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MPF500TLS-FCG784I

Microchip Technology

MPF500TLS-FCG784I by Microchip Technology

MPF500TLS-FCG784I by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w -40 to 100°C. It features a grid array package style, plastic/epoxy body material, and ball terminals. Ideal for applications requiring high-density programmable logic solutions.

Median Price

$1,216.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2 parts In-Stock

1+ parts

$840.690

100+ parts

$788.150

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2

$840.690

$788.150

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Digiode

USA . 236 parts In-Stock

1+ parts

$1,216.570

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236

$1,216.570

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1,357.460

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50

$1,357.460

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Vyrian

USA . 7,294 parts In-Stock

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Chip Stock

USA . 596 parts In-Stock

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596

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Distributors (Availability)

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AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$17.481

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227

$17.481

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Vigor

Singapore . 384 parts In-Stock

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$970.160

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384

$970.160

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Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$1,088.510

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3

$1,088.510

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Semicontronic

India . 3 parts In-Stock

1+ parts

$1,088.510

100+ parts

$1,061.297

1k+ parts

$1,055.855

10k+ parts

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3

$1,088.510

$1,061.297

$1,055.855

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Corphita

USA . 199 parts In-Stock

1+ parts

$1,152.540

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199

$1,152.540

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Continental Prestige Electronics

USA . 5,058 parts In-Stock

1+ parts

$1,357.460

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$1,330.311

5,058

$1,357.460

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-

$1,330.311

Argo Parts USA

USA . 4,202 parts In-Stock

1+ parts

$1,357.460

100+ parts

$1,343.885

1k+ parts

$1,330.311

10k+ parts

$1,316.736

4,202

$1,357.460

$1,343.885

$1,330.311

$1,316.736

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1,357.460

100+ parts

$1,330.311

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1,000

$1,357.460

$1,330.311

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Montano Global Distributors

Canada . 5,383 parts In-Stock

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NIA Electronics

USA . 4,301 parts In-Stock

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Ledger Components

France . 4,301 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,191 parts In-Stock

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LMD Electronica

Estonia . 2,997 parts In-Stock

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2,997

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Overview

Discover the cutting-edge technology of the MPF500TLS-FCG784I by Microchip Technology, a top-tier manufacturer known for producing high-quality Field Programmable Gate Arrays. This versatile FPGA offers endless possibilities for a wide range of applications, providing customers with unparalleled flexibility and performance. Experience the value and benefits of this innovative product, designed to meet all your needs with its superior quality and advanced features. Elevate your projects to new heights with the MPF500TLS-FCG784I and unlock limitless potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a cost-effective and durable solution for the FPGA package.

No. of Logic Cells: 481000

With a high number of logic cells, this FPGA can handle complex tasks efficiently.

Surface Mount: YES

Being surface mountable makes this FPGA easy to integrate into circuit boards.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity.

No. of Inputs: 388

With a high number of inputs, this FPGA can handle multiple input signals effectively.

Package Shape: SQUARE

The square shape of the package offers easy integration into the design layout.

Form Of Terminal: BALL

Ball terminals provide reliable and secure connections in the FPGA.

No. of Terminals: 784

With a high number of terminals, this FPGA allows for versatile connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA allows for customization and flexibility in design.

Package Style (Meter): GRID ARRAY

The grid array style simplifies the assembly process of the FPGA.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures compatibility with a wide range of systems.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance makes this FPGA suitable for harsh environments.

Pitch Of Terminal: 1 mm

The small pitch size of terminals enables high-density mounting on PCBs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in extreme conditions.

Position Of Terminal: BOTTOM

Bottom position terminals provide easy access during installation and maintenance.

Maximum Seated Height: 3.47 mm

The low seated height of the package allows for compact design solutions.

Width: 29 mm

The width of 29mm offers a balanced footprint for the FPGA in the system.

No. of Outputs: 388

A high number of outputs allow for efficient signal processing and control.

Length: 29 mm

The length of 29mm provides a compact form factor for the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF500TLS-FCG784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

481000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF500TLS-FCG784I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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