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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
EP3SL110F1152C4G by Intel

EP3SL110F1152C4G

Intel

EP3SL110F1152C4G by Intel is a FPGA with 107.5K logic cells, 4300 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85°C and has a package size of 35x35mm. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

FPGA

107500

744

744

4300

4300 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF300T-1FCG1152I by Microchip Technology

MPF300T-1FCG1152I

Microchip Technology

MPF300T-1FCG1152I by Microchip Tech is a 300K logic cell FPGA with CMOS tech, 512 inputs/outputs, and 1152 terminals. It operates b/w -40 to 100°C, has a package height of 3.47mm, and uses a grid array style for applications in various electronic systems.

FPGA

300000

512

512

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF300T-FCG1152E by Microchip Technology

MPF300T-FCG1152E

Microchip Technology

MPF300T-FCG1152E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 512 inputs/outputs, operates b/w 0-100°C, and uses a grid array package style. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

300000

512

512

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF300TL-FCG1152E by Microchip Technology

MPF300TL-FCG1152E

Microchip Technology

MPF300TL-FCG1152E by Microchip is a 300K logic cell FPGA with CMOS tech, 512 inputs/outputs. It's a grid array package suitable for applications requiring high-density programmable ICs in compact form factors. Operating temp range of 0-100°C and low supply voltage make it ideal for power-efficient designs.

FPGA

300000

512

512

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF300TL-FCG1152I by Microchip Technology

MPF300TL-FCG1152I

Microchip Technology

MPF300TL-FCG1152I by Microchip Technology is a 300K logic cell FPGA with CMOS technology. It features 512 inputs/outputs, operates b/w -40 to 100°C, and has a package size of 35x35mm. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

300000

512

512

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF300TLS-FCG1152I by Microchip Technology

MPF300TLS-FCG1152I

Microchip Technology

Microchip Technology's MPF300TLS-FCG1152I is a 300K logic cell FPGA with CMOS technology. It features 512 inputs/outputs, operates b/w -40 to 100°C, and has a package style of grid array. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

300000

512

512

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF300TS-1FCG1152I by Microchip Technology

MPF300TS-1FCG1152I

Microchip Technology

MPF300TS-1FCG1152I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package body material of PLASTIC/EPOXY and features surface mount technology. This FPGA is suitable for applications requiring high-performance programmable ICs.

FPGA

300000

512

512

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXMB1G4F35I5G by Intel

5AGXMB1G4F35I5G

Intel

Intel's 5AGXMB1G4F35I5G FPGA features 300K logic cells, TSMC technology, and 136880 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

300000

704

704

136880

TSMC

136880 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP4SGX230FF35I3G by Intel

EP4SGX230FF35I3G

Intel

EP4SGX230FF35I3G by Intel is a FPGA with 228,000 logic cells and 9,120 CLBs. It operates at a voltage range of 0.87V to 0.93V and has a max temperature of 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package.

FPGA

228000

564

564

9120

9120 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXFB3H4F35I3G by Intel

5AGXFB3H4F35I3G

Intel

The Intel 5AGXFB3H4F35I3G is a FPGA with 362K logic cells, TSMC technology, and 13688 CLBs. It operates at 1.12-1.18V with -40 to 100°C temperature range. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXFA5H4F35I5G by Intel

5AGXFA5H4F35I5G

Intel

Intel's 5AGXFA5H4F35I5G FPGA boasts 190,000 logic cells and TSMC technology. With 7170 CLBs, it offers 544 inputs/outputs and operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXFB7H4F35I3G by Intel

5AGXFB7H4F35I3G

Intel

Intel's 5AGXFB7H4F35I3G FPGA features 504K logic cells, TSMC technology, and 19024 CLBs. Ideal for industrial applications with a max operating temp of 100°C and min of -40°C. Package style is grid array with heat sink/slug, suitable for surface mount assembly.

FPGA

504000

704

704

19024

TSMC

19024 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGTFD3H3F35I3G by Intel

5AGTFD3H3F35I3G

Intel

Intel's 5AGTFD3H3F35I3G FPGA boasts 362K logic cells, 13688 CLBs, and operates at a max voltage of 1.18V. Ideal for industrial applications with temp range -40 to 100°C, featuring a grid array package style with heat sink and square shape.

FPGA

362000

704

704

13688

13688 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXMA7G4F35I5G by Intel

5AGXMA7G4F35I5G

Intel

Intel's 5AGXMA7G4F35I5G FPGA features 242K logic cells, TSMC technology, and 9168 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

242000

544

544

9168

TSMC

9168 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXMA5G4F35I5G by Intel

5AGXMA5G4F35I5G

Intel

The Intel 5AGXMA5G4F35I5G is a Field Programmable Gate Array (FPGA) with 190,000 logic cells and TSMC technology. It has 7170 CLBs, 544 inputs/outputs, and operates b/w -40 to 100 °C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF300T-FCG1152I by Microchip Technology

MPF300T-FCG1152I

Microchip Technology

Microchip Technology's MPF300T-FCG1152I is a 300K logic cell FPGA with CMOS technology. It features 512 inputs/outputs, operates b/w -40 to 100°C, and has a package size of 35x35mm. Ideal for applications requiring high-density programmable logic solutions in compact form factors.

FPGA

300000

512

512

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP2AGX190FF35C6G by Intel

EP2AGX190FF35C6G

Intel

EP2AGX190FF35C6G by Intel is a FPGA with 181165 logic cells, 7612 CLBs, and 612 inputs/outputs. It operates b/w -40 to 85°C and has a supply voltage range of 0.87V to 0.93V. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

181165

612

612

7612

7612 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.55 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP2AGX260FF35C6G by Intel

EP2AGX260FF35C6G

Intel

EP2AGX260FF35C6G by Intel is a FPGA with 244188 logic cells, 10260 CLBs, and 612 inputs/outputs. It operates b/w -40°C to 85°C, has a supply voltage range of 0.87V to 0.93V, and features a grid array package suitable for various applications in electronics design and development.

FPGA

244188

612

612

10260

10260 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.55 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP2AGX95EF35C4G by Intel

EP2AGX95EF35C4G

Intel

EP2AGX95EF35C4G by Intel is a FPGA with 89178 logic cells, 3747 CLBs, and 612 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of grid array. Ideal for applications requiring high-speed processing and customization in compact designs.

FPGA

89178

612

612

3747

3747 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.55 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

1SG040HH3F35E2LG by Intel

1SG040HH3F35E2LG

Intel

The Intel 1SG040HH3F35E2LG FPGA features 378K logic cells, 47.25K CLBs, and 430 inputs/outputs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor. With a package style of grid array and square shape, it is suitable for various electronic systems with stringent space constraints.

FPGA

378000

430

430

47250

47250 CLBS

0.85

.82 V

.88 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.706 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

10AX032H2F35E1HG by Intel

10AX032H2F35E1HG

Intel

Intel's 10AX032H2F35E1HG FPGA features 320K logic cells, TSMC technology, and 11990 CLBs. Ideal for applications requiring high-speed data processing, such as telecommunications equipment or industrial automation systems.

FPGA

320000

384

384

11990

TSMC

11990 CLBS

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP4SGX360FF35C4G by Intel

EP4SGX360FF35C4G

Intel

EP4SGX360FF35C4G by Intel is a FPGA with 353,600 logic cells and 14,144 CLBs. It operates at a voltage range of 0.87V to 0.93V and has a max temperature of 85°C. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

353600

564

564

14144

14144 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.3 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP4SGX180FF35C3G by Intel

EP4SGX180FF35C3G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

175750

564

564

7030

7030 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152