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MPF500TLFCG1152I

Microsemi

MPF500TLFCG1152I by Microsemi

MPF500TLFCG1152I by Microsemi is a 481K logic cell FPGA with CMOS tech. It has 584 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.

Median Price

$1,306.560

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 1,050 parts In-Stock

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$1,306.560

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Vyrian

USA . 4,395 parts In-Stock

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Chip Stock

USA . 843 parts In-Stock

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843

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Digiode

USA . 293 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,654 parts In-Stock

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$9.887

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Semicontronic

India . 930 parts In-Stock

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$14.000

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$13.650

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$13.580

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930

$14.000

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$13.580

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Ampacity Inc.

Singapore . 1,159 parts In-Stock

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$27.000

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Corohmni

South Africa . 516 parts In-Stock

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$51.502

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Vigor

Singapore . 130 parts In-Stock

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$933.790

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Continental Prestige Electronics

USA . 9,976 parts In-Stock

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$1,280.429

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Argo Parts USA

USA . 5,189 parts In-Stock

1+ parts

$1,306.560

100+ parts

$1,293.494

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$1,280.429

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$1,267.363

5,189

$1,306.560

$1,293.494

$1,280.429

$1,267.363

QualityLine Systems

Poland . 6,973 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,069 parts In-Stock

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XL Components Corporation

Australia . 4,187 parts In-Stock

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Corphita

USA . 449 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$1,280.429

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$1,241.232

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$1,215.101

100

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$1,280.429

$1,241.232

$1,215.101

Overview

Unleash the power of cutting-edge technology with the MPF500TLFCG1152I by Microsemi. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Microsemi delivers top-quality products that offer unmatched performance and reliability. With 481,000 logic cells and 584 inputs and outputs, this FPGA is perfect for a wide range of applications. Experience the value and benefits of this innovative product, from its superior design to its advanced features - the MPF500TLFCG1152I is the ultimate solution for your technological needs.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness, making the product reliable and affordable.

No. of Logic Cells - 481000

With a high number of logic cells, this FPGA offers extensive processing capabilities and flexibility for complex applications.

Surface Mount - YES

The surface mount feature allows for easy and efficient integration onto circuit boards, simplifying the assembly process.

Maximum Supply Voltage - 1.03 V

The low maximum supply voltage helps in minimizing power consumption and heat generation, leading to energy-efficient operation.

Technology Used - CMOS

CMOS technology provides low power consumption, high noise immunity, and high speed performance, making the FPGA efficient and reliable.

No. of Inputs - 584

The high number of inputs allows for diverse connectivity options and input/output configurations, increasing the versatility of the product.

Package Shape - SQUARE

The square package shape offers efficient use of space on the circuit board, enabling compact and streamlined designs.

Form Of Terminal - BALL

The ball terminals provide a secure and reliable connection, ensuring stable performance and reducing the risk of signal interference.

No. of Terminals - 1152

With a large number of terminals, the FPGA allows for extensive connectivity options and robust communication interfaces.

Programmable IC Type - FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA can be reconfigured and customized for different applications, offering flexibility and adaptability.

Package Style (Meter) - GRID ARRAY

The grid array package style provides a well-structured and organized layout, facilitating easy assembly and maintenance of the product.

Minimum Supply Voltage - 0.97 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and helps in achieving stable performance in varying operating conditions.

Maximum Operating Temperature - 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and maintain reliable performance under challenging circumstances.

Pitch Of Terminal - 1 mm

The small terminal pitch allows for high density integration and precise connections, enhancing the overall efficiency and performance of the product.

Minimum Operating Temperature - (-40 °C)

The low minimum operating temperature ensures functionality in cold environments and provides reliability in a wide range of temperature conditions.

Position Of Terminal - BOTTOM

The bottom terminal position simplifies the PCB layout and routing, optimizing signal integrity and reducing interference for improved performance.

Maximum Seated Height - 3.47 mm

The low maximum seated height enables the FPGA to fit into compact spaces and slim designs, enhancing the overall flexibility and space efficiency of the product.

Width - 35 mm

The moderate width provides a balance between compactness and accessibility, allowing for easy integration into various electronic systems and devices.

No. of Outputs - 584

With a high number of outputs, the FPGA can drive multiple devices and interfaces simultaneously, offering extensive connectivity options and communication capabilities.

Length - 35 mm

The moderate length of the FPGA ensures compatibility with standard PCB sizes and facilitates convenient placement within electronic systems, promoting ease of use and integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500TLFCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

584

No. of Outputs:

584

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF500TLFCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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