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MPF300TL-FCG1152E

Microchip Technology

MPF300TL-FCG1152E by Microchip Technology

MPF300TL-FCG1152E by Microchip is a 300K logic cell FPGA with CMOS tech, 512 inputs/outputs. It's a grid array package suitable for applications requiring high-density programmable ICs in compact form factors. Operating temp range of 0-100°C and low supply voltage make it ideal for power-efficient designs.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 3,306 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Digiode

USA . 384 parts In-Stock

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384

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AZTECH Wire

Italy . 343 parts In-Stock

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$8.872

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Ampacity Inc.

Singapore . 829 parts In-Stock

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$10.000

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Semicontronic

India . 784 parts In-Stock

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$23.000

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$22.425

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$22.310

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Aztec Data Supply Inc.

USA . 61 parts In-Stock

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$62.953

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Corohmni

South Africa . 452 parts In-Stock

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Vigor

Singapore . 889 parts In-Stock

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$499.210

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NIA Electronics

USA . 7,842 parts In-Stock

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Ledger Components

France . 7,842 parts In-Stock

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Montano Global Distributors

Canada . 7,130 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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LOOK Integrated Logistics

Peru . 1,331 parts In-Stock

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LMD Electronica

Estonia . 575 parts In-Stock

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Corphita

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Aranea Global

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Overview

Unlock a world of endless possibilities with the MPF300TL-FCG1152E by Microchip Technology. As a leading manufacturer of Field Programmable Gate Arrays, Microchip delivers top-notch quality and reliability. This FPGA is perfect for a variety of applications, offering a seamless integration and unparalleled performance. Say hello to increased efficiency, flexibility, and innovation with this cutting-edge technology. Elevate your projects to new heights with the MPF300TL-FCG1152E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and reliability, making it suitable for a variety of environments.

No. of Logic Cells: 300000

With a high number of logic cells, this FPGA can handle complex designs and tasks effectively.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto circuit boards.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

Technology Used: CMOS

CMOS technology offers high speed and low power performance, ideal for efficient operation.

No. of Inputs: 512

With a large number of inputs, this FPGA can process a significant amount of data simultaneously.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on PCBs.

Form Of Terminal: BALL

Ball terminals provide secure connections and efficient heat dissipation for optimal performance.

No. of Terminals: 1152

A high number of terminals allow for versatile connectivity options with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, it offers flexibility for customization and reprogramming as needed.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout for easy integration.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage helps in achieving energy efficiency and prolonging battery life.

Maximum Operating Temperature: 100 °C

With a high operating temperature limit, this FPGA can withstand demanding conditions.

Pitch Of Terminal: 1 mm

The tight terminal pitch allows for densely packed connections, saving space on the PCB.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA is suitable for a wide range of environments.

Position Of Terminal: BOTTOM

Bottom terminals simplify the installation process and provide a secure connection.

Maximum Seated Height: 3.47 mm

The low seated height allows for a slim profile, ideal for compact device designs.

Width: 35 mm

The moderate width provides a good balance between space savings and ease of handling.

No. of Outputs: 512

The large number of outputs allows for multiple signals to be generated simultaneously.

Length: 35 mm

The compact length of this FPGA makes it suitable for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TL-FCG1152E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

512

No. of Outputs:

512

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF300TL-FCG1152E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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