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TEA1795T/N1,118

NXP Semiconductors

TEA1795T/N1,118 by NXP Semiconductors

TEA1795T/N1,118 by NXP Semiconductors is a versatile IC designed for power supply applications. It features an 8-terminal gull-wing package, operates at a nominal voltage of 20V, and withstands peak reflow temps up to 260 °C. Ideal for compact electronic designs requiring efficient power management.

Median Price

$1.980

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,460 parts In-Stock

1+ parts

$1.980

100+ parts

$1.170

1k+ parts

$1.040

10k+ parts

-

2,460

$1.980

$1.170

$1.040

-

Newark

USA . 9,227 parts In-Stock

1+ parts

$2.240

100+ parts

$1.500

1k+ parts

$1.360

10k+ parts

-

9,227

$2.240

$1.500

$1.360

-

DigiKey

USA . 2,309 parts In-Stock

1+ parts

$2.340

100+ parts

$1.411

1k+ parts

$1.267

10k+ parts

$1.165

2,309

$2.340

$1.411

$1.267

$1.165

Mouser Electronics

USA . 8,289 parts In-Stock

1+ parts

$3.370

100+ parts

$1.790

1k+ parts

$1.580

10k+ parts

$1.280

8,289

$3.370

$1.790

$1.580

$1.280

Rochester

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

$1.170

1k+ parts

$0.971

10k+ parts

$0.866

30,000

-

$1.170

$0.971

$0.866

Element14

Singapore . 9,232 parts In-Stock

1+ parts

-

100+ parts

$1.650

1k+ parts

$1.440

10k+ parts

$1.420

9,232

-

$1.650

$1.440

$1.420

Flip Electronics (Authorized)

USA . 7,500 parts In-Stock

1+ parts

-

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-

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-

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7,500

-

-

-

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Verical

USA . 4,947 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$1.064

4,947

-

-

-

$1.064

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,224 parts In-Stock

1+ parts

$0.910

100+ parts

-

1k+ parts

-

10k+ parts

-

2,224

$0.910

-

-

-

Vyrian

USA . 3,361 parts In-Stock

1+ parts

$0.958

100+ parts

-

1k+ parts

-

10k+ parts

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3,361

$0.958

-

-

-

IBS Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.085

10,000

-

-

-

$1.085

Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

-

-

-

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NAC Semi

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.250

5,000

-

-

-

$1.250

Anansix

USA . 1,322 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,322

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,506 parts In-Stock

1+ parts

$0.862

100+ parts

-

1k+ parts

-

10k+ parts

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2,506

$0.862

-

-

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Corohmni

South Africa . 2,898 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,898

$1.380

-

-

-

Component Stockers USA

USA . 28,073 parts In-Stock

1+ parts

$2.000

100+ parts

$1.130

1k+ parts

$0.990

10k+ parts

$0.870

28,073

$2.000

$1.130

$0.990

$0.870

QUARKTWIN TECHNOLOGY LTD

USA . 22,765 parts In-Stock

1+ parts

-

100+ parts

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22,765

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-

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Infinite Electronics LLP (Excess)

. 20,005 parts In-Stock

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20,005

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Perfect Parts

USA . 16,448 parts In-Stock

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16,448

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Futuretech Components

Singapore . 10,000 parts In-Stock

1+ parts

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10,000

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Continental Prestige Electronics

USA . 9,892 parts In-Stock

1+ parts

-

100+ parts

$1.040

1k+ parts

$0.751

10k+ parts

-

9,892

-

$1.040

$0.751

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Microchip USA

USA . 5,677 parts In-Stock

1+ parts

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100+ parts

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5,677

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A-Z Elektronik GmbH

Germany . 5,253 parts In-Stock

1+ parts

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5,253

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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iodParts Technologies Inc.

India . 2,022 parts In-Stock

1+ parts

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100+ parts

$2.027

1k+ parts

$1.737

10k+ parts

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2,022

-

$2.027

$1.737

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S.R.D Solutions

India . 1,500 parts In-Stock

1+ parts

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100+ parts

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1,500

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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-

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UNI Independent Distributors

Spain . 63 parts In-Stock

1+ parts

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63

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Overview

Elevate your designs with the TEA1795T/N1,118 from NXP Semiconductors—a trusted leader in innovative technology. This versatile IC offers exceptional reliability and performance, making it perfect for a wide range of applications, from power supplies to automotive systems. With its robust construction and superior materials, you can count on durability and efficiency. Choose TEA1795T/N1,118 for unparalleled quality that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and lightweight properties, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for reduced PCB space and improved performance due to shorter lead lengths, making this product ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and facilitates easier integration into various layouts.

Power Supplies (V): 20

Operating at 20V makes this component versatile for many electronic applications requiring moderate voltage.

No. of Terminals: 8

With 8 terminals, it offers sufficient connections for different I/O functions, enabling complex interfacing capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications and provides high assembly density.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options and promotes easier PCB layout design.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds is optimal for thermal management during assembly, ensuring component integrity.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260 °C accommodates lead-free soldering processes, supporting modern environmental standards.

Terminal Form: GULL WING

Gull wing terminals provide a reliable solder joint and are easier to inspect post-assembly, reducing potential quality issues.

Nominal Supply Voltage: 20 V

A nominal supply voltage of 20V allows for compatibility with a range of power sources and application environments.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch facilitates tighter packing on PCBs while ensuring reliable connectivity, making it a favorable choice for modern electronics.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TEA1795T/N1,118 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

20

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TEA1795T/N1,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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