Loading...

NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 328

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LS1043ASN7MNLB by NXP Semiconductors

LS1043ASN7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8KNLB by NXP Semiconductors

LS1043ASN8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8KNLB by NXP Semiconductors

LS1043ASE8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8MNLB by NXP Semiconductors

LS1043ASE8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASN7KNLB by NXP Semiconductors

LS1043ASN7KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8MNLB by NXP Semiconductors

LS1043ASN8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MIMXRT1064CVL5B by NXP Semiconductors

MIMXRT1064CVL5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1064CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating from -40 to 105 °C, it supports a supply voltage range of 1.15-1.26 V for industrial applications requiring high performance and reliability.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

10 mm

SoC

LS1043ABE9MQB by NXP Semiconductors

LS1043ABE9MQB

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ACE9MQB by NXP Semiconductors

LS1043ACE9MQB

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MIMX8MQ6DVAJZIB by NXP Semiconductors

MIMX8MQ6DVAJZIB

NXP Semiconductors

SoC; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER;

e2

3

260

TIN SILVER

40

SoC

MIMXRT1175CVM8A by NXP Semiconductors

MIMXRT1175CVM8A

NXP Semiconductors

The NXP MIMXRT1175CVM8A is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.1-1.15 V. Its grid array package has 289 terminals and measures 14x14 mm, making it suitable for various embedded applications.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.15 V

1.1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MIMXRT1171CVM8A by NXP Semiconductors

MIMXRT1171CVM8A

NXP Semiconductors

The NXP Semiconductors MIMXRT1171CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.15 V

1.1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MIMXRT1172CVM8A by NXP Semiconductors

MIMXRT1172CVM8A

NXP Semiconductors

NXP Semiconductors' MIMXRT1172CVM8A is a low-profile, fine-pitch SoC with 289 terminals. Operating b/w -40 to 105°C, it supports a supply voltage range of 1.1-1.15V. Ideal for applications requiring high-performance uPs/uCs in compact form factors.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.15 V

1.1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MIMXRT1173CVM8A by NXP Semiconductors

MIMXRT1173CVM8A

NXP Semiconductors

NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.15 V

1.1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2CVM05ABR by NXP Semiconductors

MCIMX6Y2CVM05ABR

NXP Semiconductors

MCIMX6Y2CVM05ABR by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating at -40 to 105°C, it supports a voltage range of 1.275-1.5V and features tin silver copper terminal finish. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B289

e1

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX536AVP8C2 by NXP Semiconductors

MCIMX536AVP8C2

NXP Semiconductors

MCIMX536AVP8C2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.05V to 1.15V. Ideal for automotive applications due to AEC-Q100 screening level and fine pitch grid array package style.

S-PBGA-B529

e2

19 mm

3

529

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

AEC-Q100

1.85 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX534AVP8C2 by NXP Semiconductors

MCIMX534AVP8C2

NXP Semiconductors

MCIMX534AVP8C2 by NXP Semiconductors is a 529-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.05V to 1.15V, it features a fine pitch grid array package style for surface mount assembly.

S-PBGA-B529

19 mm

529

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100

1.85 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

19 mm

SoC

MCIMX6U6AVM08ADR by NXP Semiconductors

MCIMX6U6AVM08ADR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

LS1023ASN7KQB by NXP Semiconductors

LS1023ASN7KQB

NXP Semiconductors

LS1023ASN7KQB by NXP Semiconductors is a multifunction peripheral IC with CMOS technology. It operates b/w 0-105°C, with supply voltage range of 0.87-0.93V. This square package has 621 terminals in a grid array style, suitable for various uPs and uCs applications.

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

MIMX8MN5DVPIZCA by NXP Semiconductors

MIMX8MN5DVPIZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B306

11 mm

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

SoC

MIMX8MN3DVPIZAA by NXP Semiconductors

MIMX8MN3DVPIZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN3DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and compact design in various electronic devices.

S-PBGA-B306

11 mm

3

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

11 mm

SoC

MIMX8MN1DVPIZAA by NXP Semiconductors

MIMX8MN1DVPIZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN1DVPIZAA is a SoC with 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and low power consumption in compact electronic devices.

S-PBGA-B306

11 mm

3

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

11 mm

SoC

MIMX8MN5DVPIZDA by NXP Semiconductors

MIMX8MN5DVPIZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B306

11 mm

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

SoC

LS1023AXN7KQB by NXP Semiconductors

LS1023AXN7KQB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

MIMXRT105SCVL5B by NXP Semiconductors

MIMXRT105SCVL5B

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE; Width: 10 mm;

S-PBGA-B196

10 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

BALL

.65 mm

BOTTOM

10 mm

SYSTEM ON CHIP

PN7150B0HN/C11006E by NXP Semiconductors

PN7150B0HN/C11006E

NXP Semiconductors

PN7150B0HN/C11006E by NXP Semiconductors is a NFC controller with a supply voltage range of 1.65V to 1.95V and operating temperature range of -30°C to 85°C. It comes in a square package with 40 terminals and is suitable for applications requiring contactless communication.

