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EP2AGX45DF29I3N

Intel

EP2AGX45DF29I3N by Intel

Intel EP2AGX45DF29I3N is a FPGA with 42959 logic cells, 1805 CLBs, and 372 inputs/outputs. Operating at max clock frequency of 500 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range (-40 to 100°C) and multiple power supplies (0.9-2.5V), it offers versatility in various electronic designs.

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Ampacity Inc.

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Semicontronic

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One Stop Electronics

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AZTECH Wire

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Component Stockers USA

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Microchip USA

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Overview

Unlock limitless possibilities with the EP2AGX45DF29I3N by Intel. This cutting-edge Field Programmable Gate Array (FPGA) boasts 42959 logic cells and 1805 CLBs, making it a powerhouse for innovation. With a maximum clock frequency of 500 MHz and a wide range of power supplies, this FPGA is versatile and reliable for a variety of applications. From industrial automation to telecommunications, the EP2AGX45DF29I3N offers unmatched flexibility and performance. Trust Intel's reputation for excellence and invest in a product that delivers value and benefits beyond compare.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand harsh environments.

No. of Logic Cells: 42959

High number of logic cells allows for complex programming and functionality.

Surface Mount: YES

Ease of installation and integration into circuit boards.

Maximum Supply Voltage: 0.93 V

Efficient power consumption with low supply voltage.

No. of CLBs: 1805

Sufficient number of Configurable Logic Blocks for versatile programming options.

No. of Inputs: 372

High number of inputs for connecting various components and sensors.

Package Shape: SQUARE

Compact shape for efficient use of space on a circuit board.

Nominal Supply Voltage (V): 0.9

Stable and consistent supply voltage for reliable operation.

Power Supplies (V): 0.9,1.2/3.3,1.5,2.5

Support for multiple power supply voltages for flexibility in design.

No. of Terminals: 780

Sufficient terminals for connecting to other components and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Versatile and reprogrammable for different applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Effective heat dissipation to prevent overheating during operation.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage for efficient power usage.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for industrial applications.

Pitch Of Terminal: 1 mm

Standard pitch size for easy connections.

Organization: 1805 CLBS

Well-organized Configurable Logic Blocks for efficient programming.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

High-quality terminal finishing for durability and conductivity.

Position Of Terminal: BOTTOM

Convenient terminal position for easy connections.

Maximum Seated Height: 2.7 mm

Low profile design for compact installation.

Width: 29 mm

Compact width for space-saving on a circuit board.

Maximum Clock Frequency: 500 MHz

High clock frequency for fast processing and response times.

No. of Outputs: 372

High number of outputs for transmitting processed data to other components.

Length: 29 mm

Compact length for efficient use of space on a circuit board.

Grading Of Temperature: INDUSTRIAL

Suitable for industrial temperature requirements and applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2AGX45DF29I3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

42959

No. of Inputs:

372

No. of Outputs:

372

No. of CLBs:

1805

Maximum Clock Frequency:

500 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

1805 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9,1.2/3.3,1.5,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2AGX45DF29I3N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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