Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Microsemi's MPF500TSFCG1152I is a 481K logic cell FPGA with 584 inputs/outputs. Operating b/w -40°C to 100°C, it uses CMOS technology and has a supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density programmable ICs in a grid array package style.
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Provides a durable and cost-effective packaging solution for the FPGA, ensuring longevity and protection for the internal components.
Large number of logic cells allows for complex programmable logic designs to be implemented effectively, making it suitable for a wide range of applications.
Surface mount compatibility enables easy and convenient integration of the FPGA onto circuit boards, saving space and simplifying assembly processes.
Operates efficiently within a specified voltage range, ensuring reliable performance without risking damage to the FPGA.
CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the overall efficiency and performance of the FPGA.
Generous number of inputs allows for versatile input sources to be connected, enabling the FPGA to process a wide range of data inputs efficiently.
Square shape provides a uniform and compact footprint for the FPGA, optimizing space utilization within electronic devices or systems.
Ball terminal design ensures secure and reliable connections with the circuit board, reducing the risk of signal interference or disconnection.
Abundance of terminals allows for multiple connections to be established, facilitating the integration of the FPGA within complex circuitry or systems.
Being a field programmable device, the FPGA offers flexibility and reconfigurability, allowing for on-the-fly modifications and optimizations to meet specific application requirements.
Grid array package style provides a high terminal density for efficient interconnection with other components, enhancing signal integrity and system performance.
Low minimum supply voltage requirement enables energy-efficient operation and extends the battery life of portable electronic devices utilizing the FPGA.
High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions, making the FPGA suitable for a wide range of applications.
Terminal pitch of 1mm facilitates easy and accurate soldering or mounting of the FPGA onto the circuit board, improving assembly efficiency and reliability.
Wide range of minimum operating temperature allows the FPGA to function effectively in extreme cold environments, ensuring consistent performance under various conditions.
Terminal positioned at the bottom of the package enables efficient heat dissipation and minimizes signal interference, contributing to the overall reliability of the FPGA.
Low seated height profile minimizes the vertical space occupied by the FPGA on the circuit board, enabling compact and sleek design of electronic devices.
Optimal width dimension ensures compatibility with standard board sizes and layouts, facilitating easy integration of the FPGA into electronic systems or prototypes.
Balanced number of outputs enables the FPGA to process and deliver data efficiently to external components or systems, enhancing overall performance and functionality.
Compact length dimension allows for space-efficient placement of the FPGA on the circuit board, enabling streamlined design and layout of electronic devices or systems.
Field Programmable Gate Arrays (FPGA) MPF500TSFCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi
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MPF500TSFCG1152I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.
1N4148
Nte Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
B340A-13-F
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
Itt Semiconductor
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
MBRS1100T3G
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
Semitronics
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
XC6SLX25-2FTG256I
Xilinx
Xilinx XC6SLX25-2FTG256I FPGA features 24051 logic cells, 1879 CLBs, and max clock frequency of 667MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile.
XC7A50T-1CPG236C
The Xilinx XC7A50T-1CPG236C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
LCMXO2-256ZE-1MG132I
Lattice Semiconductor
LCMXO2-256ZE-1MG132I by Lattice Semiconductor is a 256 Logic Cell FPGA with 55 inputs/outputs. Operating at 1.2V, it has a temp range of -40 to 100°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.
5CEBA7F23C8N
Altera
The Altera 5CEBA7F23C8N is a Field Programmable Gate Array (FPGA) with a maximum supply voltage of 1.13V. It is a plastic/epoxy package with surface mount capabilities and a square shape. The FPGA has 484 terminals and a nominal supply voltage of 1.1V. It operates in temperatures ranging from 0 to 85 degrees Celsius. The package style is a grid array with a pitch of 1mm. Its compact size, wide temperature range, and programmability make it suitable for various applications requiring high-speed digital signal processing and data storage.
XC7A15T-3FTG256E
The Xilinx XC7A15T-3FTG256E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XCAU20P-1SFVB784I
Xilinx XCAU20P-1SFVB784I FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch.
A3P1000-FGG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7A15T-2CSG325I
Xilinx XC7A15T-2CSG325I FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing with a wide operating temperature range from -40 to 100°C. Package style is grid array with low profile and fine pitch terminals.
LCMXO1200C-3FTN256C
LCMXO1200C-3FTN256C by Lattice Semiconductor is a FPGA with 1200 logic cells, 150 CLBs, and 211 inputs/outputs. It operates at 1.8V nominal voltage and can withstand temperatures from 0 to 85°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.
10CX150YF780I5G
Intel
Intel's 10CX150YF780I5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at -40 to 100 °C, it has 284 inputs/outputs for industrial applications. Utilizes TSMC tech with 0.87-0.93 V supply voltage range in a grid array package.
XC7A200T-2FFG1156I
XC7A200T-2FFG1156I by Xilinx is a Field Programmable Gate Array (FPGA) with 215360 logic cells. It has a max clock frequency of 1286 MHz and can operate at temperatures up to 100°C. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.
XC7K325T-1FB676I
XC7K325T-1FB676I by Xilinx is a CMOS-based FPGA with 326080 logic cells and a max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.
EP4CE75F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
EP3C25F324C8NES
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: RECTANGULAR;
M7A3P1000-PQG208I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XCAU20P-L1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY;
XC7A15T-1FTG256C
XC7A15T-1FTG256C by Xilinx is a Field Programmable Gate Array (FPGA) with 16640 logic cells and 1300 CLBs. It has a max clock frequency of 1098 MHz and is commonly used in applications requiring high-speed processing and programmability.
ICE40LP8K-CM81
ICE40LP8K-CM81 by Lattice Semiconductor is a CMOS FPGA with 7680 logic cells, 960 CLBs, and 63 inputs/outputs. It operates at 1.2V with a max supply voltage of 1.26V and has a combinatorial delay of 9.36ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.
EP4CE6E22C8N
EP4CE6E22C8N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
EP4CE15F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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MPF500TS-FC1152M
Microchip Technology
MPF500TS-FC1152M by Microchip: 481K logic cells, 584 inputs/outputs, CMOS tech. Ideal for military applications with -55 to 125°C temp range. Package: grid array, square shape, surface mountable.
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
MPF500TS-1FCG784I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TFCG1152E
Microsemi's MPF500TFCG1152E is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and operates b/w 0-100°C. Its grid array package has 1152 terminals on a 35x35mm square body, making it ideal for high-performance applications requiring programmable ICs.
MPF500T-FCG1152E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 584;
MPF500T-1FCG784E
MPF500T-1FCG784E by Microchip Technology is a CMOS-based FPGA with 481,000 logic cells. It has a package style of grid array and a max supply voltage of 1.03V. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.
MPF500T-1FCG784I
MPF500T-1FCG784I by Microchip Tech is a 481K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.
MPF500T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TL-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
MPF500TLFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 584;
MPF500TLS-FCG784I
MPF500TLS-FCG784I by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w -40 to 100°C. It features a grid array package style, plastic/epoxy body material, and ball terminals. Ideal for applications requiring high-density programmable logic solutions.
MPF500TFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
MPF500T-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
MPF500TS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPF500T-FCG784E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MPF500TLS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
MPF500TLSFCG1152I
MPF500TS-FC784M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;
MPF500TS-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Length: 35 mm;
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