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TEA1792TS/1,115

NXP Semiconductors

TEA1792TS/1,115 by NXP Semiconductors

TEA1792TS/1,115 by NXP Semiconductors is a 6-terminal IC with a nominal voltage of 20V. It features a small outline, thin profile package style and gull wing terminal form for surface mount applications. Ideal for power supplies, this rectangular-shaped IC operates at peak reflow temperature of 260°C.

Median Price

$0.344

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

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$0.344

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70

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Vyrian

USA . 8,710 parts In-Stock

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Anansix

USA . 673 parts In-Stock

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673

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Digiode

USA . 408 parts In-Stock

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408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 429 parts In-Stock

1+ parts

$0.344

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429

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Netroflash

USA . 1,000 parts In-Stock

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$0.344

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$0.327

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$0.320

1,000

$0.344

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$0.327

$0.320

Microchip USA

USA . 318 parts In-Stock

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$3.377

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318

$3.377

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AZTECH Wire

Italy . 745 parts In-Stock

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$6.100

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745

$6.100

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One Stop Electronics

USA . 1,577 parts In-Stock

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$15.000

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Ampacity Inc.

Singapore . 1,204 parts In-Stock

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$24.000

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UNI Independent Distributors

Spain . 4,371 parts In-Stock

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Corphita

USA . 3,432 parts In-Stock

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Perfect Parts

USA . 54 parts In-Stock

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Overview

Discover the innovative TEA1792TS/1,115 by NXP Semiconductors, a versatile solution in the realm of Other Function uPs,uCs & Peripheral ICs. With a focus on quality and reliability, NXP Semiconductors delivers cutting-edge technology that exceeds industry standards. Ideal for a range of applications, this product offers unparalleled value and performance. Experience the benefits of seamless integration, enhanced functionality, and unmatched efficiency with the TEA1792TS/1,115. Elevate your designs and unlock new possibilities with this exceptional semiconductor component.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount : YES

Surface mount technology allows for easy installation and saves space on circuit boards.

Package Shape : RECTANGULAR

Rectangular shape helps in efficient arrangement and organization of components on a circuit board.

Power Supplies (V) : 20

With a power supply of 20V, this product can handle high voltage requirements efficiently.

No. of Terminals : 6

Having multiple terminals allows for versatile connections and flexibility in circuit design.

Package Style (Meter) : SMALL OUTLINE, THIN PROFILE

The small outline and thin profile make this product suitable for compact electronic devices.

Terminal Position : DUAL

Dual terminal position offers redundancy and reliability in signal transmission.

Peak Reflow Temperature °C : 260

With a high peak reflow temperature, this product can withstand soldering processes without damage.

Terminal Form : GULL WING

The gull wing terminal form provides a strong mechanical connection and ease of soldering.

Nominal Supply Voltage : 20 V

The nominal supply voltage of 20V is ideal for a wide range of applications requiring medium to high power.

Terminal Pitch : 0.95 mm

The small terminal pitch of 0.95mm allows for close arrangement of terminals, saving space on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TEA1792TS/1,115 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

20

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

TEA1792TS/1,115 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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