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10AX032H2F35E1HG

Intel

10AX032H2F35E1HG by Intel

Intel's 10AX032H2F35E1HG FPGA features 320K logic cells, TSMC technology, and 11990 CLBs. Ideal for applications requiring high-speed data processing, such as telecommunications equipment or industrial automation systems.

Median Price

$2,478.573

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 6,639 parts In-Stock

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VNN

France . 2,849 parts In-Stock

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Chip Stock

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Digiode

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Ampacity Inc.

Singapore . 1,344 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 567 parts In-Stock

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Texas Native Microelectronics

USA . 509 parts In-Stock

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$140.259

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$135.876

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$128.571

509

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Corohmni

South Africa . 132 parts In-Stock

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Qasali Group International

UK . 300 parts In-Stock

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Continental Prestige Electronics

USA . 3,416 parts In-Stock

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Argo Parts USA

USA . 3,359 parts In-Stock

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$2,429.002

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$2,404.216

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Netroflash

USA . 100 parts In-Stock

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Microchip USA

USA . 1,617 parts In-Stock

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Vigor

Singapore . 787 parts In-Stock

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Corphita

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MARBEL Systems

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Kenton Components

USA . 200 parts In-Stock

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Overview

Unlock endless possibilities with the 10AX032H2F35E1HG by Intel, a top-quality Field Programmable Gate Array that offers unmatched flexibility and performance. Intel's reputation for excellence guarantees reliability and innovation in every product. Whether you're working on IoT devices, automotive applications, or telecommunications systems, this FPGA will exceed your expectations. Experience seamless integration, rapid prototyping, and customizable solutions that cater to your specific needs. Embrace the future of technology with Intel's cutting-edge FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the FPGA lightweight and durable, making it easy to handle and transport.

No. of Logic Cells: 320000

With a high number of logic cells, this FPGA offers extensive programmability and flexibility for complex designs and algorithms.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Technology Used: TSMC

Utilizing TSMC technology ensures high performance and reliability in the operation of the FPGA.

No. of Inputs: 384

Having a large number of inputs allows for versatile connectivity options, making this FPGA suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape provides a compact form factor, optimizing board space and facilitating efficient layout designs.

Form Of Terminal: BALL

The use of ball terminals enables easy and reliable connections, ensuring secure integration into the circuit.

No. of Terminals: 1152

Having a high number of terminals allows for extensive I/O capabilities, supporting multiple connections and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable gate array, this IC type offers reconfigurability and adaptability for changing design requirements and functionalities.

Package Style (Meter): GRID ARRAY

The grid array package style provides a structured layout for terminals, enhancing ease of soldering and ensuring reliable electrical connections.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance of 100°C ensures reliable performance under demanding operating conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for efficient placement and routing, contributing to a streamlined design process.

Organization: 11990 CLBS

With 11990 configurable logic blocks, this FPGA provides ample resources for implementing complex logic functions and algorithms.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance of 0°C ensures functionality in a wide range of environmental conditions.

Position Of Terminal: BOTTOM

Having terminals at the bottom facilitates easy connection and integration with other components on the circuit board.

Maximum Seated Height: 3.35 mm

The maximum seated height of 3.35 mm allows for a low-profile design, ideal for applications with height constraints.

Width: 35 mm

With a width of 35 mm, this FPGA offers a compact form factor, saving space on the PCB and enabling efficient board layout.

No. of Outputs: 384

A high number of outputs provide versatile connectivity options and signal routing capabilities, enhancing the FPGA's versatility.

Length: 35 mm

The 35 mm length of this FPGA contributes to its compact size, making it suitable for integration into space-constrained designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX032H2F35E1HG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

320000

No. of Inputs:

384

No. of Outputs:

384

No. of CLBs:

11990

Technology:

TSMC

Organization:

11990 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

10AX032H2F35E1HG Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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