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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
AM6231AKGGHHALW by Texas Instruments

AM6231AKGGHHALW

Texas Instruments

AM6231AKGGHHALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 0.715-0.79V. This square-shaped IC is ideal for applications requiring very thin profile and fine pitch grid array packages.

S-PBGA-B425

13 mm

425

95 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6234ATGGHAALW by Texas Instruments

AM6234ATGGHAALW

Texas Instruments

AM6234ATGGHAALW by Texas Instruments is a 425-terminal SoC IC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This very thin profile, fine pitch grid array package is ideal for applications requiring high performance in compact spaces.

S-PBGA-B425

13 mm

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6254ASGGHAALW by Texas Instruments

AM6254ASGGHAALW

Texas Instruments

AM6254ASGGHAALW by Texas Instruments is a SoC peripheral IC with CMOS technology. It features 425 terminals in a grid array package style with 0.5mm terminal pitch. This IC operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V, making it suitable for various applications requiring precise control and processing capabilities.

S-PBGA-B425

13 mm

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6254ATGGHAALW by Texas Instruments

AM6254ATGGHAALW

Texas Instruments

AM6254ATGGHAALW by Texas Instruments is a 425-terminal SoC IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. This grid array package is ideal for applications requiring very thin profile and fine pitch components.

S-PBGA-B425

13 mm

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6232ASGGHAALW by Texas Instruments

AM6232ASGGHAALW

Texas Instruments

AM6232ASGGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40°C to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

S-PBGA-B425

13 mm

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6231ASGGHAALW by Texas Instruments

AM6231ASGGHAALW

Texas Instruments

AM6231ASGGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

S-PBGA-B425

13 mm

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

AM6234ATCGHAALW by Texas Instruments

AM6234ATCGHAALW

Texas Instruments

AM6234ATCGHAALW by Texas Instruments is a SoC peripheral IC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and low profile components.

S-PBGA-B425

13 mm

3

425

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA425,25X25,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

250

.89 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.5 mm

BOTTOM

13 mm

SoC

ESP32-S3-WROOM-1U-N4R2 by Espressif Systems (Shanghai)

ESP32-S3-WROOM-1U-N4R2

Espressif Systems (Shanghai)

ESP32-S3-WROOM-1U-N4R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.

R-XXMA-N41

19.2 mm

41

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.35 mm

3.6 V

3 V

3.3 V

YES

CMOS

NO LEAD

1.27 mm

UNSPECIFIED

18 mm

SoC

ESP32-S3-WROOM-1-N16 by Espressif Systems (Shanghai)

ESP32-S3-WROOM-1-N16

Espressif Systems (Shanghai)

ESP32-S3-WROOM-1-N16 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.

R-XXMA-N41

25.5 mm

41

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.25 mm

3.6 V

3 V

3.3 V

YES

CMOS

NO LEAD

1.27 mm

UNSPECIFIED

18 mm

SoC

ESP32-S3-WROOM-1U-N8 by Espressif Systems (Shanghai)

ESP32-S3-WROOM-1U-N8

Espressif Systems (Shanghai)

ESP32-S3-WROOM-1U-N8 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size and surface mount capability.

R-XXMA-N41

19.2 mm

41

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.35 mm

3.6 V

3 V

3.3 V

YES

CMOS

NO LEAD

1.27 mm

UNSPECIFIED

18 mm

SoC

ESP32-S3-WROOM-1-N16R2 by Espressif Systems (Shanghai)

ESP32-S3-WROOM-1-N16R2

Espressif Systems (Shanghai)

ESP32-S3-WROOM-1-N16R2 by Espressif Systems (Shanghai) is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package and surface mount capability.

