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MPF500T-1FCG784E

Microchip Technology

MPF500T-1FCG784E by Microchip Technology

MPF500T-1FCG784E by Microchip Technology is a CMOS-based FPGA with 481,000 logic cells. It has a package style of grid array and a max supply voltage of 1.03V. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.

Median Price

$884.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1 parts In-Stock

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$884.570

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$804.150

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$558.670

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1

$884.570

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$558.670

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Distributors (In-Stock)

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Digiode

USA . 288 parts In-Stock

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$840.398

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288

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Nova Conductors

Japan . 50 parts In-Stock

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$891.989

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$891.989

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Vyrian

USA . 3,658 parts In-Stock

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Chip Stock

USA . 1,262 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

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$19.375

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Semicontronic

India . 375 parts In-Stock

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$20.000

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$19.500

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$19.400

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$19.400

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Ampacity Inc.

Singapore . 1,335 parts In-Stock

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$23.000

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Aztec Data Supply Inc.

USA . 788 parts In-Stock

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$52.640

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Corohmni

South Africa . 2 parts In-Stock

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$106.919

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Vigor

Singapore . 991 parts In-Stock

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Corphita

USA . 393 parts In-Stock

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$796.167

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Argo Parts USA

USA . 4,608 parts In-Stock

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$891.989

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$883.069

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$874.149

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$865.229

4,608

$891.989

$883.069

$874.149

$865.229

Continental Prestige Electronics

USA . 657 parts In-Stock

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$891.989

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$874.149

657

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$874.149

Advanced Electronics

New Zealand . 84 parts In-Stock

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$902.333

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$902.333

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$902.333

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LOOK Integrated Logistics

Peru . 5,930 parts In-Stock

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Montano Global Distributors

Canada . 4,472 parts In-Stock

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NIA Electronics

USA . 1,947 parts In-Stock

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Ledger Components

France . 1,947 parts In-Stock

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LMD Electronica

Estonia . 1,246 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$874.149

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$847.389

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$829.549

500

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$874.149

$847.389

$829.549

Overview

Introducing the MPF500T-1FCG784E by Microchip Technology, a game-changer in the field of Field Programmable Gate Arrays (FPGA). With its superior quality and expert craftsmanship from Microchip Technology, this FPGA offers unmatched performance and reliability. Whether you need it for industrial automation, telecommunications, or aerospace applications, the MPF500T-1FCG784E delivers exceptional value and undeniable benefits. Its advanced technology, countless logic cells, and extensive inputs and outputs make it the go-to choice for high-performance projects. Experience the power of innovation with the MPF500T-1FCG784E, your solution for all FPGA needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy material makes it lightweight and durable, ideal for applications where weight and durability are important factors.

No. of Logic Cells: 481000

With a high number of logic cells, this FPGA offers ample capacity for complex designs and advanced processing capabilities, making it suitable for demanding applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, enabling seamless integration into circuit boards and reducing production time.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures stable and reliable operation of the FPGA, even under demanding electrical conditions.

Technology Used: CMOS

CMOS technology provides low power consumption and high noise immunity, making this FPGA efficient and reliable in various applications.

No. of Inputs: 388

With a considerable number of inputs, this FPGA can handle a wide range of data inputs, accommodating complex input requirements and providing flexibility in design.

Package Shape: SQUARE

The square package shape allows for efficient utilization of space on circuit boards, enabling compact and space-saving designs.

Form Of Terminal: BALL

The use of ball terminals provides excellent electrical connections and allows for a reliable and secure connection, enhancing the overall performance of the FPGA.

No. of Terminals: 784

With a high number of terminals, this FPGA offers versatility and compatibility with various interface connections, supporting complex system architectures.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The programmable IC type of this FPGA provides flexibility in customization and design modifications, allowing for efficient prototyping and adaptation to specific requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers a well-organized and standardized arrangement of terminals, facilitating easy assembly, maintenance, and troubleshooting.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures efficient power utilization and extends battery life, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows this FPGA to operate reliably in harsh environments or demanding applications, ensuring consistent performance.

Pitch Of Terminal: 1 mm

The 1 mm terminal pitch provides compatibility with various connectors and improves signal integrity, contributing to overall system efficiency.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature enables reliable operation in cold environments, making this FPGA suitable for a wide range of applications.

Position Of Terminal: BOTTOM

The bottom terminal position enables efficient thermal dissipation and facilitates heat management, ensuring the FPGA's stability and performance.

Maximum Seated Height: 3.47 mm

The maximum seated height ensures this FPGA can be easily integrated into compact designs, allowing for efficient use of space on circuit boards.

Width: 29 mm

The width of 29 mm allows for easy placement and compatibility with standard board sizes, simplifying the integration process and reducing design constraints.

No. of Outputs: 388

With a significant number of outputs, this FPGA can handle multiple data outputs simultaneously, supporting complex output requirements and enhancing system functionality.

Length: 29 mm

The length of 29 mm ensures convenient fitment within system designs and compatibility with standard board sizes, making it easier to incorporate this FPGA into various applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500T-1FCG784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF500T-1FCG784E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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