Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6Y1CVM05AA
NXP Semiconductors
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B289
e1
14 mm
3
289
105 Cel
-40 Cel
PLASTIC/EPOXY
LFBGA
BGA289,17X17,32
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.32 mm
1.5 V
1.275 V
YES
CMOS
INDUSTRIAL
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
40
SoC
MCIMX6Y1DVK05AA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B272
9 mm
272
95 Cel
0 Cel
BGA272,17X17,20
1.23 mm
OTHER
.5 mm
MCIMX6Y1DVM05AA
MCIMX6Y1DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w 0-95°C, with supply voltage ranging from 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Y2DVM05AA
MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Y7DVK05AA
MCIMX6Y7DVK05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.
SYSTEM ON CHIP
MKW21Z256VHT4
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;
S-XQCC-N48
e4
48
UNSPECIFIED
QCCN
CHIP CARRIER
3.6 V
1.71 V
3.3 V
NICKEL GOLD
NO LEAD
QUAD
MICROPROCESSOR CIRCUIT
MKW31Z512VHT4R
MKW41Z256VHT4
The NXP Semiconductors MKW41Z256VHT4 is a microprocessor circuit with CMOS technology. It operates b/w -40 to 105°C, with a supply voltage range of 1.71-3.6V. Ideal for industrial applications requiring a surface-mount square package with 48 terminals and nickel gold finish.
MKW41Z512VHT4
The NXP Semiconductors MKW41Z512VHT4 is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.71 to 3.6 V. Ideal for industrial applications requiring high-performance uPs and uCs in surface-mount configurations.
MF3ICDH2101DUD/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;
X-XUUC-N
70 Cel
-25 Cel
DIE
WAFER
UNCASED CHIP
Not Qualified
Other Microprocessor ICs
UPPER
MF3ICDH4101DUD/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER;
MF3ICDH8101DUD/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
MF3MODH2101DA4/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; JESD-30 Code: X-PXMA-N;
X-PXMA-N
MICROELECTRONIC ASSEMBLY
MF3MODH2101DA8/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel; Package Body Material: PLASTIC/EPOXY;
MF3MODH4101DA8/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 70 Cel;
MF3MODH8101DA4/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
MF3MODH8101DA8/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Maximum Operating Temperature: 70 Cel; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
MPXY8510DK016T1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;
S-XQCC-N32
32
125 Cel
HQCCN
CHIP CARRIER, HEAT SINK/SLUG
NOT SPECIFIED
2.3 mm
1.8 V
3 V
AUTOMOTIVE
.65 mm
MPXY8600DK6T1
JN5169-001-M03-2
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 27; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
R-XXMA-N27
21 mm
27
85 Cel
RECTANGULAR
2 V
1.27 mm
16 mm
MCIMX6Y2DVM09AA
MCIMX6Y2DVM09AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.375-1.5 V. This IC has 289 terminals in a GRID ARRAY package, suitable for various uP and uC applications.
1.375 V
MCIMX6Y7DVM09AA
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q4AVT08AE
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
S-PBGA-B624
624
1.6 mm
1.225 V
1.4 V
MCIMX6D5EYM12AE
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
-20 Cel
MCIMX6Q5EYM12AE
MCIMX6Y2CVM05AA
MCIMX6Y2CVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates in industrial temperature range (-40 to 105°C) and supports CMOS technology. With a supply voltage range of 1.275V to 1.5V, it is suitable for various applications requiring high-performance microcontrollers.
MCIMX6Y2CVM08AA
MCIMX6Y2CVM08AA by NXP Semiconductors is an industrial-grade SoC with CMOS technology. It operates b/w -40 to 105 °C and has a max supply voltage of 1.5 V. With 289 terminals in a square package, it's ideal for applications requiring low-profile, fine-pitch grid arrays.
1.325 V
MCIMX6DP4AVT8AB
SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
FBGA
BGA624,25X25,32
GRID ARRAY, FINE PITCH
2.16 mm
MCIMX6DP6AVT8AB
MCIMX7D2DVK12SD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B488
12 mm
488
TFBGA
BGA488,28X28,16
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
1.25 V
1.2 V
.4 mm
MCIMX7D2DVM12SD
MCIMX7D2DVM12SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.2-1.25 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.
S-PBGA-B541
19 mm
541
BGA541,25X25,29
1.42 mm
.75 mm
MCIMX7D3DVK10SD
MCIMX7D3DVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating at 0-95°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring thin profile, fine pitch grid arrays in plastic/epoxy packages.
MCIMX7D3EVK10SD
MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
MCIMX7D5EVM10SD
MCIMX7D5EVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C and has a supply voltage range of 1.2V to 1.25V. With 541 terminals in a GRID ARRAY package, it's ideal for applications requiring low profile and fine pitch components.
MCIMX7D7DVK10SD
MCIMX7D7DVM10SD
MCIMX7D7DVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating at 0-95°C. It features a low profile GRID ARRAY package style, 0.75mm terminal pitch, and 1.2-1.25V supply voltage range. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6S7CVM08AD
MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.
MCIMX6U7CVM08AD
MCIMX6U7CVM08AD by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105°C. It features a low profile grid array package style and CMOS technology, suitable for industrial applications requiring high performance and reliability.
MCIMX6Y2CVK08AB
MCIMX6Y2CVK08AB by NXP Semiconductors is a 272-terminal SoC with CMOS technology, operating b/w -40 to 105 °C. It has a low profile, fine pitch grid array package and supports surface mount installation. Ideal for applications requiring uPs/uCs & Peripheral ICs in compact designs.
MCIMX6Q6AVT08AE
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
LS1043AXN7PQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
ALSO OPERATES AT 1V SUPPLY NOM
S-PBGA-B621
621
250
2.07 mm
.93 V
.87 V
.9 V
30
LS1023AXE8PQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
S-PBGA-B780
23 mm
780
1.03 V
.97 V
1 V
LS1043AXE8PQB
LS1023AXE7PQB
LS1043AXN8PQB
LS1023AXN8PQB
LS1023AXN7PQB
LS1043AXE7PQB
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