R-XXMA-N41

25.5 mm

41

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.25 mm

3.6 V

3 V

3.3 V

YES

CMOS

NO LEAD

1.27 mm

UNSPECIFIED

18 mm

SoC

LS1023AXE7MQB by NXP Semiconductors

LS1023AXE7MQB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 105 Cel;

S-PBGA-B621

e1

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

SQUARE

250

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

SoC

LS1043AXE7MQB by NXP Semiconductors

LS1043AXE7MQB

NXP Semiconductors

LS1043AXE7MQB by NXP Semiconductors is a SoC with 621 terminals, CMOS technology, and operates b/w -40 to 105°C. It features a square package shape, PLASTIC/EPOXY body material, and TIN SILVER COPPER terminal finish. Ideal for applications requiring high-performance processing in compact designs.

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

SQUARE

250

1.92 mm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SoC

MCIMX6S5EVM10ADR by NXP Semiconductors

MCIMX6S5EVM10ADR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

CY8C4248BZS-L489 by Infineon Technologies

CY8C4248BZS-L489

Infineon Technologies

PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 124; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B241

9 mm

3

124

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA124,13X13,25

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

5.5 V

1.71 V

3.3 V

YES

CMOS

BALL

.65 mm

BOTTOM

9 mm

PROGRAMMABLE SoC

CYPM1211-42FNXIT by Infineon Technologies

CYPM1211-42FNXIT

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: BALL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 3.184 mm;

R-PBGA-B42

3.184 mm

42

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA42,6X7,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.55 mm

5.5 V

2.7 V

3.3 V

YES

CMOS

BALL

.4 mm

BOTTOM

2.633 mm

CRYPTOGRAPHIC AUTHENTICATOR

ESP32-WROOM-32UE-N8 by Espressif Systems (Shanghai)

ESP32-WROOM-32UE-N8

Espressif Systems (Shanghai)

ESP32-WROOM-32UE-N8 by Espressif Systems is a SoC with 38 terminals, operating at 3.3V nominal voltage and 85°C max temp. Ideal for IoT applications due to its CMOS technology, compact size (19.2mm x 18mm), and surface mount capability.

R-XXMA-N38

19.2 mm

3

38

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

250

3.35 mm

3.6 V

3 V

3.3 V

YES

CMOS

NO LEAD

1.27 mm

UNSPECIFIED

30

18 mm

SoC

AM6421BSFGHAALV by Texas Instruments

AM6421BSFGHAALV

Texas Instruments

AM6421BSFGHAALV by Texas Instruments is a System on Chip with 441 terminals in a fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring high-performance microcontrollers in compact designs.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

AM6441BSFFHAALV by Texas Instruments

AM6441BSFFHAALV

Texas Instruments

AM6441BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with 441 terminals in a GRID ARRAY package. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and CMOS technology.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6442BSFGHAALV by Texas Instruments

AM6442BSFGHAALV

Texas Instruments

AM6442BSFGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at speeds up to 1000 rpm and has a max supply voltage of 0.79 V. This IC is ideal for applications requiring high performance in a compact form factor, such as mobile devices and IoT products.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6411BKCGHAALV by Texas Instruments

AM6411BKCGHAALV

Texas Instruments

AM6411BKCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring fine pitch and ball terminal form technology.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6412BSCGHAALV by Texas Instruments

AM6412BSCGHAALV

Texas Instruments

AM6412BSCGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance in compact spaces.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6441BSEFHAALV by Texas Instruments

AM6441BSEFHAALV

Texas Instruments

AM6441BSEFHAALV by Texas Instruments is a 441-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch grid array package style and surface mount compatibility.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

AM6442BSDGHAALV by Texas Instruments

AM6442BSDGHAALV

Texas Instruments

AM6442BSDGHAALV by Texas Instruments is a CMOS system-on-chip with 441 terminals in a square grid array package. It operates at temperatures ranging from -40 to 105 °C and has a max supply voltage of 0.79 V. This IC is commonly used in applications requiring high-speed processing, such as data centers or telecommunications equipment.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6442BSFFHAALV by Texas Instruments

