Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA8089FG by STMicroelectronics is a compact RF and baseband circuit IC designed for industrial applications. It operates b/w -40 °C to 85 °C, features a very thin profile with 56 terminals, and supports a nominal voltage of 1.2V. Ideal for cellphone integration, it ensures efficient performance in demanding environments.
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$6.016
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Arrow
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Chip1Stop
$6.738
$5.425
Verical
Digiode
$6.401
Vyrian
Chip Stock
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Corphita
$6.064
IDEA Electronic Components Group
$16.002
$14.402
AZTECH Wire
$19.890
MKK Technologies
$30.092
DigiPath Technology Company
Kepictronics
A-Z Elektronik GmbH
RC Electronics
$9.770
$8.920
$8.650
GreenTree Electronics
Parana Technologies
$19.133
Emar International I/E
The surface mount capability allows for efficient use of PCB space and enables automated assembly processes, making it suitable for modern manufacturing.
The square package shape aids in uniform heat distribution during operation and makes layout design simpler on printed circuit boards.
With 56 terminals, this IC can accommodate complex designs and multiple functions, enhancing its versatility for various applications.
This design promotes efficient thermal management and allows for compact integration within slim devices, catering to space-constrained applications.
This higher maximum operating temperature ensures reliability in demanding environments and is ideal for industrial applications.
With a minimum temperature of -40 °C, this IC is resilient in extreme conditions, making it suitable for outdoor and harsh environment applications.
The matte tin finish provides excellent solderability and barrier protection against oxidation, ensuring long-term performance and reliability.
Quad terminal positioning allows for a balanced connection to printed circuit boards, improving signal integrity and reducing noise.
Having a low maximum seated height enables the IC to fit into slim form factor devices, which is essential for modern mobile technology.
The 7 mm width supports widespread compatibility with existing PCB layouts, simplifying integration into various electronics.
This peak reflow temperature ensures compatibility with standard soldering processes, allowing for reliable manufacturing.
The equal length to width contributes to a compact design, enhancing flexibility in device design and layout.
Being industrial-grade signifies that this IC can perform reliably in challenging industrial environments, increasing its appeal for professional applications.
The CMOS technology used provides lower power consumption and greater performance, making it ideal for battery-operated devices.
No lead terminals minimize environmental impact and enhance compatibility with modern lead-free soldering methods.
Designed for RF and baseband applications, this IC is perfect for telecommunications devices, ensuring high performance in signal processing.
The low nominal supply voltage allows for energy-efficient operation, important for battery life in handheld devices.
A small terminal pitch allows for dense packaging of components on PCBs, vital for high-performance modern electronics.
An MSL of 3 indicates that the component can handle standard moisture protection practices, ensuring longevity and reliability.
Cellphone ICs STA8089FG attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
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Telecom IC Type:
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STA8089FG Telecommunications trade compliance attributes, and parameters.
ECCN
7A994
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Material Barrier Bag 17/Dec/2020
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
Nexperia
LM358N
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Formosa Microsemi
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
MAX5863ETM+T
Analog Devices
Analog Devices' MAX5863ETM+T is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features RF and baseband circuits, CMOS technology, and nominal voltage of 3V for telecom applications.
ADF4360-4BCPZ
Analog Devices' ADF4360-4BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial settings.
AD6635XBC
AD6635XBC by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. Operating temperature ranges from -40 to 70 °C, with power supplies of 2.5V and 3.3V. This CMOS technology BASEBAND CIRCUIT is ideal for cellphone applications due to its compact SQUARE shape and BALL terminal form.
TCM320AC57IN
Texas Instruments
TCM320AC57IN by Texas Instruments is a Cellphone IC with 20 terminals, operating at 5V. It features A-LAW companding law, 13-bit linear coding, and a filter. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and through-hole terminal form.
TRF6903PTR
TRF6903PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with supply voltages of 2.5/3.3V. This RF and baseband circuit has a flatpack, low profile design for industrial telecom applications.
AFE7988IABJ
AFE7988IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit IC has a fine pitch of 0.8mm, making it ideal for telecom applications.
HMC485MS8GTR
Analog Devices' HMC485MS8GTR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C and has a peak reflow temperature of 235°C. Ideal for RF and baseband circuits in telecom applications due to its dual terminal position and tin lead finish.
CC1131IRHBRG4Q1
CC1131IRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at -40 to 85°C. It features RF and baseband circuits, operates at 3V, and has a data rate of 0.25 Mbps. This chip carrier package is suitable for industrial applications requiring high-speed communication in compact devices.
SKY13437-11
Skyworks Solutions
SKY13437-11 by Skyworks Solutions is a Cellphone IC with 22 terminals in RECTANGULAR package. Telecom IC Type: RF AND BASEBAND CIRCUIT, Nominal Voltage: 2.85V, Terminal Pitch: 0.4mm. Ideal for cellphone applications due to its compact MICROELECTRONIC ASSEMBLY and low operating temperatures of -35°C to 90°C.
ADF4360-2BCPZRL7
Analog Devices' ADF4360-2BCPZRL7 is a Cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, -40 to 85°C temperature range, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.
AD9361BBCZ-CSL
AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.
NRF9160-SIAA-B1A-R
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SIAA-B1A-R is a Cellphone IC with RF and Baseband Circuit for telecom. It operates in industrial temperature range (-40 to 85°C) with 3.8V supply voltage. The package is rectangular, surface mountable, grid array style, measuring 10.5mm x 16mm with 127 terminals at 0.5mm pitch suitable for various wireless applications.
LARA-R6001-00B
U-blox Ag
RF AND BASEBAND CIRCUIT;
ADS58C20IPFPR
Texas Instruments ADS58C20IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.
CC2511F8RSPR
The Texas Instruments CC2511F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuitry for telecom applications. With a compact size of 6x6mm and CMOS technology, it offers high performance in a small form factor suitable for mobile devices.
TLV321AC37IN
TLV321AC37IN by Texas Instruments is a CELLPHONE IC with 20 terminals in RECTANGULAR PLASTIC/EPOXY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL use. This BASEBAND CIRCUIT has a nominal voltage of 3 V and CMOS technology.
AD8340ACP
AD8340ACP by Analog Devices is a cellphone IC with 24 terminals in a square package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, operates at 5V supply voltage, and has a terminal pitch of 0.5mm.
CC1110F16RSP
The Texas Instruments CC1110F16RSP is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial applications.
AT86RF233-ZU
Microchip Technology
AT86RF233-ZU by Microchip Technology is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with power supplies of 1.8V and 3V. This RF and baseband circuit technology has a terminal pitch of 0.5mm, making it ideal for telecom applications.
MAX2306ETI
Analog Devices' MAX2306ETI is a cellphone IC with 28 terminals, operating at -40 to 85 °C. It has a supply voltage of 3/3.3V and low current draw of 0.0415mA. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package design.
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STA8088EX
STMicroelectronics
RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;
STA8088EXA
STA8088TGATR
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
STA8089FGB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
STA8089FGBTR
STA8089FGTR
STA8089FGTR by STMicroelectronics is a cellphone IC with 56 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 1.2V for telecom applications.
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