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EP2AGX260EF29I3N

Intel

EP2AGX260EF29I3N by Intel

EP2AGX260EF29I3N by Intel is a FPGA with 244188 logic cells, 10260 CLBs, and a max clock frequency of 500 MHz. It is used in industrial applications requiring high-speed processing and programmable IC capabilities. With a package style of grid array and heat sink/slug, it operates b/w -40 to 100 °C temperature range.

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Nova Conductors

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Andel Nordic

Denmark . 566 parts In-Stock

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One Stop Electronics

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Semicontronic

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Kenton Components

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Component Stockers USA

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Modulus Dynamics

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Texas Native Microelectronics

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Supply Digital

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Aranea Global

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Qasali Group International

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Overview

Unlock the potential of your projects with the EP2AGX260EF29I3N FPGA by Intel. With over 244,000 logic cells and 10,260 CLBs, this powerful device offers unparalleled flexibility and performance for a wide range of applications. Whether you're developing cutting-edge electronics or optimizing industrial processes, this FPGA's advanced features and reliable Intel manufacturing ensure top-notch results. Experience the value and innovation that only Intel can deliver with the EP2AGX260EF29I3N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package lightweight and durable, ensuring the safety of the internal components.

No. of Logic Cells: 244188

High number of logic cells allow for complex programmable logic designs to be implemented efficiently.

Surface Mount: YES

Surface mount technology makes it easy to integrate this FPGA into various electronic systems for efficient usage.

Maximum Supply Voltage: 0.93 V

Operates at a low maximum supply voltage, which can help in reducing power consumption and heat generation.

No. of CLBs: 10260

With a large number of Configurable Logic Blocks (CLBs), this FPGA offers flexibility in designing and implementing logic functions.

No. of Inputs: 372

Multiple input pins allow connectivity to external devices and inputs, enhancing the versatility of this FPGA.

Package Shape: SQUARE

Square package shape makes it easier to handle and mount this FPGA on circuit boards, optimizing space efficiency.

Form Of Terminal: BALL

Ball terminal design ensures reliable connections and easy soldering during the assembly process.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage of 0.9V ensures consistent performance of the FPGA in various operating conditions.

Power Supplies (V): 0.9,1.2/3.3,1.5,2.5

Support for multiple power supply voltages allows for compatibility with different power sources and system configurations.

No. of Terminals: 780

Ample number of terminals provide connectivity options and ease of integration with external components and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this FPGA allows for customizable logic functions and quick reprogramming as per requirements.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style along with heat sink or slug helps in efficient heat dissipation and maintaining optimal operating temperatures.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and efficient power management.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance of 100°C allows this FPGA to operate reliably in industrial environments with varying temperature conditions.

Pitch Of Terminal: 1 mm

Optimal terminal pitch of 1mm aids in easier assembly and soldering of the FPGA on circuit boards.

Organization: 10260 CLBS

Organized into 10260 Configurable Logic Blocks (CLBs), this FPGA provides a structured layout for designing and implementing logic functions efficiently.

Minimum Operating Temperature: -40 °C

Wide temperature range of -40 to 100°C allows for reliable operation in extreme cold environments as well as industrial settings.

Finishing Of Terminal Used: TIN SILVER COPPER

Use of tin, silver, and copper for terminal finishing ensures good conductivity, corrosion resistance, and durability of the connections.

Position Of Terminal: BOTTOM

Bottom terminal placement facilitates easier integration of this FPGA into circuit boards and ensures proper alignment of connections.

Maximum Seated Height: 2.7 mm

Low seated height of 2.7mm allows for compact and space-efficient placement of the FPGA on circuit boards.

Width: 29 mm

Narrow width of 29mm enables efficient space utilization on circuit boards, especially in constrained electronic systems.

Maximum Clock Frequency: 500 MHz

High maximum clock frequency of 500MHz enables fast processing and execution of logic functions, making this FPGA suitable for high-performance applications.

No. of Outputs: 372

Multiple output pins provide flexibility in connecting to external devices and systems, enhancing the functionality of this FPGA.

Length: 29 mm

Compact length of 29mm complements the narrow width and low height of this FPGA, allowing for efficient placement on circuit boards.

Grading Of Temperature: INDUSTRIAL

Suitable for industrial applications, this FPGA can withstand wide temperature ranges and harsh environmental conditions, ensuring reliable operation in demanding settings.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2AGX260EF29I3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

244188

No. of Inputs:

372

No. of Outputs:

372

No. of CLBs:

10260

Maximum Clock Frequency:

500 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

10260 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9,1.2/3.3,1.5,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2AGX260EF29I3N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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