Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA8089FG by STMicroelectronics is a compact RF and baseband circuit IC designed for industrial applications. It operates b/w -40 °C to 85 °C, features a very thin profile with 56 terminals, and supports a nominal voltage of 1.2V. Ideal for cellphone integration, it ensures efficient performance in demanding environments.
Median Price
$6.016
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Arrow
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$5.295
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Chip1Stop
$6.738
$5.425
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$6.401
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Corphita
$6.064
IDEA Electronic Components Group
$16.002
$14.402
AZTECH Wire
$19.890
MKK Technologies
$30.092
DigiPath Technology Company
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A-Z Elektronik GmbH
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$9.770
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GreenTree Electronics
Parana Technologies
$19.133
Emar International I/E
The surface mount capability allows for efficient use of PCB space and enables automated assembly processes, making it suitable for modern manufacturing.
The square package shape aids in uniform heat distribution during operation and makes layout design simpler on printed circuit boards.
With 56 terminals, this IC can accommodate complex designs and multiple functions, enhancing its versatility for various applications.
This design promotes efficient thermal management and allows for compact integration within slim devices, catering to space-constrained applications.
This higher maximum operating temperature ensures reliability in demanding environments and is ideal for industrial applications.
With a minimum temperature of -40 °C, this IC is resilient in extreme conditions, making it suitable for outdoor and harsh environment applications.
The matte tin finish provides excellent solderability and barrier protection against oxidation, ensuring long-term performance and reliability.
Quad terminal positioning allows for a balanced connection to printed circuit boards, improving signal integrity and reducing noise.
Having a low maximum seated height enables the IC to fit into slim form factor devices, which is essential for modern mobile technology.
The 7 mm width supports widespread compatibility with existing PCB layouts, simplifying integration into various electronics.
This peak reflow temperature ensures compatibility with standard soldering processes, allowing for reliable manufacturing.
The equal length to width contributes to a compact design, enhancing flexibility in device design and layout.
Being industrial-grade signifies that this IC can perform reliably in challenging industrial environments, increasing its appeal for professional applications.
The CMOS technology used provides lower power consumption and greater performance, making it ideal for battery-operated devices.
No lead terminals minimize environmental impact and enhance compatibility with modern lead-free soldering methods.
Designed for RF and baseband applications, this IC is perfect for telecommunications devices, ensuring high performance in signal processing.
The low nominal supply voltage allows for energy-efficient operation, important for battery life in handheld devices.
A small terminal pitch allows for dense packaging of components on PCBs, vital for high-performance modern electronics.
An MSL of 3 indicates that the component can handle standard moisture protection practices, ensuring longevity and reliability.
Cellphone ICs STA8089FG attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics
JESD-30 Code:
JESD-609 Code:
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Moisture Sensitivity Level (MSL):
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No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
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Maximum Seated Height:
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STA8089FG Telecommunications trade compliance attributes, and parameters.
ECCN
7A994
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Material Barrier Bag 17/Dec/2020
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
1N4148
Semitronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Comchip Technology
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
SS14
Hy Electronic
National Semiconductor
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
TCM320AC56IPT
Texas Instruments
TCM320AC56IPT by Texas Instruments is a Cellphone IC with 48 terminals, operating at temperatures from -40 to 85°C. It features a 13-bit linear codec, companding law MU-LAW, and telecom IC type BASEBAND CIRCUIT. This low-profile flatpack package has a terminal pitch of 0.5mm and is ideal for industrial applications requiring fine-pitch technology.
AD6643BCPZ-200
Analog Devices
AD6643BCPZ-200 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style, matte tin terminal finish, and industrial temperature grade. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and low supply current of 0.26mA.
LMV228UR
LMV228UR by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. The IC has a nominal voltage of 2.7V and features surface mount technology with tin lead terminal finish.
MAX4003EUA
MAX4003EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications.
BG77LA-64-SGNS
Quectel Wireless Solutions
BG77LA-64-SGNS by Quectel Wireless Solutions is a BASEBAND CIRCUIT Telecom IC with 94 terminals, RECTANGULAR package shape, and 3.3V supply voltage. It operates b/w -35°C to 75°C, making it suitable for cellphone applications requiring compact design and surface mount capability.
GC5316IZED
GC5316IZED by Texas Instruments is a Cellphone IC with 388 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.5V and 3.3V. This RF and baseband circuit has a terminal pitch of 1mm, making it ideal for telecom applications.
HMC485MS8GE
Analog Devices' HMC485MS8GE is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
TLV320AC56CN
TLV320AC56CN by Texas Instruments is a 20-terminal IC with 3V supply, operating from 0 to 70°C. It features a 13-bit linear codec and μ-law companding for baseband circuits in cellphones. The rectangular plastic package has a width of 7.62mm and length of 24.325mm, making it suitable for telecom applications.
CC1021RSS
The Texas Instruments CC1021RSS is a cellphone IC with 32 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it suitable for industrial telecom applications.
MAX2690EUB+T
MAX2690EUB+T by Analog Devices is a cellphone IC with 10 terminals in a small outline, thin profile package. Operating temperature ranges from -40 to 85 °C, making it suitable for industrial telecom applications. It features RF and baseband circuits with a nominal voltage of 3V.
NRF9160-SICA-B1A-R7
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SICA-B1A-R7 is a surface-mount Cellphone IC with 127 terminals in a rectangular grid array package. It operates b/w -40°C to 85°C, suitable for industrial applications. This RF and baseband circuit has a nominal voltage of 3.8V, making it ideal for telecom devices.
CC2511F16RSPG3
CC2511F16RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a supply voltage of 3V, this IC is surface mountable and has a terminal pitch of 0.5mm.
CC113LRGPR
The Texas Instruments CC113LRGPR is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it has a supply voltage of 1.8/3.6V and data rate of 0.6 Mbps. Ideal for RF and baseband circuits, this IC is surface mountable and features a moisture sensitivity level of 3.
TRF370417TDA1
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TRF371125IRGZR
TRF371125IRGZR by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.
CC1000PW
CC1000PW by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry for telecom applications, and CMOS technology in a small outline package suitable for industrial use.
CC2510F16RHHT
CC2510F16RHHT by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with power supplies of 2.5/3.3V for RF and baseband circuits. This CMOS technology IC has a terminal pitch of 0.5mm and is suitable for industrial temperature grade applications.
ADF7025BCPZ-RL
Analog Devices' ADF7025BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It has a supply voltage of 2.5/3.3V and terminal pitch of 0.5mm. Ideal for telecom applications, this chip carrier package IC is surface mountable and suitable for industrial use.
TCM320AC57PT
Texas Instruments TCM320AC57PT is a cellphone IC with 48 terminals in a square package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features a low profile flatpack design with gull wing terminals, ideal for baseband circuit applications.
SKY13526-485LF
Skyworks Solutions
SKY13526-485LF by Skyworks Solutions is a 14-terminal cellphone IC with a square package shape and chip carrier style. Operating b/w -30°C to 90°C, it's ideal for RF and baseband circuits in telecom applications. With a compact size of 2x2mm and no-lead terminals, it offers high performance in a small footprint.
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STA8088EX
STMicroelectronics
RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;
STA8088EXA
STA8088TGATR
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
STA8089FGB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
STA8089FGBTR
STA8089FGTR
STA8089FGTR by STMicroelectronics is a cellphone IC with 56 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 1.2V for telecom applications.
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