Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MIMX8MM1DVTLZAA
NXP Semiconductors
The NXP Semiconductors MIMX8MM1DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.
S-PBGA-B486
e2
14 mm
3
486
95 Cel
0 Cel
PLASTIC/EPOXY
LFBGA
BGA486,27X27,20
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.25 mm
1.05 V
.95 V
1 V
YES
CMOS
OTHER
TIN SILVER
BALL
.5 mm
BOTTOM
40
SoC
MIMX8MM2DVTLZAA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;
MIMX8MM3DVTLZAA
The NXP Semiconductors MIMX8MM3DVTLZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.
MIMX8MM4DVTLZAA
The NXP Semiconductors MIMX8MM4DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.
MIMX8MM5DVTLZAA
The NXP Semiconductors MIMX8MM5DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.
MIMX8MM1CVTKZAA
The NXP Semiconductors MIMX8MM1CVTKZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w -40 to 105°C, it has a supply voltage range of 0.9-1V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
105 Cel
-40 Cel
.9 V
MIMX8MM3CVTKZAA
The NXP Semiconductors MIMX8MM3CVTKZAA is a SoC with 486 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 0.9V to 1V and uses CMOS technology. This low-profile, fine-pitch IC is suitable for applications requiring high performance in compact spaces.
MCIMX7D5EVK10SD
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.2 V;
S-PBGA-B488
12 mm
488
-20 Cel
TFBGA
BGA488,28X28,16
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
1.25 V
1.2 V
1.225 V
.4 mm
SYSTEM ON CHIP
MIMX8MN1CVTIZAA
SYSTEM ON CHIP; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MIMX8MN1DVTJZAA
The NXP Semiconductors MIMX8MN1DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high-performance computing in compact spaces.
MIMX8MN2CVTIZAA
SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2;
MIMX8MN2DVTJZAA
MIMX8MN3CVTIZAA
SYSTEM ON CHIP; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MIMX8MN3DVTJZAA
MIMX8MN4CVTIZAA
SYSTEM ON CHIP; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40;
MIMX8MN4DVTJZAA
The NXP Semiconductors MIMX8MN4DVTJZAA is a SoC with 486 terminals in a low profile, fine pitch grid array package. It operates b/w 0-95°C with supply voltage range of 0.95-1.05 V. Ideal for applications requiring high performance and compact design in various electronic devices.
MIMX8MN5CVTIZAA
SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Terminal Finish: TIN SILVER;
MIMX8MN5DVTJZAA
The NXP Semiconductors MIMX8MN5DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
MIMX8MN6DVTJZCA
MIMX8MN6DVTJZDA
MCIMX6Z0DVM09ABR
SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.375 V;
S-PBGA-B289
289
BGA289,17X17,32
1.32 mm
1.5 V
1.375 V
.8 mm
MCIMX6DP4AVT8AAR
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
S-PBGA-B624
21 mm
624
125 Cel
FBGA
BGA624,25X25,32
GRID ARRAY, FINE PITCH
2.16 mm
1.4 V
MCIMX6DP4AVT8ABR
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA624,25X25,32;
MCIMX6DP6AVT8AAR
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.4 V;
e1
TIN SILVER COPPER
MCIMX6DP6AVT8ABR
MCIMX6X4AVM08ABR
SoC; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
S-PBGA-B529
19 mm
529
BGA529,23X23,32
1.52 mm
1.275 V
MCIMX6G0DVM05AA
SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
GRID ARRAY
1.3 V
1.15 V
COMMERCIAL
MCIMX6DP4AVT8AA
SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
AUTOMOTIVE
MCIMX6DP5EYM1AA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.
1.6 mm
1.35 V
MCIMX6DP6AVT8AA
MCIMX6DP7CVT8AA
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
GRID ARRAY, HEAT SINK/SLUG
INDUSTRIAL
MCIMX6QP5EYM1AA
MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6QP7CVT8AA
MCIMX6QP7CVT8AA by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability.
MCIMX6G1AVM05AA
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6G1AVM07AA
MCIMX6G2AVM05AA
MCIMX6G2AVM07AA
MCIMX6G1CVM05AA
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
Tin/Silver (Sn/Ag)
MCIMX6G2CVK05AA
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B272
9 mm
272
1.23 mm
MCIMX6G2CVM05AA
MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.
MCIMX6G3CVM05AA
MCIMX7D3DVK10SC
MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.
1.045 V
1.1 V
MCIMX7D3EVK10SC
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;
MCIMX7D7DVM10SC
MCIMX7D7DVM10SC by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating b/w 0-95°C. It has a supply voltage range of 1.045-1.25 V and uses BALL terminal form. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.
S-PBGA-B541
541
BGA541,25X25,30
1.4 mm
.75 mm
LS1043ASE7MNLA
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
S-PBGA-B621
621
HFBGA
BGA621,25X25,32
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
250
2.07 mm
.93 V
.87 V
30
MCIMX6Y0CVM05AA
24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
MCIMX6Y0DVM05AA
MCIMX6Y0DVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.
MCIMX6Y1CVK05AA
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;
BGA272,17X17,20
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