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1SG040HH3F35E2LG

Intel

1SG040HH3F35E2LG by Intel

The Intel 1SG040HH3F35E2LG FPGA features 378K logic cells, 47.25K CLBs, and 430 inputs/outputs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor. With a package style of grid array and square shape, it is suitable for various electronic systems with stringent space constraints.

Median Price

$4,409.907

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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VNN

France . 26,808 parts In-Stock

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Vyrian

USA . 4,932 parts In-Stock

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 449 parts In-Stock

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$14.494

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Ampacity Inc.

Singapore . 847 parts In-Stock

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Texas Native Microelectronics

USA . 165 parts In-Stock

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$104.313

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$98.704

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Continental Prestige Electronics

USA . 6,210 parts In-Stock

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Argo Parts USA

USA . 1,353 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Microchip USA

USA . 1,133 parts In-Stock

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MARBEL Systems

Belgium . 4,906 parts In-Stock

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Qasali Group International

UK . 962 parts In-Stock

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Kenton Components

USA . 450 parts In-Stock

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Corphita

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Overview

Experience unparalleled performance and versatility with the 1SG040HH3F35E2LG by Intel, a top-of-the-line Field Programmable Gate Array. Boasting 378,000 logic cells and 47,250 CLBs, this FPGA offers endless possibilities for customization and optimization. Whether you're in the aerospace, automotive, or telecommunications industry, this product delivers high-quality results with its cutting-edge technology. Trust in Intel's reputation for excellence and unlock the full potential of your projects with the 1SG040HH3F35E2LG. Elevate your work to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring a longer lifespan for the product.

No. of Logic Cells: 378000

With a large number of logic cells, this FPGA can handle complex and demanding tasks efficiently.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 0.88 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 47250

Having a high number of Configurable Logic Blocks enables flexibility and customization in designing the circuitry.

No. of Inputs: 430

A large number of inputs allow for a wide range of input signals to be processed, making the FPGA versatile in its applications.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and integrate into various system designs.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage ensures stable and reliable operation of the FPGA within specified limits.

No. of Terminals: 1152

With a high number of terminals, there is ample connectivity options available, allowing for seamless integration with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA can be reconfigured and updated as needed, making it adaptable for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and efficient layout for the components, optimizing space usage on a circuit board.

Minimum Supply Voltage: 0.82 V

The low minimum supply voltage ensures compatibility with various power sources and helps in achieving energy-saving goals.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range allows for reliable performance even in harsh environmental conditions.

Pitch Of Terminal: 1 mm

The pitch of the terminals enables easy connection and soldering during installation, simplifying the manufacturing process.

Organization: 47250 CLBS

The organized structure of 47250 Configurable Logic Blocks allows for efficient utilization of resources and logical operations.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments without any adverse effects.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom makes it easier to mount and connect the FPGA on a circuit board, enhancing ease of use.

Maximum Seated Height: 3.706 mm

With a low maximum seated height, this FPGA can be installed in compact devices or systems with space constraints.

Width: 35 mm

The compact width of the FPGA allows for easy integration into various system designs without taking up too much space.

No. of Outputs: 430

A high number of outputs enable the FPGA to drive multiple external devices or signals, enhancing its functionality and versatility.

Length: 35 mm

The compact length of the FPGA ensures it can fit in tight spaces or densely populated circuit boards, making it a versatile choice for designs with space constraints.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 1SG040HH3F35E2LG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

378000

No. of Inputs:

430

No. of Outputs:

430

No. of CLBs:

47250

Organization:

47250 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.82 V

Maximum Supply Voltage:

.88 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.706 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

1SG040HH3F35E2LG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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