

-20 Cel

UNSPECIFIED

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

TS 16949

2.87 mm

300 mA

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24 mm

LISA-U200-03S by U-blox Ag

LISA-U200-03S

U-blox Ag

LISA-U200-03S by U-blox Ag is a surface mount Cellphone IC with 76 terminals in a rectangular package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits with a nominal voltage of 3.8V. Its compact size of 22.4mm width and 33.2mm length makes it ideal for mobile communication devices.

R-XQMA-N76

33.2 mm

1

76

85 Cel

-40 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

1.1 mm

QUAD

22.4 mm

ADRF5549BCPZN-R7 by Analog Devices

ADRF5549BCPZN-R7

Analog Devices

Analog Devices' ADRF5549BCPZN-R7 is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

ADRF5549BCPZN-RL by Analog Devices

ADRF5549BCPZN-RL

Analog Devices

Analog Devices' ADRF5549BCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

AFE7921IABJ by Texas Instruments

AFE7921IABJ

Texas Instruments

AFE7921IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a compact size of 17x17 mm and is surface mountable.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

AFE7988IABJ by Texas Instruments

AFE7988IABJ

Texas Instruments

AFE7988IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit IC has a fine pitch of 0.8mm, making it ideal for telecom applications.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

AFE7989IABJ by Texas Instruments

AFE7989IABJ

Texas Instruments

AFE7989IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C and features RF AND BASEBAND CIRCUIT for telecom applications. The package is made of PLASTIC/EPOXY, measures 17x17 mm, and has a terminal pitch of 0.8 mm.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

A3I25X050GNR1 by NXP Semiconductors

A3I25X050GNR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

e3

3

260

RF AND BASEBAND CIRCUIT

TIN

40

TOBY-L210-03S by U-blox Ag

TOBY-L210-03S

U-blox Ag

TOBY-L210-03S by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits at 3.8V supply voltage. Ideal for compact mobile devices due to its small dimensions of 24.8mm width and 35.6mm length.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

4

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm

TOBY-L210-65S by U-blox Ag

TOBY-L210-65S

U-blox Ag

TOBY-L210-65S by U-blox Ag is a surface mount Cellphone IC with 1 function. It has 152 terminals and a rectangular package shape. With a max operating temperature of 65°C, it is suitable for RF and baseband circuit applications.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

4

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm

TOBY-L280-03S by U-blox Ag

TOBY-L280-03S

U-blox Ag

TOBY-L280-03S by U-blox Ag is a CELLPHONE IC with 152 terminals in GRID ARRAY package. It operates b/w -20°C to 65°C, ideal for RF and baseband circuits. With a compact size of 24.8mm x 35.6mm x 2.87mm, it's suitable for mobile communication devices.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

4

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm

MAX4003EUA/GH9-T by Maxim Integrated

MAX4003EUA/GH9-T

Maxim Integrated

MAX4003EUA/GH9-T by Maxim Integrated is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

S-PDSO-G8

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

3 mm

SKY78215-11 by Skyworks Solutions

SKY78215-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT

ADRF6658BCPZ-RL7 by Analog Devices

ADRF6658BCPZ-RL7

Analog Devices

Analog Devices' ADRF6658BCPZ-RL7 is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

ADRF6658BCPZ by Analog Devices

ADRF6658BCPZ

Analog Devices

Analog Devices' ADRF6658BCPZ is a 48-terminal cellphone IC with a square package shape and matte tin terminal finish. Operating b/w -40 to 105 °C, it's ideal for RF and baseband circuits in telecom applications. With a compact size of 7x7mm and no-lead terminal form, it offers industrial-grade performance at 3.3V supply voltage.

S-XQCC-N48

e3

7 mm

3

1

48

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

STA8089FGBTR by STMicroelectronics

STA8089FGBTR

STMicroelectronics

STA8089FGBTR by STMicroelectronics is a compact RF and baseband circuit IC designed for industrial applications. It features a very thin profile with a max operating temp of 85 °C, operates at 1.2V, and has 56 terminals in a no-lead configuration. Ideal for cellphone integration, it ensures reliable performance in diverse environments.

S-XQCC-N56

e3

7 mm

3

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.2 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

30

7 mm

STA8089FGB by STMicroelectronics

STA8089FGB

STMicroelectronics

STA8089FGB by STMicroelectronics is a compact RF and baseband circuit IC designed for industrial applications. It features a -40 °C to 85 °C operating temp range, 1.2V nominal voltage, and a very thin profile of just 0.9mm height. Ideal for cellphone integration, it ensures efficient performance in tight spaces.

S-XQCC-N56

e3

7 mm

3

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.2 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

30

7 mm

STA8089FGTR by STMicroelectronics

STA8089FGTR

STMicroelectronics

STA8089FGTR by STMicroelectronics is a cellphone IC with 56 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 1.2V for telecom applications.

S-XQCC-N56

e3

7 mm

3

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.2 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

30

7 mm

STA8089FG by STMicroelectronics

STA8089FG

STMicroelectronics

STA8089FG by STMicroelectronics is a compact RF and baseband circuit IC designed for industrial applications. It operates b/w -40 °C to 85 °C, features a very thin profile with 56 terminals, and supports a nominal voltage of 1.2V. Ideal for cellphone integration, it ensures efficient performance in demanding environments.

