Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MPF500T-1FCG784E by Microchip Technology is a CMOS-based FPGA with 481,000 logic cells. It has a package style of grid array and a max supply voltage of 1.03V. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.
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This product's use of plastic/epoxy material makes it lightweight and durable, ideal for applications where weight and durability are important factors.
With a high number of logic cells, this FPGA offers ample capacity for complex designs and advanced processing capabilities, making it suitable for demanding applications.
The surface mount feature allows for easy and efficient installation, enabling seamless integration into circuit boards and reducing production time.
The high maximum supply voltage ensures stable and reliable operation of the FPGA, even under demanding electrical conditions.
CMOS technology provides low power consumption and high noise immunity, making this FPGA efficient and reliable in various applications.
With a considerable number of inputs, this FPGA can handle a wide range of data inputs, accommodating complex input requirements and providing flexibility in design.
The square package shape allows for efficient utilization of space on circuit boards, enabling compact and space-saving designs.
The use of ball terminals provides excellent electrical connections and allows for a reliable and secure connection, enhancing the overall performance of the FPGA.
With a high number of terminals, this FPGA offers versatility and compatibility with various interface connections, supporting complex system architectures.
The programmable IC type of this FPGA provides flexibility in customization and design modifications, allowing for efficient prototyping and adaptation to specific requirements.
The grid array package style offers a well-organized and standardized arrangement of terminals, facilitating easy assembly, maintenance, and troubleshooting.
The low minimum supply voltage ensures efficient power utilization and extends battery life, making it suitable for energy-efficient applications.
The high maximum operating temperature allows this FPGA to operate reliably in harsh environments or demanding applications, ensuring consistent performance.
The 1 mm terminal pitch provides compatibility with various connectors and improves signal integrity, contributing to overall system efficiency.
The low minimum operating temperature enables reliable operation in cold environments, making this FPGA suitable for a wide range of applications.
The bottom terminal position enables efficient thermal dissipation and facilitates heat management, ensuring the FPGA's stability and performance.
The maximum seated height ensures this FPGA can be easily integrated into compact designs, allowing for efficient use of space on circuit boards.
The width of 29 mm allows for easy placement and compatibility with standard board sizes, simplifying the integration process and reducing design constraints.
With a significant number of outputs, this FPGA can handle multiple data outputs simultaneously, supporting complex output requirements and enhancing system functionality.
The length of 29 mm ensures convenient fitment within system designs and compatibility with standard board sizes, making it easier to incorporate this FPGA into various applications.
Field Programmable Gate Arrays (FPGA) MPF500T-1FCG784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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JESD-30 Code:
MPF500T-1FCG784E Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet Update 02/Jun/2022 Revised timing data 26/Aug/2021
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
PCN Other - Security change 29/May/2019
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
LM358N
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
LM358AN
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
Signetics
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
M2GL010-TQG144I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
5CEBA4F17C8N
Intel
Intel's 5CEBA4F17C8N FPGA boasts 49000 logic cells, 128 inputs/outputs, and operates at a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementations in various industries.
XC7A35T-2CSG324C
Xilinx
Xilinx XC7A35T-2CSG324C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with low profile grid array package style.
LFE5U-25F-6BG256C
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
XCAU10P-2SBVB484I
FIELD PROGRAMMABLE GATE ARRAY;
XC7S6-1FTGB196I
Xilinx XC7S6-1FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and 1098 MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.
XCKU3P-1FFVB676I
Xilinx XCKU3P-1FFVB676I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.
LCMXO2-640HC-4MG132I
LCMXO2-640HC-4MG132I by Lattice Semiconductor is a FPGA with 640 logic cells, 79 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-performance computing and programmable IC solutions.
EP3C25E144I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
XC7K160T-1FFG676C
XC7K160T-1FFG676C by Xilinx is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It operates at supply voltages ranging from 0.97V to 3.3V and is used in applications requiring high-speed processing and programmable ICs.
EP1C6T144I7N
M2GL010-TQG144I by Microchip is a 144-terminal FPGA with max supply voltage of 1.26V, suitable for industrial applications. With a square package and gull wing terminals, it operates b/w -40 to 100 °C and has a low profile flatpack style. Ideal for high-performance electronic systems requiring programmable ICs in compact form factors.
XCAU25P-2SFVB784E
XCAU20P-L1SFVB784I
LCMXO3LF-4300E-5UWG81CTR1K
LCMXO3LF-4300E-5UWG81CTR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 0.4mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact designs.
A3P1000-FGG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7S75-1FGGA676I
Xilinx XC7S75-1FGGA676I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 400 inputs/outputs.
XC7S50-2CSGA324I
The Xilinx XC7S50-2CSGA324I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications for high-speed data processing due to its low profile package style and fine pitch grid array design.
5CEFA7F23I7N
Intel's 5CEFA7F23I7N FPGA boasts 149.5K logic cells and operates at a max supply voltage of 1.13V. Ideal for applications requiring high-speed processing, with 240 inputs/outputs and CMOS technology ensuring efficient performance in a compact square package.
XC6VLX760-1FFG1760I
Xilinx XC6VLX760-1FFG1760I FPGA features 758784 logic cells, operates at max 1098 MHz clock frequency, and supports CMOS technology. Ideal for industrial applications requiring high-speed processing with a wide range of inputs/outputs and low power consumption.
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MPF500TS-FC1152M
MPF500TS-FC1152M by Microchip: 481K logic cells, 584 inputs/outputs, CMOS tech. Ideal for military applications with -55 to 125°C temp range. Package: grid array, square shape, surface mountable.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
MPF500TS-1FCG784I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TFCG1152E
Microsemi's MPF500TFCG1152E is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and operates b/w 0-100°C. Its grid array package has 1152 terminals on a 35x35mm square body, making it ideal for high-performance applications requiring programmable ICs.
MPF500T-FCG1152E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 584;
MPF500T-1FCG784I
MPF500T-1FCG784I by Microchip Tech is a 481K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.
MPF500T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TL-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
MPF500TLFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 584;
MPF500TLS-FCG784I
MPF500TLS-FCG784I by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w -40 to 100°C. It features a grid array package style, plastic/epoxy body material, and ball terminals. Ideal for applications requiring high-density programmable logic solutions.
MPF500TFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
MPF500T-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
MPF500TSFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.47 mm;
MPF500TS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPF500T-FCG784E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MPF500TLS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
MPF500TLSFCG1152I
MPF500TS-FC784M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;
MPF500T-1FCG1152E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1;
Supply Digital Components
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