Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XC2VP40-6FF1152I FPGA features 43632 logic cells, 4848 CLBs, and 692 inputs. With a max clock frequency of 1200 MHz, it's ideal for high-performance applications like signal processing and data acceleration. The package style is grid array with a square shape and ball terminals for easy mounting.
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Plastic/epoxy material makes the FPGA lightweight and durable for easy handling and long-term use.
Large number of logic cells enable complex programming and implementation of various functions in the FPGA.
Surface mount capability allows for easy installation on circuit boards, saving space and simplifying assembly processes.
Low maximum supply voltage helps in reducing power consumption and improving efficiency.
High number of Configurable Logic Blocks (CLBs) provide flexibility in design and implementation of custom logic functions.
Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity for reliable performance.
Large number of inputs allow for extensive connectivity and input signal processing capabilities in the FPGA.
Square package shape helps in efficient utilization of space on circuit boards and facilitates uniform layout designs.
Ball terminal design ensures reliable solder joints and easy connectivity during assembly.
Stable nominal supply voltage of 1.5V ensures consistent operation and performance of the FPGA.
Large number of terminals provide ample connectivity options and ease of integration in complex electronic systems.
Being a Field Programmable Gate Array (FPGA), this product offers reconfigurable logic and versatile functionality for a wide range of applications.
Grid array package style offers high terminal density and improved signal integrity for optimized performance.
Low minimum supply voltage allows for efficient power management and extended battery life in portable applications.
Narrow terminal pitch of 1mm enables high-density mounting and compact designs in electronic circuits.
Low combinatorial delay of CLBs enables fast processing speeds and reduced latency in real-time applications.
Organized configuration of 4848 CLBs enhances design flexibility and scalability in implementing complex logic circuits.
Tin/lead finishing of terminals provides reliable solder joints and good electrical conductivity for optimal performance.
Bottom terminal position facilitates easy integration with circuit boards and ensures proper alignment during assembly.
Moisture sensitivity level of 4 indicates robustness against environmental conditions and reliability in various operating environments.
Low seated height of 3.4mm allows for compact and slim designs in space-constrained electronic devices.
Moderate width of 35mm provides a balance between space efficiency and ease of connectivity in circuit board layouts.
High maximum clock frequency of 1200MHz enables rapid data processing and real-time operation for time-critical applications.
Large number of outputs support versatile signal routing options and extensive connectivity for diverse system requirements.
Maximum reflow time of 30 seconds ensures efficient soldering and reliable connections during assembly processes.
High peak reflow temperature of 225°C allows for robust solder joints and durable connections in harsh operating conditions.
Moderate length of 35mm provides a compact form factor suitable for various electronic devices and system integrations.
Field Programmable Gate Arrays (FPGA) XC2VP40-6FF1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC2VP40-6FF1152I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 6/Jan/2020
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
LM358AN
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
ABS25-32.768KHZ-T
Abracon
Abracon's ABS25-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency, such as IoT devices and precision timing systems in industrial settings.
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LFE5U-45F-7BG256I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
10CL006YU256I7G
Intel
The Intel 10CL006YU256I7G is a FPGA with 392 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of -40°C to 100°C. It is used in industrial applications requiring high performance computing and programmable logic capabilities.
XC7S6-2CSGA225I
Xilinx
Xilinx XC7S6-2CSGA225I FPGA offers 6000 logic cells, 469 CLBs, and 1286 MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.
XC7S50-1CSGA324I
The Xilinx XC7S50-1CSGA324I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.
EP4CE75F23C8N
EP4CE75F23C8N by Intel is a FPGA with 75408 logic cells and 4713 CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications like signal processing and data acceleration. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.
M2S090-FCS325I
Microchip Technology
Microchip Technology's M2S090-FCS325I FPGA boasts 86184 logic cells, 180 inputs/outputs, and operates at a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic solutions in compact form factors with fine pitch grid arrays.
M2GL010-TQG144I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC7A200T-1SBG484C
Xilinx XC7A200T-1SBG484C is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1098 MHz. It operates b/w -40 to 85 °C and is used in high-performance computing applications.
LFE5U-25F-6BG381C
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): NOT SPECIFIED;
A3PE1500-PQG208I
A3PE1500-PQG208I by Microchip Technology is a CMOS FPGA with 38400 logic cells and 1500000 equivalent gates. It operates at a supply voltage of 1.5V, suitable for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 28mm square package.
LCMXO2-640UHC-4TG144C
LCMXO2-640UHC-4TG144C by Lattice Semiconductor is a 640 logic cell FPGA with max supply voltage of 3.465V. It has 107 inputs/outputs, operates b/w 0-85°C, and uses matte tin terminals. Ideal for applications requiring high-speed processing in compact designs like IoT devices and industrial automation systems.
M2S010-VFG400I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;
EP4CE6F17I8LN
EP4CE6F17I8LN by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 362 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of grid array and low profile, it offers versatility in design and integration.
M2GL060-FCSG325I
M2GL060-FCSG325I by Microsemi is a PLASTIC/EPOXY FPGA with a max supply voltage of 1.26V. It has 325 terminals and is suitable for applications requiring a field programmable gate array.
EP3C55F484I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
A3P1000-FGG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCKU040-2FFVA1156E
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
EP2C8Q208I8N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Minimum Supply Voltage: 1.15 V;
MPF300T-1FCG784E
MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.
XC7A25T-2CSG325C
The Xilinx XC7A25T-2CSG325C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries. With a package style of grid array and low profile, it offers flexibility in design while maintaining high performance standards.
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XC2V1000-4BGG575C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;
XC2V1500-4FGG676C
XC2V1500-4FGG676C by Xilinx is a CMOS FPGA with 17280 logic cells and 1920 CLBs. It operates at a max clock frequency of 650 MHz and is commonly used in applications requiring high-performance programmable logic solutions.
XC2V250-6CS144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
XC2V1000-4FGG256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC2V3000-5BF957C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE;
XC2VP4-6FG456I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Organization: 752 CLBS;
XC2VP50-5FF1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Organization: 5904 CLBS;
XC2VP20-5FF896I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 556;
XC2V2000-5BG575C
XC2V250-4FGG256C
XC2V1000-4FG456I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Organization: 1280 CLBS, 1000000 GATES;
XC2V1000-6FG256C
XC2V1500-4FG676I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 650 MHz;
XC2V1500-5FG676I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XC2V3000-4FF1152C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
XC2VP2-5FGG256C
XC2VP20-5FG676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XC2VP4-6FGG456I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
XC2VP50-6FF1152C
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