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TEA1792T/N1,118

NXP Semiconductors

TEA1792T/N1,118 by NXP Semiconductors

TEA1792T/N1,118 by NXP Semiconductors is a compact surface-mount IC designed for power supply applications. It operates at a nominal voltage of 20V and features an 8-terminal gull-wing design with a peak reflow temp of 260 °C. Ideal for efficient energy management in various electronic devices.

Median Price

$0.719

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 146,984 parts In-Stock

1+ parts

-

100+ parts

$0.746

1k+ parts

$0.619

10k+ parts

$0.552

146,984

-

$0.746

$0.619

$0.552

Verical

USA . 5,000 parts In-Stock

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$0.692

5,000

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$0.692

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 146,984 parts In-Stock

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146,984

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Vyrian

USA . 7,697 parts In-Stock

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7,697

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Digiode

USA . 728 parts In-Stock

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728

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Anansix

USA . 170 parts In-Stock

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170

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Distributors (Availability)

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Microchip USA

USA . 4,958 parts In-Stock

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$3.432

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$3.432

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Component Stockers USA

USA . 15,282 parts In-Stock

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$8.710

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15,282

$8.710

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AZTECH Wire

Italy . 532 parts In-Stock

1+ parts

$14.940

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532

$14.940

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One Stop Electronics

USA . 1,021 parts In-Stock

1+ parts

$15.000

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1,021

$15.000

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Ampacity Inc.

Singapore . 804 parts In-Stock

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$32.000

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804

$32.000

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Corohmni

South Africa . 317 parts In-Stock

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$40.102

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317

$40.102

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QUARKTWIN TECHNOLOGY LTD

USA . 21,514 parts In-Stock

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21,514

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A-Z Elektronik GmbH

Germany . 6,603 parts In-Stock

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6,603

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Corphita

USA . 3,618 parts In-Stock

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3,618

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UNI Independent Distributors

Spain . 2,718 parts In-Stock

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Overview

Unlock the potential of your projects with the TEA1792T/N1,118 from NXP Semiconductors, a leader in innovation and quality. This advanced power supply IC is designed to enhance efficiency and reliability in various applications, from consumer electronics to industrial systems. With its compact design and robust performance, it ensures seamless integration while delivering outstanding value. Experience the benefits of superior engineering and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

With surface mount technology, this product allows for compact designs and efficient use of PCB space, enabling advanced miniaturization in electronic devices.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient spacing and arrangement on the PCB, optimizing layout and improving circuit performance.

Power Supplies (V): 20

A maximum power supply of 20V ensures compatibility with a wide range of electronic applications, providing flexibility in design.

No. of Terminals: 8

Having 8 terminals allows for various configurations and connections, enhancing the versatility of the product in different electronic circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for space-constrained applications, making it ideal for modern, compact electronic devices.

Terminal Position: DUAL

Dual terminal positioning allows for easier soldering and connection on the PCB, which simplifies assembly processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature of 260 °C allows the device to withstand modern soldering processes, ensuring reliable assembly without damage.

Terminal Form: GULL WING

Gull wing terminals provide excellent surface mount soldering capabilities, leading to improved electrical performance and reliability.

Nominal Supply Voltage: 20 V

A nominal supply voltage of 20V indicates stable power operation, suitable for high-performance applications requiring consistent voltage.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables precise connections and makes it compatible with a variety of PCB layouts, enhancing design flexibility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TEA1792T/N1,118 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

20

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA1792T/N1,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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