Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
MPF500T-FCG784E by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w 0-100°C. It features a grid array package style, 784 ball terminals in a square shape, and surface mount capability. Ideal for applications requiring high-speed data processing and complex logic functions in electronic systems.
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PLASTIC/EPOXY material provides durability and protection for the components inside, making the FPGA reliable and long-lasting.
With a high number of logic cells, this FPGA can handle complex and large-scale digital designs effectively.
Surface mount technology enables easy and efficient installation of the FPGA on PCBs, saving time and effort during the manufacturing process.
The low maximum supply voltage of 1.03 V helps in reducing power consumption and heat generation, making the FPGA energy efficient.
CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the FPGA suitable for a wide range of applications.
With a high number of inputs, the FPGA can accommodate a large number of signals and data inputs, making it versatile and suitable for diverse applications.
The square package shape provides optimal use of space on a PCB, allowing for efficient layout and integration with other components.
Ball terminals offer reliable connections and easy soldering during installation, ensuring a secure and stable connection for the FPGA.
With a high number of terminals, the FPGA can provide multiple connectivity options, allowing for versatile integration with external devices and components.
Being a Field Programmable Gate Array, this IC type allows for flexible and customizable designs, making it suitable for prototyping and development purposes.
The grid array package style provides a compact and efficient layout of terminals, enabling easy and secure connections on the PCB.
The low minimum supply voltage of 0.97 V ensures reliable operation of the FPGA even under low-power conditions, making it suitable for energy-efficient applications.
With a high maximum operating temperature of 100°C, this FPGA can withstand harsh environmental conditions and high temperature fluctuations, ensuring reliable performance in challenging environments.
The 1 mm terminal pitch allows for compact and efficient placement of terminals, enabling a high density of connections on the PCB for enhanced functionality.
With a minimum operating temperature of 0°C, this FPGA can operate efficiently in a wide range of temperature conditions, ensuring reliable performance in various environments.
Having terminals at the bottom allows for easy and convenient PCB layout and solder connections, making the FPGA installation process smooth and efficient.
The maximum seated height of 3.47 mm ensures a compact and low-profile design of the FPGA, making it suitable for space-constrained applications and PCB layouts.
The 29 mm width provides a compact form factor, allowing for efficient use of space on the PCB and enabling easy integration with other components in the system.
With a high number of outputs, the FPGA can transmit a large amount of data and signals, enabling versatile and high-performance functionality in various applications.
The 29 mm length offers a balanced and compact size for the FPGA, allowing for efficient placement on the PCB and optimal space utilization in the system design.
Field Programmable Gate Arrays (FPGA) MPF500T-FCG784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
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Technology:
Additional Features:
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Maximum Supply Voltage:
Minimum Operating Temperature:
Maximum Operating Temperature:
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Surface Mountable:
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JESD-30 Code:
MPF500T-FCG784E Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Revised timing data 26/Aug/2021 Datasheet Update 02/Jun/2022
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
PCN Other - Security change 29/May/2019
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
261
Deltrol Controls
Other Relays;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
Changzhou Starsea Electronics
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
BAV99
Philips Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
10M25DAF256C8G
The Intel 10M25DAF256C8G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high-speed processing and programmable logic capabilities in various electronic systems.
XA6SLX45-3CSG324Q
Xilinx
The Xilinx XA6SLX45-3CSG324Q is a FPGA with 43661 logic cells, 218 inputs/outputs, and max clock frequency of 62.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
A3P250-FGG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCAU10P-L1UBVA368I
FIELD PROGRAMMABLE GATE ARRAY;
XC7A35T-1CSG324I
The Xilinx XC7A35T-1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. With a package style of grid array and low profile, it offers versatile integration options for various electronic systems.
XC7K325T-3FFG900E
Xilinx XC7K325T-3FFG900E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds.
XC7A200T-3FFG1156E
The Xilinx XC7A200T-3FFG1156E is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7A100T-2FTG256C
Xilinx XC7A100T-2FTG256C is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1286 MHz. Ideal for high-speed applications requiring low profile grid array packages. Operating temp range: 0-85°C.
10M08DAF256I7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 8000;
XCAU20P-1SFVB784E
Xilinx XCAU20P-1SFVB784E is a FPGA with 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. It operates b/w -40°C to 100°C, with supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance programmable ICs in compact form factors.
XC6SLX9-2CSG225I
Xilinx XC6SLX9-2CSG225I FPGA features 9152 logic cells, 715 CLBs, and 160 inputs/outputs. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages of 1.14V to 1.26V.
EP3C16F484C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
LCMXO2-4000HC-4FTG256I
Lattice Semiconductor
LCMXO2-4000HC-4FTG256I by Lattice Semiconductor is a FPGA with 4320 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-performance computing, signal processing, and embedded systems due to its low profile grid array package style.
XC7S25-1FTGB196C
Xilinx XC7S25-1FTGB196C is a 23360 logic cell FPGA with 1825 CLBs, 150 inputs/outputs, and max clock freq of 1098 MHz. Ideal for high-speed applications requiring low power consumption and compact design. Package style: grid array, low profile, fine pitch.
10M25DAF256I7G
The 10M25DAF256I7G by Altera is a PLASTIC/EPOXY FPGA with 25000 logic cells, CMOS technology, and 178 inputs/outputs. It comes in a BGA package with 256 terminals and a pitch of 1mm. This FPGA operates at a nominal supply voltage of 1.2V and is suitable for various applications requiring programmable ICs.
10M16SAU169I7G
The Intel 10M16SAU169I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
10M16SCU169A7G
Intel's 10M16SCU169A7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and 0.8mm terminal pitch.
10M08SCU169A7G
The Intel 10M08SCU169A7G is a Field Programmable Gate Array with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 125°C. Ideal for automotive applications due to its high reliability and performance in harsh environments.
EP3C10F256C8N
EP3C10F256C8N by Intel is a FPGA with 10320 logic cells, 182 inputs/outputs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.
10M16SAE144I7G
Intel 10M16SAE144I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at 2.85-3.15V, -40 to 100°C, ideal for industrial applications requiring high-performance programmable ICs in compact form factors with low power consumption.
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MPF500TS-FC1152M
Microchip Technology
MPF500TS-FC1152M by Microchip: 481K logic cells, 584 inputs/outputs, CMOS tech. Ideal for military applications with -55 to 125°C temp range. Package: grid array, square shape, surface mountable.
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
MPF500TS-1FCG784I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TFCG1152E
Microsemi's MPF500TFCG1152E is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and operates b/w 0-100°C. Its grid array package has 1152 terminals on a 35x35mm square body, making it ideal for high-performance applications requiring programmable ICs.
MPF500T-FCG1152E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 584;
MPF500T-1FCG784E
MPF500T-1FCG784E by Microchip Technology is a CMOS-based FPGA with 481,000 logic cells. It has a package style of grid array and a max supply voltage of 1.03V. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.
MPF500T-1FCG784I
MPF500T-1FCG784I by Microchip Tech is a 481K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.
MPF500T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TL-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
MPF500TLFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 584;
MPF500TLS-FCG784I
MPF500TLS-FCG784I by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w -40 to 100°C. It features a grid array package style, plastic/epoxy body material, and ball terminals. Ideal for applications requiring high-density programmable logic solutions.
MPF500TFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
MPF500T-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
MPF500TSFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.47 mm;
MPF500TS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPF500TLS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
MPF500TLSFCG1152I
MPF500TS-FC784M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;
MPF500T-1FCG1152E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1;
Supply Digital Components
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