Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP2AGX190FF35C6G by Intel is a FPGA with 181165 logic cells, 7612 CLBs, and 612 inputs/outputs. It operates b/w -40 to 85°C and has a supply voltage range of 0.87V to 0.93V. Ideal for applications requiring high-speed data processing in compact electronic systems.
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Corphita
The use of plastic/epoxy material makes the package lightweight and cost-effective.
With a large number of logic cells, this FPGA can handle complex logic functions and designs efficiently.
Being surface mountable enhances the ease of integration into circuit boards and reduces assembly time.
The low maximum supply voltage helps in minimizing power consumption and heat generation.
Having a high number of Configurable Logic Blocks (CLBs) allows for versatile programming and customization.
The FPGA provides ample input ports for interfacing with external devices and sensors.
The square package shape simplifies PCB layout and ensures efficient use of space.
The nominal supply voltage of 0.9V strikes a balance between power efficiency and performance.
Having a high number of terminals allows for versatile connectivity options within the system.
As a field programmable device, this FPGA can be customized and reconfigured for different applications without the need for physical modification.
The grid array package style with a heat sink/slug design enhances thermal management and reliability under high operating temperatures.
The low minimum supply voltage ensures compatibility with a wide range of power sources and extends the device's operating range.
The FPGA can operate effectively in high-temperature environments, offering reliability in industrial and automotive applications.
The 1mm terminal pitch allows for compact and precise soldering during assembly.
The organization of 7612 Configurable Logic Blocks provides a structured architecture for designing complex digital circuits.
The FPGA can withstand extreme cold temperatures, making it suitable for outdoor and harsh environment applications.
The terminal placement at the bottom of the package facilitates easier routing of connections on the PCB.
The low profile design with a maximum seated height of 2.55mm allows for space-saving integration in compact electronic devices.
The 35mm width provides a compact form factor for the FPGA, suitable for applications with size constraints.
With 612 output ports, the FPGA can drive multiple external devices and components simultaneously.
The 35mm length offers a balanced aspect ratio for the FPGA, ensuring easy integration into standard PCB designs.
Field Programmable Gate Arrays (FPGA) EP2AGX190FF35C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP2AGX190FF35C6G Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult PN LABEL 01/08/2023 Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EU2B-YS3203C
Idec
ROTARY SWITCH;
STM32H743IIT6
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
SMBJ18CA
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
XCAU20P-1SFVB784I
Xilinx
Xilinx XCAU20P-1SFVB784I FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch.
EP3C5E144C8N
Intel
EP3C5E144C8N by Intel is a CMOS FPGA with 5136 logic cells and CLBs. It operates at 1.2V nominal voltage, suitable for applications requiring high-speed processing and low power consumption in various industries such as telecommunications, automotive, and consumer electronics. With a compact rectangular package style and GULL WING terminals, it offers flexibility for surface mount integration in space-constrained designs.
LFD2NX-40-7BG196I
Lattice Semiconductor
LFD2NX-40-7BG196I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 92 inputs/outputs, and uses plastic/epoxy package material. Ideal for industrial applications requiring high-performance programmable ICs in compact square form factor.
M2S090-FCS325
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Pitch Of Terminal: .5 mm;
EP2C20F256C8N
EP2C20F256C8N by Intel is a FPGA with 18752 logic cells, 1172 CLBs, and 152 inputs. It operates at a max clock frequency of 402.5 MHz and is suitable for applications requiring high-speed processing and programmable ICs in various industries. With a package style of grid array and low profile, it offers versatility in design while maintaining a compact form factor.
EP4CE6E22C8N
EP4CE6E22C8N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC5VLX20T-1FFG323C
Xilinx XC5VLX20T-1FFG323C FPGA features 19968 logic cells, 1560 CLBs, and 172 inputs/outputs. Utilized in applications requiring high-speed processing with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XC7S50-1FGGA484C
The Xilinx XC7S50-1FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
10M40DAF256I7G
Intel's 10M40DAF256I7G FPGA features 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C and a min of -40°C. The package style is grid array with a square shape and ball terminals.
M7A3P1000-FG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7K160T-2FFG676C
The Xilinx XC7K160T-2FFG676C is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC6SLX9-2FTG256C
XC6SLX9-2FTG256C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring programmable ICs for high-speed data processing.
EP4CE15F23I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XC7S6-2FTGB196I
Xilinx XC7S6-2FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array, low profile, fine pitch.
EP4CE22F17C8N
EP4CE22F17C8N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and digital signal processing devices.
A3P1000-FG144M
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
A3PN250-VQG100I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
10M02SCU169A7G
The Intel 10M02SCU169A7G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at a supply voltage of 2.85-3.15V and has a temperature range of -40 to 125°C. Ideal for automotive applications due to its compact size (11mm x 11mm) and grid array package style.
10M16SCE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; No. of Inputs: 101;
EP2C5T144C7N
EP2C5T144C7N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and max clock frequency of 450 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of flatpack and low profile, it offers versatility in design while maintaining efficient power supplies at 1.2V to 3.3V.
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EP2AGZ225HF40I3N
EP2AGZ225HF40I3N by Intel is a FPGA with 224,000 logic cells and 734 inputs/outputs. It operates at a max clock frequency of 500 MHz and supports multiple power supplies. Ideal for industrial applications requiring high-speed processing in a compact form factor.
EP2AGX190FF35C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX65DF25C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 572; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX45DF29I3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX125EF29C4G
EP2AGX125EF29C4G by Intel is a Field Programmable Gate Array (FPGA) with 118,143 logic cells. It has a max supply voltage of 0.93V and can operate at temperatures up to 85°C. This FPGA is suitable for various applications requiring programmable ICs and offers a package style of grid array with heat sink/slug.
EP2AGX260FF35I3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX65DF29C5N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX260FF35C6G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
EP2AGX125EF35I3N
EP2AGX65DF25C5N
EP2AGX260EF29I3N
EP2AGX45DF29C4N
EP2AGX95EF35I5N
EP2AGX125EF29I5
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA780,28X28,40;
EP2AGX125EF29I5G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
EP2AGX45DF25I5G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 572; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 0.9;
EP2AGX65DF29C6G
EP2AGX125DF25C4N
EP2AGX125EF35C5
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
EP2AGX190FF35I3
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
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