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MPF500TS-FC784M

Microchip Technology

MPF500TS-FC784M by Microchip Technology

MPF500TS-FC784M by Microchip Technology is a CMOS FPGA with 481K logic cells, 388 inputs/outputs, and MILITARY-grade temperature rating. It features a GRID ARRAY package style, PLASTIC/EPOXY body material, and operates b/w -55 to 125 °C. Ideal for high-performance applications requiring advanced programmable ICs in compact form factors.

Median Price

$1,122.988

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$900.775

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200

$900.775

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Digiode

USA . 263 parts In-Stock

1+ parts

$1,345.200

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263

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Vyrian

USA . 800 parts In-Stock

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800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,501 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

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-

1,501

$5.000

$4.875

$4.850

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Ampacity Inc.

Singapore . 401 parts In-Stock

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$16.000

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401

$16.000

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AZTECH Wire

Italy . 260 parts In-Stock

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$16.257

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$16.257

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Aranea Global

USA . 2,000 parts In-Stock

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$882.760

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$847.449

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2,000

$882.760

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$847.449

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Continental Prestige Electronics

USA . 457 parts In-Stock

1+ parts

$900.775

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$882.760

457

$900.775

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$882.760

Argo Parts USA

USA . 381 parts In-Stock

1+ parts

$900.775

100+ parts

$891.767

1k+ parts

$882.760

10k+ parts

$873.752

381

$900.775

$891.767

$882.760

$873.752

Corphita

USA . 323 parts In-Stock

1+ parts

$1,274.400

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323

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QualityLine Systems

Poland . 5,101 parts In-Stock

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XL Components Corporation

Australia . 4,962 parts In-Stock

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Marpe Global Electronics

Taiwan . 2,833 parts In-Stock

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2,833

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Microchip USA

USA . 1,956 parts In-Stock

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Overview

Experience the unmatched quality of Microchip Technology with the MPF500TS-FC784M Field Programmable Gate Array. This advanced technology offers 481,000 logic cells and 388 inputs and outputs in a compact square package. Ideal for military-grade applications, this FPGA provides high performance and reliability. Trust in the innovation and expertise of Microchip Technology to bring you cutting-edge solutions that meet your needs and exceed your expectations. Unlock the full potential of your projects with the MPF500TS-FC784M.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the FPGA easier to handle and less expensive to manufacture.

No. of Logic Cells: 481000

With a large number of logic cells, this FPGA is suitable for complex designs and high computational tasks.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards and reduces the overall footprint of the system.

Maximum Supply Voltage: 1.03 V

The ability to operate at a relatively low maximum supply voltage helps in reducing power consumption and heat generation.

Technology Used: CMOS

CMOS technology offers high speed and low power consumption, making this FPGA energy-efficient and suitable for various applications.

No. of Inputs: 388

A high number of inputs allows for versatile input configurations and connectivity options in the design.

Package Shape: SQUARE

The square shape of the package provides a balanced layout and ease of placement on a circuit board.

Form Of Terminal: BALL

Ball terminals are reliable for surface mounting and offer good contact with the circuit board for stable connections.

No. of Terminals: 784

A high number of terminals provide sufficient connectivity options for interfacing with other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being programmable, this FPGA allows for flexibility in design and customization for specific applications without the need for a custom chip.

Package Style (Meter): GRID ARRAY

A grid array package style offers good thermal performance and mechanical reliability for demanding environments.

Minimum Supply Voltage: 0.97 V

The option to operate at a low minimum supply voltage provides flexibility in power supply design and energy-efficient operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this FPGA is suitable for applications that require reliable performance under extreme conditions.

Pitch Of Terminal: 1 mm

A small terminal pitch allows for high-density packaging and efficient use of board space.

Minimum Operating Temperature: -55 °C

The ability to operate at a low minimum temperature makes this FPGA suitable for a wide range of environments and applications.

Position Of Terminal: BOTTOM

Bottom terminals make it easier to solder and mount the FPGA onto a circuit board, ensuring a secure connection.

Maximum Seated Height: 3.47 mm

The relatively low seated height allows for compact system designs and efficient use of space.

Width: 29 mm

The compact width of the FPGA makes it suitable for applications where space is limited.

No. of Outputs: 388

A high number of outputs provide flexibility in driving external devices and components in the system.

Length: 29 mm

The compact length of the FPGA complements its width, making it suitable for space-constrained designs.

Grading Of Temperature: MILITARY

With military-grade temperature grading, this FPGA is suitable for rugged and harsh environments where reliable performance is critical.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500TS-FC784M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF500TS-FC784M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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