Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MPF500TLSFCG1152I by Microsemi is a FPGA with 481K logic cells, 584 inputs/outputs, and CMOS technology. It operates b/w -40°C to 100°C, has a package size of 35x35mm, and uses a grid array style. Ideal for applications requiring high-density programmable ICs in plastic/epoxy packages with surface mount capability.
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Vigor
This material provides a good balance of durability and cost-effectiveness, making the product suitable for a wide range of applications.
The large number of logic cells allows for complex designs and high performance in the FPGA.
Surface mount capability makes installation and replacement of the FPGA easier and more convenient.
Operating at a low maximum supply voltage helps in reducing power consumption and heat generation, leading to energy efficiency.
CMOS technology provides high speed and low power consumption, making the FPGA efficient and reliable.
With a high number of inputs, the FPGA can handle a large amount of data and input signals, making it versatile and adaptable to different requirements.
Square shape allows for efficient use of space and easy integration into different systems and devices.
Ball terminals provide secure connections and allow for easy installation and removal of the FPGA.
The large number of terminals offer flexibility in connectivity options and ensure compatibility with various interfaces and peripherals.
Being field programmable allows for customization and reconfiguration of the FPGA according to specific requirements, making it versatile and cost-effective.
Grid array package style provides efficient routing and signal integrity, ensuring optimal performance of the FPGA.
Having a low minimum supply voltage ensures reliable operation even under low power conditions, enhancing the overall efficiency of the FPGA.
High maximum operating temperature tolerance allows for reliable performance in harsh environments and under extreme conditions.
Close pitch terminals enable compact design, efficient signal routing, and easy integration into various systems and circuit boards.
With a low minimum operating temperature, the FPGA can operate reliably in cold environments without compromising performance.
Bottom position terminals facilitate easy access and connection to the FPGA, simplifying installation and maintenance procedures.
Low maximum seated height ensures compact design and efficient use of space, making the FPGA suitable for applications with size constraints.
Compact width dimension allows for easy integration and placement of the FPGA in various systems and devices.
High number of outputs enables the FPGA to drive multiple external devices and communicate results efficiently, enhancing overall system performance.
Compact length dimension ensures optimal space utilization and easy integration of the FPGA into different electronic systems and applications.
Field Programmable Gate Arrays (FPGA) MPF500TLSFCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi
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MPF500TLSFCG1152I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
STMicroelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
Won-top Electronics
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
NC7WZ17P6X
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
LFE5U-25F-8BG381I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
EP4CE15F17C8N
Intel
EP4CE15F17C8N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities. With a package style of GRID ARRAY, it offers versatility for various design requirements.
A3P1000-FGG484
The A3P1000-FGG484 by Microchip Technology is a CMOS-based FPGA with 1.5V supply voltage, 24576 CLBs, 1000000 gates, and a maximum clock frequency of 350 MHz. It is used in applications requiring high-performance programmable logic solutions.
ICE40LP4K-CM121
ICE40LP4K-CM121 by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and max clock frequency of 133 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.
10M40SAE144I7G
The Intel 10M40SAE144I7G is a Field Programmable Gate Array with 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. It operates at temperatures ranging from -40 to 100°C and has a supply voltage of 2.85-3.15V. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.
10M08SAE144C8GES
Altera
FIELD PROGRAMMABLE GATE ARRAY;
10M02SCU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
XC7A12T-L1CPG238I
Xilinx
The Xilinx XC7A12T-L1CPG238I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for various functions. With a package style of grid array and low profile, it offers flexibility in design while maintaining reliability.
EP4CE6F17C6N
EP4CE6F17C6N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems due to its low profile package style and high operating temperature range up to 85°C.
XC7A25T-2CSG325I
Xilinx XC7A25T-2CSG325I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.
XC6SLX9-2CSG225C
Xilinx XC6SLX9-2CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
XC6SLX45-2FGG484I
Xilinx XC6SLX45-2FGG484I FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range from -40 to 100°C and low power consumption at 1.2V, this FPGA offers versatile programmability for various electronic systems.
LFCPNX-100-9LFG672C
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4;
5CEBA4F17C8N
Intel's 5CEBA4F17C8N FPGA boasts 49000 logic cells, 128 inputs/outputs, and operates at a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementations in various industries.
LFE5UM-85F-8BG554C
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
A3P125-VQG100I
A3P125-VQG100I by Microchip Technology is a CMOS FPGA with 3072 CLBs and 125000 gates. It operates at max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of flatpack, thin profile, fine pitch, it offers versatility in design and integration.
XC7K325T-2FFG676I
Xilinx XC7K325T-2FFG676I is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. It's used in industrial applications requiring high-speed processing and programmable ICs for versatile functionality.
EP4CE55F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 472.5 MHz;
XC7S50-1CSGA324C
Xilinx XC7S50-1CSGA324C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
10M50DAF484C8G
Intel's 10M50DAF484C8G FPGA boasts 50000 logic cells, 3125 CLBs, and 500 inputs. Ideal for applications requiring high-speed processing and customization in fields like telecommunications, automotive, and aerospace due to its programmable nature and versatile package style.
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MPF500TS-FC1152M
MPF500TS-FC1152M by Microchip: 481K logic cells, 584 inputs/outputs, CMOS tech. Ideal for military applications with -55 to 125°C temp range. Package: grid array, square shape, surface mountable.
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
MPF500TS-1FCG784I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TFCG1152E
Microsemi's MPF500TFCG1152E is a CMOS FPGA with 481K logic cells, 584 inputs/outputs, and operates b/w 0-100°C. Its grid array package has 1152 terminals on a 35x35mm square body, making it ideal for high-performance applications requiring programmable ICs.
MPF500T-FCG1152E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 584;
MPF500T-1FCG784E
MPF500T-1FCG784E by Microchip Technology is a CMOS-based FPGA with 481,000 logic cells. It has a package style of grid array and a max supply voltage of 1.03V. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.
MPF500T-1FCG784I
MPF500T-1FCG784I by Microchip Tech is a 481K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.
MPF500T-1FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 481000;
MPF500TL-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
MPF500TLFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 584;
MPF500TLS-FCG784I
MPF500TLS-FCG784I by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w -40 to 100°C. It features a grid array package style, plastic/epoxy body material, and ball terminals. Ideal for applications requiring high-density programmable logic solutions.
MPF500TFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
MPF500T-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
MPF500TSFCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.47 mm;
MPF500TS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPF500T-FCG784E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MPF500TLS-FCG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
MPF500TS-FC784M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;
MPF500TL-FCG784E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
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