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MPF500TS-1FCG784I

Microchip Technology

MPF500TS-1FCG784I by Microchip Technology

MPF500TS-1FCG784I by Microchip Technology is a CMOS FPGA with 481K logic cells, 388 inputs/outputs. It operates b/w -40 to 100°C, has a package size of 29x29mm and uses a grid array style. Ideal for applications requiring high-density programmable logic in compact form factors.

Median Price

$1,202.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 20 parts In-Stock

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$1,189.310

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20

$1,189.310

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Digiode

USA . 238 parts In-Stock

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$1,216.570

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238

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Vyrian

USA . 5,213 parts In-Stock

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Chip Stock

USA . 721 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 679 parts In-Stock

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$5.198

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679

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Corohmni

South Africa . 273 parts In-Stock

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$31.789

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Aztec Data Supply Inc.

USA . 65 parts In-Stock

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$100.930

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65

$100.930

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Vigor

Singapore . 839 parts In-Stock

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$970.160

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839

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$1,088.510

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Corphita

USA . 104 parts In-Stock

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$1,152.540

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Continental Prestige Electronics

USA . 4,157 parts In-Stock

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$1,189.310

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$1,165.524

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Argo Parts USA

USA . 1,968 parts In-Stock

1+ parts

$1,189.310

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$1,177.417

1k+ parts

$1,165.524

10k+ parts

$1,153.631

1,968

$1,189.310

$1,177.417

$1,165.524

$1,153.631

Semicontronic

India . 6 parts In-Stock

1+ parts

$2,369.110

100+ parts

$2,309.882

1k+ parts

$2,298.037

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6

$2,369.110

$2,309.882

$2,298.037

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LMD Electronica

Estonia . 8,279 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,780 parts In-Stock

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Montano Global Distributors

Canada . 1,418 parts In-Stock

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NIA Electronics

USA . 799 parts In-Stock

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Ledger Components

France . 799 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the MPF500TS-1FCG784I by Microchip Technology. As a leading manufacturer of Field Programmable Gate Arrays (FPGA), Microchip guarantees top-quality products designed to meet your needs. This versatile FPGA offers a multitude of applications, providing unmatched flexibility and customization. Experience seamless integration, enhanced performance, and optimized functionality with this innovative solution. Trust Microchip for reliable, high-performance products that deliver value and efficiency to every customer. Step into the future with the MPF500TS-1FCG784I and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and heat resistance, making it a reliable choice for the product.

No. of Logic Cells: 481000

With a large number of logic cells, this FPGA allows for complex programmable functionality and flexibility in design.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage allows for increased performance and efficiency in power consumption.

Technology Used: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making this FPGA energy efficient and reliable.

No. of Inputs: 388

With a high number of inputs, this FPGA can accommodate a large amount of data and signals for processing.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout for the terminals, making it easier for integration and assembly.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that this FPGA remains operational in a wide range of environmental conditions.

No. of Outputs: 388

The balanced number of outputs to inputs allows for efficient processing and signal routing within the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500TS-1FCG784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF500TS-1FCG784I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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