S-XQCC-N40

6 mm

3

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

NO LEAD

.5 mm

QUAD

6 mm

NFC CONTROLLER

MIMXRT1051CVJ5BR by NXP Semiconductors

MIMXRT1051CVJ5BR

NXP Semiconductors

The NXP Semiconductors MIMXRT1051CVJ5BR is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring a low profile, fine pitch package style and grid array configuration.

S-PBGA-B196

12 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

SYSTEM ON CHIP

MCIMX6S5DVM10ADR by NXP Semiconductors

MCIMX6S5DVM10ADR

NXP Semiconductors

MCIMX6S5DVM10ADR by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 1.35-1.5V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6U5DVM10ADR by NXP Semiconductors

MCIMX6U5DVM10ADR

NXP Semiconductors

MCIMX6U5DVM10ADR by NXP Semiconductors is a SoC with 624 terminals, operating at 0-95°C. It has a supply voltage range of 1.35-1.5V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch grid array packages in surface mount configurations.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

LS1023AXE7QQB by NXP Semiconductors

LS1023AXE7QQB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Width: 21 mm;

S-PBGA-B621

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

21 mm

SoC

MIMX8DL1AVNFZBA by NXP Semiconductors

MIMX8DL1AVNFZBA

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 388; Package Shape: SQUARE; Terminal Position: BOTTOM; Peak Reflow Temperature (C): 260;

S-PBGA-B388

15 mm

3

388

PLASTIC/EPOXY

SQUARE

260

1.7 mm

YES

CMOS

BALL

BOTTOM

40

15 mm

SoC

SE051A2HQ1/Z01XEZ by NXP Semiconductors

SE051A2HQ1/Z01XEZ

NXP Semiconductors

SE051A2HQ1/Z01XEZ by NXP Semiconductors is a 20-terminal chip carrier with cryptographic authenticator. It operates b/w -40°C to 105°C, with supply voltage range of 1.62V to 3.6V. Ideal for applications requiring secure authentication in compact spaces.

S-XQCC-N20

3 mm

1

20

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC20,.12SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.33 mm

3.6 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

3 mm

CRYPTOGRAPHIC AUTHENTICATOR

SE051P2HQ1/Z011AZ by NXP Semiconductors

SE051P2HQ1/Z011AZ

NXP Semiconductors

SE051P2HQ1/Z011AZ by NXP Semiconductors is a cryptographic authenticator IC with 20 terminals, operating voltage range of 1.62V to 3.6V, and max temp of 105°C. Ideal for secure applications requiring high-level encryption in compact designs due to its CMOS technology and small square chip carrier package style.

S-XQCC-N20

3 mm

1

20

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC20,.12SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.33 mm

3.6 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

3 mm

CRYPTOGRAPHIC AUTHENTICATOR

SE051W2HQ1/Z019TZ by NXP Semiconductors

SE051W2HQ1/Z019TZ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

S-XQCC-N20

3 mm

1

20

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC20,.12SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.33 mm

3.6 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

3 mm

CRYPTOGRAPHIC AUTHENTICATOR

LS1023AXE7MQB by NXP Semiconductors

LS1023AXE7MQB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 105 Cel;

S-PBGA-B621

e1

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

SQUARE

250

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

SoC

LS1043AXE7MQB by NXP Semiconductors

LS1043AXE7MQB

NXP Semiconductors

LS1043AXE7MQB by NXP Semiconductors is a SoC with 621 terminals, CMOS technology, and operates b/w -40 to 105°C. It features a square package shape, PLASTIC/EPOXY body material, and TIN SILVER COPPER terminal finish. Ideal for applications requiring high-performance processing in compact designs.

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

SQUARE

250

1.92 mm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SoC

MCIMX6S5EVM10ADR by NXP Semiconductors

MCIMX6S5EVM10ADR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

P1025NXE5DFB by NXP Semiconductors

P1025NXE5DFB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B561

23 mm

3

561

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA561,27X27,32

SQUARE

GRID ARRAY, FINE PITCH

2.3 mm

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SoC

P1025NSE5DFB by NXP Semiconductors

P1025NSE5DFB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B561

23 mm

3

561

125 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA561,27X27,32

SQUARE

GRID ARRAY, FINE PITCH

2.3 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SoC

P1015NSN5DFB by NXP Semiconductors

P1015NSN5DFB

NXP Semiconductors

The NXP Semiconductors P1015NSN5DFB is a 561-terminal SoC IC with CMOS technology. It operates b/w 0-125°C, with supply voltage range of 0.95-1.05 V. This fine-pitch grid array IC is suitable for applications requiring high performance in compact spaces.

S-PBGA-B561

23 mm

3

561

125 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA561,27X27,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.79 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

23 mm

SoC