Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA8089FGB by STMicroelectronics is a compact RF and baseband circuit IC designed for industrial applications. It features a -40 °C to 85 °C operating temp range, 1.2V nominal voltage, and a very thin profile of just 0.9mm height. Ideal for cellphone integration, it ensures efficient performance in tight spaces.
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This surface mount design allows for easy integration into compact devices, making it suitable for modern cellphone applications.
The square package shape enables efficient space utilization on PCBs, which is essential for slim and lightweight cellphone designs.
Having 56 terminals provides multiple connection points for enhanced functionality, making it ideal for complex RF and baseband circuit designs.
The thin profile improves the overall form factor of the cellphone, ensuring it aligns with contemporary design aesthetics.
With a high maximum operating temperature, this IC is reliable even in demanding conditions, ensuring durability and consistent performance.
The wide temperature range allows for reliable operation in extreme environmental conditions, making it versatile for various applications.
Matte tin terminal finish ensures good solderability, which is essential for maintaining robust electrical connections during assembly.
Quad terminal positioning optimizes space and connectivity, which is critical for high-density integration in mobile devices.
The low profile design aids in fitting the IC in thin cellular devices, contributing to overall device aesthetics and portability.
A moderate width suits a variety of designs while keeping the IC manageable in size for tight layouts.
A maximum time of 30 seconds at peak reflow temperature allows for effective soldering without risking thermal damage to the IC.
Operating at up to 260 °C ensures compatibility with a range of modern surface mount assembly processes.
With a length of 7 mm, this IC fits well into compact layouts, optimizing space usage in cellphone designs.
An industrial temperature grade implies higher reliability standards, making this IC suitable for various rigorous applications.
CMOS technology offers low power consumption and high speed, which are crucial for battery-operated cellphones.
The no-lead design allows for a smaller footprint, enhancing integration in tight spaces typical in mobile devices.
Designed for both RF and baseband applications, this IC integrates crucial functionalities for advanced telecom devices.
A low nominal supply voltage contributes to energy efficiency, which is vital for improving the battery life of mobile gadgets.
A fine terminal pitch allows for dense packaging of components, which is essential for making compact electronic designs feasible.
With an MSL of 3, the IC can be exposed to moisture for a limited time before needing proper handling to ensure reliability.
Cellphone ICs STA8089FGB attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics
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JESD-609 Code:
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STA8089FGB Telecommunications trade compliance attributes, and parameters.
ECCN
7A994
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Material Barrier Bag 17/Dec/2020
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
1N4148
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MC33269T-3.3G
Onsemi
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ROHM
Brightking
Fairchild Semiconductor
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
Bharat Electronics
LM317LMX/NOPB
Texas Instruments
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MPCI-L200-03S-00
U-blox Ag
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
CC113LRTKR
The Texas Instruments CC113LRTKR is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
ST25R3911B-AQWT
RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
SKY65723-81
Skyworks Solutions
SKY65723-81 by Skyworks Solutions is a CELLPHONE IC with 6 terminals in MICROELECTRONIC ASSEMBLY. It operates b/w -40°C to 85°C, suitable for INDUSTRIAL use. This RF AND BASEBAND CIRCUIT has a nominal voltage of 1.8V, ideal for cellphone applications.
ADRV9010BBCZ-A-RL
Analog Devices
Analog Devices' ADRV9010BBCZ-A-RL is a CELLPHONE IC with 289 terminals in a PLASTIC/EPOXY package. It operates b/w -40 to 110 °C, suitable for RF and baseband circuits. The low-profile GRID ARRAY design with 0.8mm terminal pitch makes it ideal for compact mobile devices.
ADF4360-3BCPZ
ADF4360-3BCPZ by Analog Devices is a cellphone IC with a square package shape and 24 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.3 V. This IC is commonly used in baseband circuit applications.
MC13142D
Motorola
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
NRF24L01-REEL7
Nordic Semiconductor Asa
NRF24L01-REEL7 by Nordic Semiconductor Asa is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features a square package shape, matte tin finish, and RF/baseband circuit type. Ideal for industrial applications due to its low profile and no lead terminal form.
CC2510F32RHHT
CC2510F32RHHT by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features CMOS, surface mount capability, and a terminal pitch of 0.5mm for industrial applications.
TLV320AC56IN
TLV320AC56IN by Texas Instruments is a 20-terminal IC with 3V power supply, operating b/w -40 to 85°C. It features companding law MU-LAW, 13-bit linear coding, and a filter. Ideal for cellphone baseband circuits due to its industrial temperature grade and compact rectangular package design.
ADF7025BCP
Analog Devices' ADF7025BCP is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. This RF and baseband circuit is ideal for telecom applications requiring a nominal voltage of 3V.
TRF3762-EIRHAT
TRF3762-EIRHAT by Texas Instruments is a cellphone IC with 40 terminals, operating at -40 to 85°C. It features a 5V supply, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, measures 6x6mm, and is surface mountable with nickel palladium gold finish.
LMV228TL/NOPB
LMV228TL/NOPB by Texas Instruments is a cellphone IC with surface mount capability. It features a max operating temperature of 85°C and min of -40°C, making it suitable for industrial applications. With a max supply current of 8mA, it is designed for RF and baseband circuit use in telecommunications.
SX1268IMLTRT
Semtech
Semtech's SX1268IMLTRT is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, ideal for RF and baseband circuits. With a compact size of 4x4mm and terminal pitch of 0.5mm, it's suitable for telecom applications.
MAX2550ETN+
Analog Devices' MAX2550ETN+ is a cellphone IC with 56 terminals in a square chip carrier package. Operating b/w -40 °C to 85°C, it has a supply voltage of 3.3V and max current of 390mA. Ideal for RF and baseband circuits, this IC features a terminal pitch of 0.4mm and is suitable for industrial temperature grade applications.
ADF7901BRUZ-REEL
Analog Devices' ADF7901BRUZ-REEL is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w 0 °C to 50°C and has a nominal voltage of 3V. This RF and baseband circuit is ideal for telecom applications requiring surface mount technology.
MAX5865ETM+
Analog Devices' MAX5865ETM+ is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 3V for telecom applications.
TRF3762-EIRHARG4
TRF3762-EIRHARG4 by Texas Instruments is a cellphone IC with 40 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and terminal pitch of 0.5mm. The package style is chip carrier with heat sink/slug in a square shape, suitable for industrial use.
AD6635BB
AD6635BB by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5V and 3.3V. This BASEBAND CIRCUIT technology uses CMOS and is suitable for industrial telecom applications.
CC1000-RTR1
CC1000-RTR1 by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuit for telecom applications, and CMOS technology in a small outline package. Ideal for industrial use due to its nickel palladium gold finish and dual terminal position.
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STA8088EX
RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;
STA8088EXA
STA8088TGATR
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
STA8089FG
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
STA8089FGBTR
STA8089FGTR
STA8089FGTR by STMicroelectronics is a cellphone IC with 56 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 1.2V for telecom applications.
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