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STA8089FGB

STMicroelectronics

STA8089FGB by STMicroelectronics

STA8089FGB by STMicroelectronics is a compact RF and baseband circuit IC designed for industrial applications. It features a -40 °C to 85 °C operating temp range, 1.2V nominal voltage, and a very thin profile of just 0.9mm height. Ideal for cellphone integration, it ensures efficient performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,964 parts In-Stock

1+ parts

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4,964

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Digiode

USA . 461 parts In-Stock

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461

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Anansix

USA . 148 parts In-Stock

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148

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 844 parts In-Stock

1+ parts

$13.008

100+ parts

-

1k+ parts

$11.707

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844

$13.008

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$11.707

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AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$19.090

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258

$19.090

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MKK Technologies

India . 2,317 parts In-Stock

1+ parts

$24.460

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2,317

$24.460

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DigiPath Technology Company

USA . 2,317 parts In-Stock

1+ parts

$24.460

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2,317

$24.460

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 779 parts In-Stock

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779

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Parana Technologies

USA . 180 parts In-Stock

1+ parts

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100+ parts

$15.553

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180

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$15.553

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Overview

Elevate your mobile device performance with the STA8089FGB from STMicroelectronics, a leader in innovative semiconductor solutions. This powerful cellphone IC is designed for reliability and efficiency, ensuring exceptional connectivity and seamless user experiences. With its compact design and robust temperature range, it’s perfect for various applications, empowering engineers to create cutting-edge products that stand out in today’s competitive market. Trust in STMicroelectronics to deliver quality and innovation you can rely on!

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for easy integration into compact devices, making it suitable for modern cellphone applications.

Package Shape: SQUARE

The square package shape enables efficient space utilization on PCBs, which is essential for slim and lightweight cellphone designs.

No. of Terminals: 56

Having 56 terminals provides multiple connection points for enhanced functionality, making it ideal for complex RF and baseband circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile improves the overall form factor of the cellphone, ensuring it aligns with contemporary design aesthetics.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is reliable even in demanding conditions, ensuring durability and consistent performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable operation in extreme environmental conditions, making it versatile for various applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability, which is essential for maintaining robust electrical connections during assembly.

Terminal Position: QUAD

Quad terminal positioning optimizes space and connectivity, which is critical for high-density integration in mobile devices.

Maximum Seated Height: 0.9 mm

The low profile design aids in fitting the IC in thin cellular devices, contributing to overall device aesthetics and portability.

Width: 7 mm

A moderate width suits a variety of designs while keeping the IC manageable in size for tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature allows for effective soldering without risking thermal damage to the IC.

Peak Reflow Temperature °C: 260

Operating at up to 260 °C ensures compatibility with a range of modern surface mount assembly processes.

Length: 7 mm

With a length of 7 mm, this IC fits well into compact layouts, optimizing space usage in cellphone designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade implies higher reliability standards, making this IC suitable for various rigorous applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, which are crucial for battery-operated cellphones.

Terminal Form: NO LEAD

The no-lead design allows for a smaller footprint, enhancing integration in tight spaces typical in mobile devices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Designed for both RF and baseband applications, this IC integrates crucial functionalities for advanced telecom devices.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage contributes to energy efficiency, which is vital for improving the battery life of mobile gadgets.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for dense packaging of components, which is essential for making compact electronic designs feasible.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the IC can be exposed to moisture for a limited time before needing proper handling to ensure reliability.

Technical Specifications

Cellphone ICs STA8089FGB attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

STA8089FGB Telecommunications trade compliance attributes, and parameters.

ECCN

7A994

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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