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MPF300T-FCG1152I

Microchip Technology

MPF300T-FCG1152I by Microchip Technology

Microchip Technology's MPF300T-FCG1152I is a 300K logic cell FPGA with CMOS technology. It features 512 inputs/outputs, operates b/w -40 to 100°C, and has a package size of 35x35mm. Ideal for applications requiring high-density programmable logic solutions in compact form factors.

Median Price

$606.860

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 6 parts In-Stock

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$606.860

100+ parts

$551.690

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$383.280

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6

$606.860

$551.690

$383.280

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Distributors (In-Stock)

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Digiode

USA . 179 parts In-Stock

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$576.574

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179

$576.574

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Vyrian

USA . 2,696 parts In-Stock

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2,696

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Chip Stock

USA . 225 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 386 parts In-Stock

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$9.509

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386

$9.509

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Corohmni

South Africa . 646 parts In-Stock

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$50.866

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Aztec Data Supply Inc.

USA . 684 parts In-Stock

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$117.650

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684

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Vigor

Singapore . 425 parts In-Stock

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$499.200

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425

$499.200

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$515.880

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$515.880

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Semicontronic

India . 1 parts In-Stock

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$515.880

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$502.983

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$500.404

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1

$515.880

$502.983

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Corphita

USA . 463 parts In-Stock

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$546.228

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Marpe Global Electronics

Taiwan . 8,243 parts In-Stock

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QualityLine Systems

Poland . 8,243 parts In-Stock

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XL Components Corporation

Australia . 8,243 parts In-Stock

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Argo Parts USA

USA . 4,426 parts In-Stock

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Continental Prestige Electronics

USA . 1,483 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Unlock limitless possibilities with the MPF300T-FCG1152I by Microchip Technology. As a leading manufacturer in the industry, this Field Programmable Gate Array (FPGA) offers unparalleled quality and reliability. With 300,000 logic cells and 512 inputs/outputs, this product is perfect for a wide range of applications. Its CMOS technology ensures optimal performance while its compact square shape allows for easy integration. Experience the value and benefits of this innovative solution and take your projects to the next level with Microchip Technology's MPF300T-FCG1152I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness to the product.

No. of Logic Cells: 300000

With a large number of logic cells, this FPGA is suitable for complex applications.

Surface Mount: YES

Being surface mountable makes installation of this product quick and easy.

Maximum Supply Voltage: 1.03V

The high maximum supply voltage allows for versatility in power options.

Technology Used: CMOS

CMOS technology offers high speed and low power consumption.

No. of Inputs: 512

With a generous number of inputs, this FPGA can handle a variety of signals simultaneously.

Package Shape: SQUARE

The square shape of the package allows for efficient use of PCB space.

Form Of Terminal: BALL

Ball terminals provide secure connections and easy integration into circuits.

No. of Terminals: 1152

The large number of terminals enables connectivity to various components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being FPGA enables customization and flexibility in the design.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout.

Minimum Supply Voltage: 0.97V

The low minimum supply voltage ensures compatibility with a range of power sources.

Maximum Operating Temperature: 100 °C

The high operating temperature range allows for reliable performance in various environments.

Pitch Of Terminal: 1mm

The closely spaced terminals enable high-density mounting on PCBs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the FPGA can function in cold conditions.

Position Of Terminal: BOTTOM

Bottom terminal placement facilitates easy PCB routing and assembly.

Maximum Seated Height: 3.47mm

The low height profile makes this FPGA suitable for compact design requirements.

Width: 35mm

The moderate width ensures the FPGA can fit into various PCB layouts.

No. of Outputs: 512

The numerous outputs make this FPGA suitable for applications requiring multiple signal outputs.

Length: 35mm

The moderate length provides a balanced form factor for easy integration into designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

512

No. of Outputs:

512

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF300T-FCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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