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MPF500T-FCG1152I

Microchip Technology

MPF500T-FCG1152I by Microchip Technology

MPF500T-FCG1152I by Microchip Technology is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and 1152 terminals in a grid array package. It operates b/w -40°C to 100°C, with supply voltage range of 0.97V to 1.03V. Ideal for high-performance computing applications requiring advanced programmable ICs.

Median Price

$973.030

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

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$902.990

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$902.990

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Microchip Technology

USA . 2 parts In-Stock

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$973.030

100+ parts

$884.570

1k+ parts

$614.540

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2

$973.030

$884.570

$614.540

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DigiKey

USA . 22 parts In-Stock

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$973.040

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22

$973.040

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Distributors (In-Stock)

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Digiode

USA . 94 parts In-Stock

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$924.454

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94

$924.454

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Nova Conductors

Japan . 800 parts In-Stock

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$1,119.920

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800

$1,119.920

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Vyrian

USA . 8,101 parts In-Stock

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Chip Stock

USA . 1,471 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 978 parts In-Stock

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$19.864

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978

$19.864

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Vigor

Singapore . 401 parts In-Stock

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$800.390

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$800.390

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Ampacity Inc.

Singapore . 46 parts In-Stock

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$827.140

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$827.140

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Semicontronic

India . 23 parts In-Stock

1+ parts

$827.140

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$806.462

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$802.326

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Corphita

USA . 213 parts In-Stock

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$875.799

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Continental Prestige Electronics

USA . 12,475 parts In-Stock

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$1,119.920

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$1,097.522

12,475

$1,119.920

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$1,097.522

Netroflash

USA . 4,000 parts In-Stock

1+ parts

$1,119.920

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1k+ parts

$1,063.924

10k+ parts

$1,041.526

4,000

$1,119.920

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$1,063.924

$1,041.526

Argo Parts USA

USA . 2,759 parts In-Stock

1+ parts

$1,119.920

100+ parts

$1,108.721

1k+ parts

$1,097.522

10k+ parts

$1,086.322

2,759

$1,119.920

$1,108.721

$1,097.522

$1,086.322

Fulton Briggs Corp.

USA . 1,436 parts In-Stock

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1,436

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Overview

Experience unparalleled performance and versatility with the MPF500T-FCG1152I by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-quality Field Programmable Gate Arrays (FPGAs) that cater to a wide range of applications. With 481,000 logic cells and 584 inputs/outputs, this FPGA offers unmatched flexibility and precision. Its advanced CMOS technology ensures efficient operation while the compact square package design makes installation a breeze. Trust Microchip to provide cutting-edge solutions that exceed expectations and unlock endless possibilities for your projects. Elevate your designs with the MPF500T-FCG1152I today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and durable housing for the FPGA, ensuring reliability in various operating conditions.

No. of Logic Cells: 481000

Large number of logic cells allow for complex programming and customization, making it suitable for a wide range of applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high speed, making the FPGA efficient and fast in processing data.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the FPGA can operate in extreme cold conditions, enhancing its versatility.

Maximum Seated Height: 3.47 mm

Low profile design allows for easy integration in compact electronic systems, saving space and improving overall system performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500T-FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

584

No. of Outputs:

584

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF500T-FCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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