S-XQCC-N56

e3

7 mm

3

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.2 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

7 mm

BGA7210,515 by NXP Semiconductors

BGA7210,515

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.85 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGA7210X by NXP Semiconductors

BGA7210X

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.85 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGA7350,115 by NXP Semiconductors

BGA7350,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

5 mm

BGA7350,515 by NXP Semiconductors

BGA7350,515

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGU7060Y by NXP Semiconductors

BGU7060Y

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7061,518 by NXP Semiconductors

BGU7061,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7062,518 by NXP Semiconductors

BGU7062,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,115 by NXP Semiconductors

BGU7063,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,518 by NXP Semiconductors

BGU7063,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

30

8 mm

CC1150RGVT by Texas Instruments

CC1150RGVT

Texas Instruments

The Texas Instruments CC1150RGVT is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and data rate of 0.5 Mbps. This surface-mount IC has 16 terminals in a square shape, ideal for industrial applications requiring compact design and high performance.

.5 Mbps

S-PQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.65 mm

QUAD

30

4 mm

CC1021RSST by Texas Instruments

CC1021RSST

Texas Instruments

The Texas Instruments CC1021RSST is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a data rate of 0.1536 Mbps, making it ideal for telecommunications applications.

.1536 Mbps

S-PQCC-N32

e4

7 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.65 mm

QUAD

30

7 mm

STA8088TGATR by STMicroelectronics

STA8088TGATR

STMicroelectronics

RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;

e3

3

260

RF AND BASEBAND CIRCUIT

MATTE TIN

40

SKY13524-639LF by Skyworks Solutions

SKY13524-639LF

Skyworks Solutions

SKY13524-639LF by Skyworks Solutions is a cellphone IC with 14 terminals in a square package style. Operating b/w -30°C to 90°C, it's ideal for RF and baseband circuits at 3.3V supply voltage. With a compact size of 1.6mm x 1.6mm and terminal pitch of 0.4mm, it's suitable for telecom applications requiring surface mount technology.

S-XQCC-N14

1.6 mm

1

14

90 Cel

-30 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.5 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

1.6 mm

HMC832ALP6GETR by Analog Devices

HMC832ALP6GETR

Analog Devices

Analog Devices' HMC832ALP6GETR is a cellphone IC with 40 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications. It features RF and baseband circuits, operates at 3.3V, and has a compact size of 6x6mm with a terminal pitch of 0.5mm.

S-XQCC-N40

e3

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

30

6 mm

HMC832ALP6GE by Analog Devices

HMC832ALP6GE

Analog Devices

Analog Devices' HMC832ALP6GE is a 40-terminal cellphone IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has a nominal voltage of 3.3V and terminal pitch of 0.5mm, making it ideal for compact designs requiring high performance.

S-XQCC-N40

e3

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

30

6 mm

RFX2411 by Skyworks Solutions

RFX2411

Skyworks Solutions

RFX2411 by Skyworks Solutions is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 125°C, suitable for automotive use. This RF and baseband circuit has a nominal voltage of 3.3V, utilizing CMOS technology for high performance in telecom applications.

S-XQCC-N16

3 mm

1

16

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

3 mm

RFX5000B by Skyworks Solutions

RFX5000B

Skyworks Solutions

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N16

3 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SKY65364-21 by Skyworks Solutions

SKY65364-21

Skyworks Solutions

SKY65364-21 by Skyworks Solutions is a cellphone IC with 28 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications, with a nominal voltage of 3.3V. This surface mount IC in square package style is ideal for industrial use due to its compact size and quad terminal position.

S-XQMA-N28

6 mm

1

28

85 Cel

-40 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

NOT SPECIFIED

6 mm

ST25R3912-AQFT by STMicroelectronics

ST25R3912-AQFT

STMicroelectronics

ST25R3912-AQFT by STMicroelectronics is a compact RF and baseband circuit IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 3.3V supply, and comes in a very thin profile with 32 terminals. Ideal for cellphone integration, it ensures reliable performance in demanding environments.

S-XQCC-N32

5 mm

1

32

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

AD6688BBPZRL-3000 by Analog Devices

AD6688BBPZRL-3000

Analog Devices

AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

.975 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

SKY66291-11 by Skyworks Solutions

SKY66291-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; No. of Terminals: 16; Terminal Position: UNSPECIFIED; Peak Reflow Temperature (C): 260;

S-XXSS-X16

3

1

16

260

5 V

RF AND BASEBAND CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

SKY66292-11 by Skyworks Solutions

SKY66292-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

3

260

RF AND BASEBAND CIRCUIT

HPA00420RGVR by Texas Instruments

HPA00420RGVR

Texas Instruments

Texas Instruments' HPA00420RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With nickel palladium gold finish, it offers a nominal voltage of 3V and terminal pitch of 0.65mm.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA01083RGVR by Texas Instruments

HPA01083RGVR

Texas Instruments

Texas Instruments' HPA01083RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With a compact size of 4x4mm and no-lead terminal form, it suits industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA02142RGVR by Texas Instruments

HPA02142RGVR

Texas Instruments

Texas Instruments' HPA02142RGVR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it has a supply voltage of 3V and max current of 4mA. Ideal for RF and baseband circuits, this IC is surface mountable with nickel palladium gold finish.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

4 mA

3 V

YES

RF AND BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm