Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TDA8029HL/C207,151
NXP Semiconductors
TDA8029HL/C207,151 by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE package. It operates b/w -40 to 90 °C and supports power supplies of 1.8/5,3/5 V. Ideal for industrial applications requiring high temperature tolerance and surface mount compatibility.
S-PQFP-G32
1
32
90 Cel
-40 Cel
PLASTIC/EPOXY
QFP
QFP32,.35SQ,32
SQUARE
FLATPACK
260
1.8/5,3/5
Not Qualified
Other Microprocessor ICs
YES
INDUSTRIAL
GULL WING
.8 mm
QUAD
MICROPROCESSOR CIRCUIT
MFRC53001T/0FE,518
MFRC53001T/0FE,518 by NXP Semiconductors is a microprocessor circuit with a 5V supply and operates b/w -25 °C to 85 °C. It features a compact rectangular package with 32 terminals and supports surface mount technology. Ideal for various peripheral applications, it ensures efficient performance in constrained spaces.
R-PDSO-G32
3
85 Cel
-25 Cel
SOP
SOP32,.4
RECTANGULAR
SMALL OUTLINE
250
5
40 mA
5 V
OTHER
1.27 mm
DUAL
TDA8026ET/C2,518
TDA8026ET/C2,518 by NXP Semiconductors is a microprocessor circuit with a 3.3V supply and operates b/w -25 °C to 85 °C. It features a fine pitch grid array package with 64 terminals and supports surface mount technology. Ideal for various embedded applications, it ensures reliable performance in compact designs.
S-PBGA-B64
e1
2
64
FBGA
BGA64,8X8,32
GRID ARRAY, FINE PITCH
3.3
260 mA
3.3 V
TIN SILVER COPPER
BALL
BOTTOM
30
TDA8026ET/C2,551
NXP Semiconductors TDA8026ET/C2,551 is a MICROPROCESSOR CIRCUIT with 64 terminals and 3.3V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring a fine pitch GRID ARRAY package style. With a peak reflow temp of 260°C, it's ideal for SMT assembly in electronics manufacturing.
TDA8026ET/C2,557
TDA8026ET/C2,557 by NXP Semiconductors is a microprocessor circuit in a square grid array package. It operates at 3.3V with a max current of 260mA and supports temperatures from -25 °C to 85 °C. Ideal for compact electronic applications requiring efficient processing.
MF0ICU1001W/S7DL,0
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified;
70 Cel
DIE OR CHIP
MF0ICU1001W/U7DL,0
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel; Package Equivalence Code: DIE OR CHIP;
MF0ICU1101W/U7DL,0
MF0ICU1101W/S7DL,0
TDA8035HN/C1,157
NXP Semiconductors TDA8035HN/C1,157 is a CMOS microprocessor circuit with 32 terminals. It operates b/w -25 to 85 °C and requires 2.7-5.5 V supply voltage. This chip carrier is ideal for applications needing very thin profile peripheral ICs in surface-mount technology.
S-PQCC-N32
5 mm
HVQCCN
LCC32,.2SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
220 mA
5.5 V
2.7 V
CMOS
NO LEAD
.5 mm
MFRC52301HN1,151
MFRC52301HN1,151 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.
e4
QCCN
CHIP CARRIER
3/3.3
10 mA
NICKEL PALLADIUM GOLD
MFRC52301HN1,157
MFRC52301HN1,157 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.
MFRC52201HN1,118
The NXP Semiconductors MFRC52201HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE CHIP CARRIER package. It operates at -25 to 85 °C and requires 3/3.3V power supply. Ideal for applications requiring contactless communication such as RFID systems and access control devices.
100 mA
MFRC52202HN1,118
The NXP Semiconductors MFRC52202HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals and operates at 3/3.3V. It comes in a PLASTIC/EPOXY square chip carrier package style suitable for surface mount applications. With an operating temperature range of -25 to 85°C, it is ideal for various embedded systems requiring low power consumption.
TEA1792T/N1,118
TEA1792T/N1,118 by NXP Semiconductors is a compact surface-mount IC designed for power supply applications. It operates at a nominal voltage of 20V and features an 8-terminal gull-wing design with a peak reflow temp of 260 °C. Ideal for efficient energy management in various electronic devices.
R-PDSO-G8
8
SOP8,.25
20
20 V
TEA1792TS/1,115
TEA1792TS/1,115 by NXP Semiconductors is a 6-terminal IC with a nominal voltage of 20V. It features a small outline, thin profile package style and gull wing terminal form for surface mount applications. Ideal for power supplies, this rectangular-shaped IC operates at peak reflow temperature of 260°C.
R-PDSO-G6
6
TSOP
TSOP6,.11,37
SMALL OUTLINE, THIN PROFILE
.95 mm
MFRC63102HN,118
MFRC63102HN,118 by NXP Semiconductors is a microprocessor circuit designed for surface mount applications. It operates at 5V with a max supply current of 20mA and withstands temperatures from -25 °C to 85 °C. Ideal for RFID and NFC solutions, it features a compact chip carrier design.
20 mA
MFRC63102HN,551
MFRC63102HN,551 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.
MFRC63102HN,557
MFRC63102HN,557 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.
MFRC63102HN,518
MFRC63102HN,518 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for various peripheral applications, it features surface mount technology.
TEA1792ATS/1,115
TEA1792ATS/1,115 by NXP Semiconductors is a compact, surface-mount IC designed for efficient power management. It operates at a nominal voltage of 20V with a max supply current of 1.2mA and features a thin profile package. Ideal for applications requiring reliable voltage regulation in space-constrained environments.
Other uPs/uCs/Peripheral ICs
1.2 mA
SLRC61002HN,157
SLRC61002HN,157 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring reliable performance in harsh environments.
3.3/5
SLRC61002HN,557
SLRC61002HN,557 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring efficient processing in tight spaces.
SLRC61002HN,551
SLRC61002HN,551 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring reliable performance in harsh environments.
SLRC61002HN,518
SLRC61002HN,518 by NXP Semiconductors is a versatile microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring efficient power management and surface mount design.
PR601HL/C1,557
PR601HL/C1,557 by NXP Semiconductors is a microprocessor circuit in a square flatpack with 100 gull-wing terminals. It operates b/w -25 °C and 70 °C and supports power supplies of 3.3V and 5V. Ideal for various embedded applications, it features surface mount technology for efficient integration.
S-PQFP-G100
100
QFP100,.63SQ,20
3.3,5
MF0UL1101DUD,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -20 Cel; Package Equivalence Code: DIE OR CHIP;
-20 Cel
COMMERCIAL
MF0UL1101DUF,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Maximum Operating Temperature: 70 Cel;
MF0UL2101DUD,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Qualification: Not Qualified;
MF0UL2101DUF,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel;
SL2MOS5301EV,118
MICROPROCESSOR CIRCUIT; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Package Equivalence Code: MODULE(UNSPEC);
MODULE(UNSPEC)
MICROELECTRONIC ASSEMBLY
SL2MOS5401EV,118
MICROPROCESSOR CIRCUIT; Package Equivalence Code: MODULE(UNSPEC); Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
PN7120A0EV/C10801E
NXP Semiconductors' PN7120A0EV/C10801E is a 49-terminal IC with 1.8V supply voltage, operating b/w -30°C to 85°C. It features a grid array package style, ball terminal form, and tin silver copper finish. Ideal for applications requiring fine pitch surface mount technology in plastic/epoxy packages.
S-PBGA-B49
49
-30 Cel
BGA49,7X7,20
1.8
1.8 V
TDA8007BHL/C4,118
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G48
7 mm
48
LFQFP
QFP48,.35SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
1.6 mm
315 mA
6 V
SDIO101AIHRE
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 60; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N60
60
1.95 V
1.65 V
SDIO101AIHRZ
LH79520N0M000B1
Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: QFP; Package Shape: SQUARE;
S-PQFP-G176
176
0 Cel
QFP176,.87SQ,16
1.8,3.3
.4 mm
LH7A400N0E000B3A
NXP Semiconductors' LH7A400N0E000B3A is a ceramic package IC with 256 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications requiring fine pitch grid array style packaging in commercial-grade environments.
S-XBGA-B256
256
CERAMIC
BGA256,16X16,32
LH7A404N0E000B0A
Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;
S-XBGA-B324
324
BGA324,20X20,32
HTCM400/EAE,122
Other uPs/uCs/Peripheral ICs; Temperature Grade: OTHER; No. of Terminals: 27; Maximum Supply Current: 100 mA; Maximum Operating Temperature: 85 Cel; Package Body Material: PLASTIC/EPOXY;
27
MODULE,27LEAD,1
P82B715TD,118
NXP Semiconductors P82B715TD,118 is an 8-terminal IC with a supply voltage range of 4.5V to 12V. Ideal for industrial applications, it operates b/w -40°C to 85°C and features a small outline package style. This bipolar technology peripheral IC is designed for microprocessor circuits in various electronic devices.
4.9 mm
1.75 mm
12 V
4.5 V
BIPOLAR
3.9 mm
PCA9504ADGG,112
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G56
14 mm
56
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.2 mm
3.6 V
3 V
6.1 mm
PCA9504ADGG,118
TDA8002CG/C1,518
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;
e3
QFP32,.28SQ,20
140 mA
6.5 V
TIN
TDA8002CT/A/C1,512
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G28
17.9 mm
28
2.65 mm
7.5 mm
TDA8002CT/B/C1,512
TDA8002CT/C/C1,512
TDA8002CT/C/C1,518
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