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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LFE2M100E-6FN1152C by Lattice Semiconductor

LFE2M100E-6FN1152C

Lattice Semiconductor

LFE2M100E-6FN1152C by Lattice Semiconductor is a 100000 logic cell FPGA with 520 inputs/outputs, operating at 357 MHz. It has a max supply voltage of 1.26V and is suitable for applications requiring high-speed processing in industrial automation and telecommunications due to its low combinatorial delay and high clock frequency capabilities.

FPGA

100000

520

520

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1152,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-4FF1152I by Xilinx

XC2V3000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;

FPGA

32256

720

720

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V3000-5FF1152I by Xilinx

XC2V3000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 32256;

FPGA

32256

720

720

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V4000-4FF1152I by Xilinx

XC2V4000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

51840

824

824

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V4000-5FF1152I by Xilinx

XC2V4000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

51840

824

824

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V6000-4FF1152I by Xilinx

XC2V6000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 76032;

FPGA

76032

824

824

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V6000-5FF1152I by Xilinx

XC2V6000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

76032

824

824

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V8000-4FF1152I by Xilinx

XC2V8000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.4 mm;

FPGA

104832

824

824

11648

8000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V8000-5FF1152I by Xilinx

XC2V8000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

104832

824

824

11648

8000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP20-6FF1152C by Xilinx

XC2VP20-6FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

564

564

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP20-6FF1152I by Xilinx

XC2VP20-6FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.4 mm;

FPGA

20880

564

564

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-6FF1152C by Xilinx

XC2VP50-6FF1152C

Xilinx

The Xilinx XC2VP50-6FF1152C is a FPGA with 53136 logic cells, 5904 CLBs, and 692 inputs. It operates at max frequency of 1200 MHz and has a max combinatorial delay of 0.32 ns. Ideal for applications requiring high-speed processing and complex logic functions in telecommunications, aerospace, and industrial automation.

FPGA

53136

692

644

5904

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-6FF1152I by Xilinx

XC2VP50-6FF1152I

Xilinx

Xilinx XC2VP50-6FF1152I FPGA features 53136 logic cells, 5904 CLBs, and a max clock frequency of 1200 MHz. Ideal for high-performance applications like telecommunications, networking, and industrial automation due to its advanced CMOS technology and versatile programmable IC type.

FPGA

53136

692

644

5904

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-7FF1152C by Xilinx

XC2VP50-7FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

692

644

5904

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP20-5FF1152C by Xilinx

XC2VP20-5FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

564

564

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP20-5FF1152I by Xilinx

XC2VP20-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

20880

564

564

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP30-5FF1152C by Xilinx

XC2VP30-5FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

644

644

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP30-5FF1152I by Xilinx

XC2VP30-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 30816;

FPGA

30816

644

644

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP30-6FF1152C by Xilinx

XC2VP30-6FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

644

644

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP30-6FF1152I by Xilinx

XC2VP30-6FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1200 MHz;

FPGA

30816

644

644

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP30-7FF1152C by Xilinx

XC2VP30-7FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

644

644

3424

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-5FF1152C by Xilinx

XC2VP40-5FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

644

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-5FF1152I by Xilinx

XC2VP40-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

43632

692

644

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-6FF1152C by Xilinx

XC2VP40-6FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

644

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-6FF1152I by Xilinx

XC2VP40-6FF1152I

Xilinx

Xilinx XC2VP40-6FF1152I FPGA features 43632 logic cells, 4848 CLBs, and 692 inputs. With a max clock frequency of 1200 MHz, it's ideal for high-performance applications like signal processing and data acceleration. The package style is grid array with a square shape and ball terminals for easy mounting.

FPGA

43632

692

644

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-7FF1152C by Xilinx

XC2VP40-7FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

644

4848

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-5FF1152C by Xilinx

XC2VP50-5FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

692

644

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-5FF1152I by Xilinx

XC2VP50-5FF1152I

Xilinx

Xilinx XC2VP50-5FF1152I FPGA features 53136 logic cells, 5904 CLBs, and a max clock frequency of 1050 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities in a compact GRID ARRAY package with PLASTIC/EPOXY body material.

FPGA

53136

692

644

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-10FF1152C by Xilinx

XC4VFX100-10FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

94896

576

576

10544

1028 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-10FF1152I by Xilinx

XC4VFX100-10FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

94896

576

576

10544

1028 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-11FF1152C by Xilinx

XC4VFX100-11FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

94896

576

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-11FF1152I by Xilinx

XC4VFX100-11FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 576;

FPGA

94896

576

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX40-10FF1152I by Xilinx

XC4VFX40-10FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 448;

FPGA

41904

448

448

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-10FF1152C by Xilinx

XC4VFX60-10FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-10FF1152I by Xilinx

XC4VFX60-10FF1152I

Xilinx

Xilinx XC4VFX60-10FF1152I FPGA features 56880 logic cells, 6320 CLBs, and a max clock frequency of 1028 MHz. Ideal for high-performance applications requiring fast processing speeds in a compact form factor. Suitable for various industries like telecommunications, aerospace, and automotive due to its advanced CMOS technology and programmable nature.

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-11FF1152C by Xilinx

XC4VFX60-11FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-11FF1152I by Xilinx

XC4VFX60-11FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;

FPGA

56880

576

576

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC2V3000-4FFG1152C by Xilinx

XC2V3000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

720

720

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-4FFG1152I by Xilinx

XC2V3000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5,1.5/3.3,3.3;

FPGA

32256

720

720

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-5FFG1152C by Xilinx

XC2V3000-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

3584

3000000

750 MHz

0.39 ns

CMOS

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-5FFG1152I by Xilinx

XC2V3000-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

3584

3000000

750 MHz

0.39 ns

CMOS

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-6FFG1152C by Xilinx

XC2V3000-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

3584

3000000

820 MHz

0.35 ns

CMOS

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-4FFG1152C by Xilinx

XC2V4000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

824

824

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-4FFG1152I by Xilinx

XC2V4000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

51840

824

824

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-5FFG1152C by Xilinx

XC2V4000-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

824

824

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-5FFG1152I by Xilinx

XC2V4000-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Organization: 5760 CLBS, 4000000 GATES;

FPGA

51840

824

824

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-6FFG1152C by Xilinx

XC2V4000-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

824

824

5760

4000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-4FFG1152C by Xilinx

XC2V6000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

824

824

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No