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MPF500TLS-FCG1152I

Microchip Technology

MPF500TLS-FCG1152I by Microchip Technology

MPF500TLS-FCG1152I by Microchip Technology is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and 1152 terminals in a square grid array package. It operates b/w -40°C to 100°C, with supply voltage range of 0.97V to 1.03V. Ideal for high-performance applications requiring programmable ICs in compact form factors.

Median Price

$1,155.960

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2 parts In-Stock

1+ parts

$1,155.960

100+ parts

$1,050.870

1k+ parts

$730.080

10k+ parts

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2

$1,155.960

$1,050.870

$730.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2 parts In-Stock

1+ parts

$924.770

100+ parts

$866.980

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-

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2

$924.770

$866.980

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Digiode

USA . 471 parts In-Stock

1+ parts

$1,338.256

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471

$1,338.256

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Nova Conductors

Japan . 564 parts In-Stock

1+ parts

$1,493.210

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564

$1,493.210

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Vyrian

USA . 6,038 parts In-Stock

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6,038

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Chip Stock

USA . 1,342 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,545 parts In-Stock

1+ parts

$8.652

100+ parts

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1,545

$8.652

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Advanced Electronics

New Zealand . 37 parts In-Stock

1+ parts

$88.186

100+ parts

$80.249

1k+ parts

$72.313

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37

$88.186

$80.249

$72.313

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Ampacity Inc.

Singapore . 6 parts In-Stock

1+ parts

$1,197.390

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6

$1,197.390

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Semicontronic

India . 3 parts In-Stock

1+ parts

$1,197.390

100+ parts

$1,167.455

1k+ parts

$1,161.468

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3

$1,197.390

$1,167.455

$1,161.468

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Corphita

USA . 387 parts In-Stock

1+ parts

$1,267.821

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387

$1,267.821

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Aranea Global

USA . 200 parts In-Stock

1+ parts

$1,463.346

100+ parts

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$1,404.812

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200

$1,463.346

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$1,404.812

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Continental Prestige Electronics

USA . 9,634 parts In-Stock

1+ parts

$1,493.210

100+ parts

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$1,463.346

9,634

$1,493.210

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-

$1,463.346

Argo Parts USA

USA . 3,184 parts In-Stock

1+ parts

$1,493.210

100+ parts

$1,478.278

1k+ parts

$1,463.346

10k+ parts

$1,448.414

3,184

$1,493.210

$1,478.278

$1,463.346

$1,448.414

West Coast Incorporated

USA . 6,936 parts In-Stock

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6,936

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Vigor

Singapore . 817 parts In-Stock

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817

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Overview

Transform your projects with the MPF500TLS-FCG1152I by Microchip Technology, a powerhouse in the field of Field Programmable Gate Arrays (FPGA). With 481,000 logic cells and 584 inputs/outputs, this FPGA offers unmatched performance and versatility. Microchip Technology's dedication to quality ensures reliability and innovation in every product. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, the MPF500TLS-FCG1152I delivers value, efficiency, and endless possibilities. Elevate your creations with this game-changing FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the FPGA, ensuring a longer lifespan and reliable performance.

No. of Logic Cells: 481000

With a high number of logic cells, this FPGA offers extensive programmability and flexibility for complex designs and applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V ensures compatibility with a wide range of power sources, making this FPGA versatile for different operating conditions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient performance and signal integrity for the FPGA.

No. of Inputs: 584

With a large number of inputs, this FPGA can process and handle a significant amount of data simultaneously, making it suitable for complex computing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, maximizing the integration of the FPGA into a compact design.

Form Of Terminal: BALL

Ball terminals provide reliable connectivity and secure attachment to the circuit board, ensuring stable electrical connections for the FPGA.

No. of Terminals: 1152

With a high number of terminals, this FPGA can support complex routing and connectivity requirements, enabling versatile configuration options for different applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable gate array, this IC type offers the flexibility to implement custom logic functions and algorithms, making it suitable for diverse applications and rapid prototyping.

Package Style (Meter): GRID ARRAY

The grid array package style allows for easy alignment and soldering during installation, improving the manufacturing efficiency and reliability of the FPGA.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97 V provides energy efficiency and low power consumption for the FPGA, reducing operating costs and heat generation.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand elevated environmental conditions, ensuring reliable performance in demanding applications or harsh environments.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for compact and precise placement on the circuit board, optimizing the electrical connections and signal integrity of the FPGA.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures functionality in cold environments, making this FPGA suitable for a wide range of operating conditions and applications.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom allows for efficient heat dissipation and space-saving on the circuit board, enhancing the thermal performance and integration of the FPGA.

Maximum Seated Height: 3.47 mm

The maximum seated height of 3.47 mm enables a compact and low-profile design for the FPGA, making it suitable for space-constrained applications and devices.

Width: 35 mm

With a width of 35 mm, this FPGA offers a balance between compact size and functionality, facilitating integration into various electronic systems and designs.

No. of Outputs: 584

The ample number of outputs allows for versatile signal routing and processing capabilities, making this FPGA suitable for diverse applications requiring multiple output channels.

Length: 35 mm

The length of 35 mm provides a compact form factor for the FPGA, enabling efficient placement and integration into space-limited designs and electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500TLS-FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

584

No. of Outputs:

584

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF500TLS-FCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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