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EP2AGX95EF35I5N

Intel

EP2AGX95EF35I5N by Intel

EP2AGX95EF35I5N by Intel is a FPGA with 89178 logic cells, 3747 CLBs, and max clock frequency of 500 MHz. It is used in industrial applications requiring high-speed processing and programmable IC capabilities. The package style includes grid array and heat sink/slug for efficient thermal management.

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Semicontronic

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One Stop Electronics

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Advanced Electronics

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Modulus Dynamics

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Texas Native Microelectronics

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Overview

Unlock the power of innovation with the EP2AGX95EF35I5N by Intel. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Intel delivers a high-quality product that boasts 89178 logic cells and 3747 CLBs. With a maximum clock frequency of 500 MHz, this FPGA offers unparalleled performance and flexibility for a variety of applications. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, the EP2AGX95EF35I5N provides the value, benefits, and advantages you need to bring your ideas to life. Join the ranks of top innovators and elevate your projects with Intel's EP2AGX95EF35I5N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the package, ensuring the longevity of the product.

No. of Logic Cells: 89178

Large number of logic cells allow for complex programming and customization, making it suitable for advanced applications.

Surface Mount: YES

Surface mount capability makes installation and integration easier, saving time and effort during setup.

Maximum Supply Voltage: 0.93 V

Efficient power consumption with a low maximum supply voltage leads to reduced energy costs and heat generation.

No. of CLBs: 3747

High number of Configurable Logic Blocks (CLBs) offer flexibility in design and implementation of various functions within the FPGA.

No. of Inputs: 612

Extensive input options allow for versatile connectivity and input signal processing capabilities.

Package Shape: SQUARE

Square package shape provides efficient use of space and easy alignment during installation.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

Power Supplies (V): 0.9,1.2/3.3,1.5,2.5

Multiple power supply options cater to different power requirements, offering flexibility in system design and integration.

No. of Terminals: 1152

Abundant terminals provide ample connectivity options for interfacing with other components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field Programmable Gate Array (FPGA) type allows for custom programming and reconfiguration, enabling adaptability to changing system requirements.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style with heat sink/slug helps in heat dissipation and thermal management, ensuring optimal performance under varying conditions.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage ensures operational stability even under low power conditions.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions.

Pitch Of Terminal: 1 mm

Optimal terminal pitch facilitates easy soldering and connection, enhancing the overall reliability of the product.

Organization: 3747 CLBS

Organized structure with 3747 Configurable Logic Blocks (CLBs) offers a systematic approach to designing and implementing complex logic functions.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation ensures functionality in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Quality terminal finishing with tin, silver, and copper enhances conductivity and reliability of connections.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates easy PCB layout and integration, simplifying installation and maintenance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures protection against moisture-induced damage, enhancing the product's durability.

Maximum Seated Height: 2.6 mm

Low seated height enables compact design and efficient use of space within the system architecture.

Width: 35 mm

Moderate width makes the FPGA suitable for various form factors and system configurations.

Maximum Clock Frequency: 500 MHz

High maximum clock frequency allows for rapid data processing and execution of complex algorithms, making it ideal for high-speed applications.

No. of Outputs: 612

Numerous output options enable versatile signal processing and data transmission capabilities within the FPGA.

Length: 35 mm

Moderate length ensures compatibility with standard PCB layouts and facilitates easy integration into existing systems.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial environments, making it a robust choice for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2AGX95EF35I5N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

89178

No. of Inputs:

612

No. of Outputs:

612

No. of CLBs:

3747

Maximum Clock Frequency:

500 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

3747 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9,1.2/3.3,1.5,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2AGX95EF35I5N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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