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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2V6000-4FFG1152I by Xilinx

XC2V6000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.5;

FPGA

76032

824

824

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-5FFG1152C by Xilinx

XC2V6000-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

824

824

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-5FFG1152I by Xilinx

XC2V6000-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Organization: 8448 CLBS, 6000000 GATES;

FPGA

76032

824

824

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-6FFG1152C by Xilinx

XC2V6000-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

824

824

8448

6000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V8000-4FFG1152C by Xilinx

XC2V8000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

11648

8000000

650 MHz

0.44 ns

CMOS

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V8000-4FFG1152I by Xilinx

XC2V8000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

11648

8000000

650 MHz

0.44 ns

CMOS

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V8000-5FFG1152C by Xilinx

XC2V8000-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

11648

8000000

750 MHz

0.39 ns

CMOS

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V8000-5FFG1152I by Xilinx

XC2V8000-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5);

FPGA

11648

8000000

750 MHz

0.39 ns

CMOS

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP20-5FFG1152C by Xilinx

XC2VP20-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

564

564

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP20-5FFG1152I by Xilinx

XC2VP20-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;

FPGA

20880

564

564

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP20-6FFG1152C by Xilinx

XC2VP20-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

564

564

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP20-6FFG1152I by Xilinx

XC2VP20-6FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

20880

564

564

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP20-7FFG1152C by Xilinx

XC2VP20-7FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

564

564

2320

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP30-5FFG1152C by Xilinx

XC2VP30-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

644

644

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP30-5FFG1152I by Xilinx

XC2VP30-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

30816

644

644

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP30-6FFG1152C by Xilinx

XC2VP30-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

644

644

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP30-6FFG1152I by Xilinx

XC2VP30-6FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 644;

FPGA

30816

644

644

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP30-7FFG1152C by Xilinx

XC2VP30-7FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

644

644

3424

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP40-5FFG1152C by Xilinx

XC2VP40-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

692

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP40-5FFG1152I by Xilinx

XC2VP40-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 4848;

FPGA

43632

692

692

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP40-6FFG1152C by Xilinx

XC2VP40-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

692

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP40-6FFG1152I by Xilinx

XC2VP40-6FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

43632

692

692

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP40-7FFG1152C by Xilinx

XC2VP40-7FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

692

4848

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP50-5FFG1152C by Xilinx

XC2VP50-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

852

852

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP50-5FFG1152I by Xilinx

XC2VP50-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5,1.5/3.3,2/2.5,2.5;

FPGA

53136

692

692

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP50-6FFG1152C by Xilinx

XC2VP50-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

692

692

5904

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP50-6FFG1152I by Xilinx

XC2VP50-6FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;

FPGA

53136

692

692

5904

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2VP50-7FFG1152C by Xilinx

XC2VP50-7FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

692

692

5904

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX100-10FFG1152C by Xilinx

XC4VFX100-10FFG1152C

Xilinx

The Xilinx XC4VFX100-10FFG1152C is a FPGA with 94896 logic cells, 10544 CLBs, and max clock frequency of 1028 MHz. It operates b/w -40 to 85°C and is ideal for high-performance computing applications requiring fast processing speeds in compact designs.

FPGA

94896

576

576

10544

1028 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX100-10FFG1152I by Xilinx

XC4VFX100-10FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;

FPGA

94896

576

576

10544

1028 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX100-11FFG1152C by Xilinx

XC4VFX100-11FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

94896

576

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX100-11FFG1152I by Xilinx

XC4VFX100-11FFG1152I

Xilinx

The Xilinx XC4VFX100-11FFG1152I is a FPGA with 94896 logic cells, 10544 CLBs, and max clock frequency of 1181 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

94896

576

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX40-10FFG1152C by Xilinx

XC4VFX40-10FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

41904

448

448

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX40-10FFG1152I by Xilinx

XC4VFX40-10FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;

FPGA

41904

448

448

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX40-11FFG1152C by Xilinx

XC4VFX40-11FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

41904

448

448

4656

1181 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX60-10FFG1152C by Xilinx

XC4VFX60-10FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX60-10FFG1152I by Xilinx

XC4VFX60-10FFG1152I

Xilinx

The Xilinx XC4VFX60-10FFG1152I is a FPGA with 56880 logic cells, 6320 CLBs, and max clock frequency of 1028 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX60-11FFG1152C by Xilinx

XC4VFX60-11FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX60-11FFG1152I by Xilinx

XC4VFX60-11FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;

FPGA

56880

576

576

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC4VFX60-12FFG1152C by Xilinx

XC4VFX60-12FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

MPF500T-FCG1152E by Microchip Technology

MPF500T-FCG1152E

Microchip Technology

MPF500T-FCG1152E by Microchip Technology is a FPGA with 481K logic cells, 584 inputs/outputs, CMOS technology, and operates b/w 0-100°C. It features a grid array package style with 1152 terminals in a square shape for surface mounting applications.

FPGA

481000

584

584

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF500T-FCG1152I by Microchip Technology

MPF500T-FCG1152I

Microchip Technology

MPF500T-FCG1152I by Microchip Technology is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and 1152 terminals in a grid array package. It operates b/w -40°C to 100°C, with supply voltage range of 0.97V to 1.03V. Ideal for high-performance computing applications requiring advanced programmable ICs.

FPGA

481000

584

584

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF500TLS-FCG1152I by Microchip Technology

MPF500TLS-FCG1152I

Microchip Technology

MPF500TLS-FCG1152I by Microchip Technology is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and 1152 terminals in a square grid array package. It operates b/w -40°C to 100°C, with supply voltage range of 0.97V to 1.03V. Ideal for high-performance applications requiring programmable ICs in compact form factors.

FPGA

481000

584

584

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF500TS-FCG1152I by Microchip Technology

MPF500TS-FCG1152I

Microchip Technology

MPF500TS-FCG1152I by Microchip Technology is a 481K logic cell FPGA with CMOS technology. Featuring 584 inputs/outputs, it operates b/w -40 to 100°C and has a package style of grid array. Ideal for applications requiring high-density programmable logic solutions in compact form factors.

FPGA

481000

584

584

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

MPF500TLFCG1152I by Microsemi

MPF500TLFCG1152I

Microsemi

MPF500TLFCG1152I by Microsemi is a 481K logic cell FPGA with CMOS tech. It has 584 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.

FPGA

481000

584

584

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.47 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGZME1H2F35I3LG by Intel

5AGZME1H2F35I3LG

Intel

Intel's 5AGZME1H2F35I3LG FPGA boasts 220,000 logic cells and 8302 CLBs. With 414 inputs/outputs, it operates b/w -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in a compact square package with a grid array style.

FPGA

220000

414

414

8302

8302 CLBS

0.85

.82 V

.88 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP3SE80F1152C2G by Intel

EP3SE80F1152C2G

Intel

EP3SE80F1152C2G by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of GRID ARRAY. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

80000

744

744

3200

3200 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP3SE80F1152C3G by Intel

EP3SE80F1152C3G

Intel

EP3SE80F1152C3G by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of grid array. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

80000

744

744

3200

3200 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152