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5AGXMB1G4F35I5G

Intel

5AGXMB1G4F35I5G by Intel

Intel's 5AGXMB1G4F35I5G FPGA features 300K logic cells, TSMC technology, and 136880 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

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VNN

France . 26,811 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 563 parts In-Stock

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Ampacity Inc.

Singapore . 1,428 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 990 parts In-Stock

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Qasali Group International

UK . 22 parts In-Stock

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Vigor

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Microchip USA

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Overview

Unlock limitless possibilities with the Intel 5AGXMB1G4F35I5G Field Programmable Gate Array. Crafted by industry leader Intel, this FPGA offers unparalleled quality and reliability. Perfect for a wide range of applications, this versatile device allows for custom configurations to suit your specific needs. Experience the benefits of enhanced performance, flexibility, and efficiency with this innovative product. Trust Intel to deliver cutting-edge technology that empowers you to push boundaries and achieve your goals like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and reliability for the product.

No. of Logic Cells: 300000

High number of logic cells allows for complex logic implementations.

Surface Mount: YES

This makes it easy to mount and integrate the FPGA onto various electronic devices.

Maximum Supply Voltage: 1.13 V

Allows for efficient power usage within this range.

No. of CLBs: 136880

Large number of configurable logic blocks provides flexibility in design.

Technology Used: TSMC

Known for high-quality semiconductor manufacturing, ensuring reliability and performance.

No. of Inputs: 704

Sufficient number of inputs for handling complex input requirements.

Package Shape: SQUARE

Square shape allows for efficient use of space on PCBs.

Form Of Terminal: BALL

Ball terminals are known for good electrical contact and reliability.

Nominal Supply Voltage (V): 1.1

Optimal supply voltage for efficient performance.

No. of Terminals: 1152

Sufficient terminals for connections and interfacing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA provides flexibility for reconfigurable logic implementation.

Package Style (Meter): GRID ARRAY

Grid array packaging allows for easy mounting and alignment.

Minimum Supply Voltage: 1.07 V

Allows for efficient power usage at lower voltages.

Maximum Operating Temperature: 100 °C

Suitable for industrial applications with high operating temperatures.

Pitch Of Terminal: 1 mm

Standard pitch for easy soldering and mounting.

Organization: 136880 CLBS

Well-organized logic blocks allow for efficient design implementation.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments as well.

Position Of Terminal: BOTTOM

Bottom positioning of terminals for convenient PCB layout.

Maximum Seated Height: 2.7 mm

Low profile for space-constrained applications.

Width: 35 mm

Compact width for fitting into various electronic designs.

No. of Outputs: 704

Balanced number of outputs for complex logic operations.

Length: 35 mm

Compact length for space-saving designs.

Grading Of Temperature: INDUSTRIAL

Suitable for industrial temperature range applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGXMB1G4F35I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

704

No. of Outputs:

704

No. of CLBs:

136880

Technology:

TSMC

Organization:

136880 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

5AGXMB1G4F35I5G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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