AM6442BSFFHAALV

Texas Instruments

AM6442BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. This IC is ideal for applications requiring high-speed processing in compact electronic devices.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6411BSCGHAALV by Texas Instruments

AM6411BSCGHAALV

Texas Instruments

AM6411BSCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring high-performance computing in compact spaces.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6421BSFFHAALV by Texas Instruments

AM6421BSFFHAALV

Texas Instruments

AM6421BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It features 441 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w -40 to 105 °C, it's ideal for applications requiring low power consumption and high performance in compact designs.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6442BSEFHAALV by Texas Instruments

AM6442BSEFHAALV

Texas Instruments

AM6442BSEFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for high-speed applications requiring fine pitch components.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

AM6442BSEGHAALV by Texas Instruments

AM6442BSEGHAALV

Texas Instruments

AM6442BSEGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. This IC has 441 terminals in a GRID ARRAY package style and is ideal for various applications requiring high-speed processing.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

CY8C4045AZQ-S413 by Infineon Technologies

CY8C4045AZQ-S413

Infineon Technologies

PSoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Width: 7 mm;

S-PQFP-G48

7 mm

48

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.6 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

7 mm

PSoC

XCVE1752-1MLINSVG1369 by Xilinx

XCVE1752-1MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LSENSVG1369 by Xilinx

XCVE1752-2LSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLENSVG1369 by Xilinx

XCVE1752-2MLENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSENSVG1369 by Xilinx

XCVE1752-2MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2HSINSVG1369 by Xilinx

XCVE1752-2HSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSINSVG1369 by Xilinx

XCVE1752-2MSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LLINSVG1369 by Xilinx

XCVE1752-1LLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSINSVG1369 by Xilinx

XCVE1752-1LSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSENSVG1369 by Xilinx

XCVE1752-1MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSINSVG1369 by Xilinx

XCVE1752-1MSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLINSVG1369 by Xilinx

XCVE1752-2MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSENSVG1369 by Xilinx

XCVE1752-1LSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LLENSVG1369 by Xilinx

XCVE1752-2LLENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

AM6422BSDGHAALV by Texas Instruments

AM6422BSDGHAALV

Texas Instruments

AM6422BSDGHAALV by Texas Instruments is a SYSTEM ON CHIP with a max supply voltage of 0.79 V and a min operating temperature of -40 °C. It is used in applications requiring high speed and low power consumption.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

P1025NXE5DFB by NXP Semiconductors

P1025NXE5DFB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B561

23 mm

3

561

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA561,27X27,32

SQUARE

GRID ARRAY, FINE PITCH

2.3 mm

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SoC

ESP32-WROOM-32E(M113EH2800PH3Q0) by Espressif Systems (Shanghai)

ESP32-WROOM-32E(M113EH2800PH3Q0)

Espressif Systems (Shanghai)

ESP32-WROOM-32E by Espressif Systems is a SoC with 38 terminals, CMOS technology, and 1.27mm terminal pitch. Its compact size (18x25.5 mm) makes it ideal for IoT applications requiring surface mount microelectronic assemblies with low seated height of 3.35mm.

R-XXMA-N38

25.5 mm

38

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.35 mm

YES

CMOS

NO LEAD

1.27 mm

UNSPECIFIED

18 mm

SoC

TDA4VE88TGAALZRQ1 by Texas Instruments

TDA4VE88TGAALZRQ1

Texas Instruments

TDA4VE88TGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 0.76V to 0.84V. This IC has 770 terminals in a GRID ARRAY package style and is suitable for automotive applications under AEC-Q100 and ISO 26262 standards.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

TDA4AL88TGAALZRQ1 by Texas Instruments

TDA4AL88TGAALZRQ1

Texas Instruments

TDA4AL88TGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has 770 terminals in a GRID ARRAY, FINE PITCH package style. Ideal for automotive applications meeting AEC-Q100 and ISO 26262 standards.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP