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EP2AGX125EF29C4G

Intel

EP2AGX125EF29C4G by Intel

EP2AGX125EF29C4G by Intel is a Field Programmable Gate Array (FPGA) with 118,143 logic cells. It has a max supply voltage of 0.93V and can operate at temperatures up to 85°C. This FPGA is suitable for various applications requiring programmable ICs and offers a package style of grid array with heat sink/slug.

Median Price

$2,524.740

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 36 parts In-Stock

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$2,524.740

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Vyrian

USA . 1,280 parts In-Stock

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Digiode

USA . 367 parts In-Stock

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367

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Distributors (Availability)

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AZTECH Wire

Italy . 407 parts In-Stock

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$9.165

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Ampacity Inc.

Singapore . 374 parts In-Stock

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$31.000

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MARBEL Systems

Belgium . 1,000 parts In-Stock

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$55.768

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$53.537

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$55.768

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Texas Native Microelectronics

USA . 1,070 parts In-Stock

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$64.101

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$61.537

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$59.614

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Kenton Components

USA . 28 parts In-Stock

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$76.921

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$67.691

28

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Aranea Global

USA . 1,000 parts In-Stock

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$2,474.245

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$2,375.275

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Continental Prestige Electronics

USA . 2,280 parts In-Stock

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$2,524.740

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Argo Parts USA

USA . 1,537 parts In-Stock

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$2,524.740

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$2,499.493

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$2,474.245

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$2,448.998

1,537

$2,524.740

$2,499.493

$2,474.245

$2,448.998

Microchip USA

USA . 1,980 parts In-Stock

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$2,525.237

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$2,525.237

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Qasali Group International

UK . 781 parts In-Stock

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$166.150

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$152.304

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Corphita

USA . 236 parts In-Stock

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Overview

Upgrade your technology with the EP2AGX125EF29C4G from Intel! As a leader in manufacturing, Intel delivers top-notch quality and reliability. This FPGA offers endless possibilities for your applications, whether you're in robotics, aerospace, or telecommunications. Experience the value of seamless integration, increased performance, and improved efficiency. With its advanced features and flexibility, the EP2AGX125EF29C4G is designed to meet all your needs. Stay ahead of the competition and unlock your full potential with Intel's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making it a reliable choice for various environments.

No. of Logic Cells: 118,143

With a high number of logic cells, this FPGA provides extensive programmability and flexibility, allowing for complex and advanced digital designs.

Surface Mount: YES

The surface mount feature simplifies the integration process and facilitates efficient PCB assembly, making it a convenient option for manufacturers and reducing time-to-market.

Maximum Supply Voltage: 0.93 V

The FPGA's low maximum supply voltage enables power-efficient operation, contributing to energy savings and reducing overall system heating.

No. of CLBs: 4,964

The multiple configurable logic blocks (CLBs) offer a substantial amount of customizable resources, enabling the implementation of diverse and intricate digital functions.

No. of Inputs: 372

With a generous number of inputs, this FPGA accommodates connectivity requirements for a wide range of devices, ensuring seamless integration and data exchange.

Package Shape: SQUARE

The square package shape allows for compact and space-efficient installation, making it suitable for applications where size constraints are a concern.

Form Of Terminal: BALL

The ball form of terminal offers reliable electrical connections and secure solder joints, enhancing the durability and longevity of the FPGA in demanding operating conditions.

Nominal Supply Voltage (V): 0.9

The low nominal supply voltage contributes to power efficiency and enhances the overall energy-saving capabilities of the FPGA.

No. of Terminals: 780

The presence of a large number of terminals facilitates versatile connectivity options, enabling seamless integration and ensuring compatibility with various systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this product grants users the ability to modify and reconfigure the circuitry to suit specific application requirements, offering versatility and adaptability.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The inclusion of a heat sink/slug in the grid array package style ensures efficient heat dissipation, mitigating thermal issues and promoting stable performance.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage enhances power efficiency while still providing reliable operation, making it suitable for energy-conscious applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding environments without compromising performance, ensuring reliable operation under challenging conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for precise and secure electrical connections, reducing the risk of signal degradation and ensuring reliable data transmission.

Organization: 4,964 CLBs

The organizational structure of 4,964 configurable logic blocks (CLBs) enables efficient design implementation and offers scalability for complex digital systems.

Minimum Operating Temperature: 0 °C

The FPGA's ability to operate reliably at low temperatures makes it suitable for applications that require extended temperature ranges or exposure to cold environments.

Position Of Terminal: BOTTOM

The bottom position of the terminal simplifies board layout and routing, enhancing ease of integration and facilitating efficient PCB designs.

Maximum Seated Height: 2.6 mm

With a relatively low maximum seated height, this FPGA allows for compact and space-saving designs, making it well-suited for applications with limited vertical clearance.

Width: 29 mm

With a width of 29 mm, this FPGA offers a compact form factor, enabling flexibility in system design and ensuring efficient utilization of available space.

No. of Outputs: 372

The inclusion of a significant number of outputs enables versatile data distribution and control capabilities, accommodating diverse system requirements.

Length: 29 mm

The FPGA's length of 29 mm provides a compact footprint, allowing for efficient integration in space-constrained applications while not compromising functionality.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2AGX125EF29C4G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

118143

No. of Inputs:

372

No. of Outputs:

372

No. of CLBs:

4964

Organization:

4964 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

EP2AGX125EF29C4G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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