Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP2AGX125EF29C4G by Intel is a Field Programmable Gate Array (FPGA) with 118,143 logic cells. It has a max supply voltage of 0.93V and can operate at temperatures up to 85°C. This FPGA is suitable for various applications requiring programmable ICs and offers a package style of grid array with heat sink/slug.
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The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making it a reliable choice for various environments.
With a high number of logic cells, this FPGA provides extensive programmability and flexibility, allowing for complex and advanced digital designs.
The surface mount feature simplifies the integration process and facilitates efficient PCB assembly, making it a convenient option for manufacturers and reducing time-to-market.
The FPGA's low maximum supply voltage enables power-efficient operation, contributing to energy savings and reducing overall system heating.
The multiple configurable logic blocks (CLBs) offer a substantial amount of customizable resources, enabling the implementation of diverse and intricate digital functions.
With a generous number of inputs, this FPGA accommodates connectivity requirements for a wide range of devices, ensuring seamless integration and data exchange.
The square package shape allows for compact and space-efficient installation, making it suitable for applications where size constraints are a concern.
The ball form of terminal offers reliable electrical connections and secure solder joints, enhancing the durability and longevity of the FPGA in demanding operating conditions.
The low nominal supply voltage contributes to power efficiency and enhances the overall energy-saving capabilities of the FPGA.
The presence of a large number of terminals facilitates versatile connectivity options, enabling seamless integration and ensuring compatibility with various systems.
Being a field-programmable gate array, this product grants users the ability to modify and reconfigure the circuitry to suit specific application requirements, offering versatility and adaptability.
The inclusion of a heat sink/slug in the grid array package style ensures efficient heat dissipation, mitigating thermal issues and promoting stable performance.
The low minimum supply voltage enhances power efficiency while still providing reliable operation, making it suitable for energy-conscious applications.
With a high maximum operating temperature, this FPGA can withstand demanding environments without compromising performance, ensuring reliable operation under challenging conditions.
The small pitch of terminals allows for precise and secure electrical connections, reducing the risk of signal degradation and ensuring reliable data transmission.
The organizational structure of 4,964 configurable logic blocks (CLBs) enables efficient design implementation and offers scalability for complex digital systems.
The FPGA's ability to operate reliably at low temperatures makes it suitable for applications that require extended temperature ranges or exposure to cold environments.
The bottom position of the terminal simplifies board layout and routing, enhancing ease of integration and facilitating efficient PCB designs.
With a relatively low maximum seated height, this FPGA allows for compact and space-saving designs, making it well-suited for applications with limited vertical clearance.
With a width of 29 mm, this FPGA offers a compact form factor, enabling flexibility in system design and ensuring efficient utilization of available space.
The inclusion of a significant number of outputs enables versatile data distribution and control capabilities, accommodating diverse system requirements.
The FPGA's length of 29 mm provides a compact footprint, allowing for efficient integration in space-constrained applications while not compromising functionality.
Field Programmable Gate Arrays (FPGA) EP2AGX125EF29C4G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP2AGX125EF29C4G Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult PN LABEL 01/08/2023 Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
Frontier Electronics
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
1N4148WS
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
Eic Semiconductor
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358AN
Philips Semiconductors
Meritek Electronics
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMSZ5245BT1G
Onsemi
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
KSZ9031RNXIA
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
EP4CE6F17C7N
Intel
EP4CE6F17C7N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and digital signal processing.
EP3C16F484I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
LCMXO2-7000HC-4FTG256I
Lattice Semiconductor
LCMXO2-7000HC-4FTG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring low profile grid array packages, it has a max operating temperature of 100°C and can handle peak reflow temperatures up to 260°C.
LFXP2-8E-5FTN256C
LFXP2-8E-5FTN256C by Lattice Semiconductor is a 8000 logic cell FPGA with 201 inputs/outputs, operating at 435 MHz. It uses CMOS technology, has a max supply voltage of 1.26 V, and is suitable for applications requiring high-speed processing in compact electronic systems.
XC7A100T-1FGG484I
Xilinx
Xilinx XC7A100T-1FGG484I FPGA features 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. Utilized in applications requiring high clock frequencies up to 1098 MHz, such as telecommunications and signal processing due to its advanced CMOS technology and low power consumption.
LFE5U-45F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
M2GL010-TQG144
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
ICE40HX1K-CB132
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: FBGA; Package Shape: SQUARE;
EP4CE10F17C8N
EP4CE10F17C8N by Altera is a PLASTIC/EPOXY FPGA with 10320 logic cells, 179 inputs/outputs, and a maximum clock frequency of 472.5 MHz. It operates at a supply voltage of 1.2V and is suitable for various applications requiring high-speed data processing and programmable logic capabilities.
EP4CE15F17C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LCMXO2-4000HC-4MG132C
LCMXO2-4000HC-4MG132C by Lattice Semiconductor is a FPGA with 4320 logic cells, 104 inputs/outputs, and operates at 2.375V to 3.465V. Ideal for applications requiring high-speed processing and programmable ICs in compact designs with a grid array package style.
A3P1000-FGG256I
Microchip Technology
A3P1000-FGG256I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 24576 CLBs and 1000000 gates. It operates at a max clock frequency of 350 MHz and has a max supply voltage of 1.575 V. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.
XCAU15P-1UBVA368E
FIELD PROGRAMMABLE GATE ARRAY;
M2GL025-FGG484
M2GL025-FGG484 by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.14-1.26V, it has a package style of grid array and is suitable for applications requiring high-speed data processing in industrial automation and telecommunications.
XC6SLX75-2FGG484I
Xilinx XC6SLX75-2FGG484I FPGA offers 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
EP2C20Q240C8N
The Intel EP2C20Q240C8N FPGA features 18752 logic cells, 1172 CLBs, and a max clock frequency of 402.5 MHz. Ideal for applications requiring high-speed processing and programmable ICs in fields like telecommunications, aerospace, and industrial automation.
ICE40UP5K-SG48ITR50
ICE40UP5K-SG48ITR50 by Lattice Semiconductor is a CMOS FPGA with 5280 logic cells, 660 CLBs, and 39 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 1.26 V. Ideal for applications requiring high flexibility and programmability in a compact form factor.
LFE5UM-85F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
EP2C8T144C8N
EP2C8T144C8N by Intel is a FPGA with 8256 logic cells, 516 CLBs, and max clock frequency of 402.5 MHz. It operates at temperatures from 0 to 85 °C and has a package style of flatpack, low profile, fine pitch. Ideal for applications requiring high-speed processing and programmable logic in compact form factors.
XC7A200T-2FBG676C
Xilinx XC7A200T-2FBG676C FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
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EP2AGZ225HF40I3N
EP2AGZ225HF40I3N is a 224,000 logic cell FPGA by Altera with a maximum clock frequency of 500 MHz. It has 734 inputs and outputs, operates in an industrial temperature range, and is suitable for various applications requiring programmable ICs.
EP2AGZ225HF40I3N by Intel is a FPGA with 224,000 logic cells and 734 inputs/outputs. It operates at a max clock frequency of 500 MHz and supports multiple power supplies. Ideal for industrial applications requiring high-speed processing in a compact form factor.
EP2AGX190FF35C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX45DF29I3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX65DF29C5N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX260FF35C6G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
EP2AGX125EF35I3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX65DF25C5N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 572; Package Code: HBGA; Package Shape: SQUARE;
EP2AGX260EF29I3N
EP2AGX45DF29C4N
EP2AGX95EF35I5N
EP2AGX125EF29C4N
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